TW201016885A - Coating chamber with a moveable shield - Google Patents

Coating chamber with a moveable shield Download PDF

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Publication number
TW201016885A
TW201016885A TW098128421A TW98128421A TW201016885A TW 201016885 A TW201016885 A TW 201016885A TW 098128421 A TW098128421 A TW 098128421A TW 98128421 A TW98128421 A TW 98128421A TW 201016885 A TW201016885 A TW 201016885A
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TW
Taiwan
Prior art keywords
coating
substrate
mask
coating chamber
chamber
Prior art date
Application number
TW098128421A
Other languages
Chinese (zh)
Other versions
TWI491762B (en
Inventor
Hans Wolf
Ralph Lingenberg
Original Assignee
Applied Materials Inc
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Publication date
Priority claimed from US12/197,605 external-priority patent/US20100044213A1/en
Priority claimed from EP08162906.5A external-priority patent/EP2159302B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201016885A publication Critical patent/TW201016885A/en
Application granted granted Critical
Publication of TWI491762B publication Critical patent/TWI491762B/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13069—Thin film transistor [TFT]

Abstract

The present invention refers to a method of operating a coating chamber as well as a coating chamber comprising a coating source, a transport device for moving a substrate carrier adapted to be able to carry a substrate to be coated into at least one coating position with respect to the coating source, so that the substrate may be coated, and at least one first shield being arranged in an area between the coating position of the substrate and the coating source to prevent coating of areas other than the surface of the substrate to be coated, wherein the first shield comprises a moving apparatus and a coupling device for coupling the first shield and the substrate carrier, so that first shield and substrate carrier are movable together.

Description

201016885 六、發明說明： 【發明所屬之技術領域】 本發明與一種塗佈腔室以及一種用於運作一塗佈腔室 的方法有關’且特別是一真空塗佈腔室，在其中實行例 如化學氣相沉積（CVD )製程、電漿辅助化學氣相沉積 (PECVD)製程、物理氣相沉積（PVD)製程或濺鍍製 程等薄膜沉積技術。 【先前技術】 塗佈技術係廣泛用於業界中以生產不同產品。舉例而 言，作為建構使用或與顯示器有關之玻璃基板，例如薄 膜電晶體（TFT)顯示器、有機發光二極體（〇led)顯 示器等’都需要塗佈薄膜。 對於所有這些產品而言，需要實現均質且均勻之塗 層。此外，塗佈製程也需要高效率以保持低成本並得到 具競爭性的結果。因此，在習知技術中已提出多種方法 與設備’期能以合理的價格獲得高品質塗層。 各種實施塗層沉稂的方法可分為三種不同類型：第_ 種類型是基板的靜止式塗佈，根據此類型，在整個塗佈 製程中，待塗佈基板係保持於單一塗佈位置；因此塗 層來源所定義之塗佈區域必須覆蓋待塗佈之整體表面。 雖然此一方法相當簡單且因而具有成本效益也適用於 種應用，但此方法的缺點在於在整體表面上所沉積之 201016885 塗層並不均質與均勻；由於空間條件之故，基板表面的 不同區域有塗佈差異，特別是在表面的邊緣處會發生問 題。 第二種類型之塗佈係設計為連續塗佈方式，且其特徵 在於待塗佈基板係連續移動通過塗佈區域，該區域係由 塗層來源以可移動之基板載具所定義；藉此可均質地塗 佈大面積之基板（例如建構玻璃），由於基板的連續移 動，待塗佈之表面的每一點都會通過塗佈區域的不同區 ® 域，因此至少沿著傳輸方向上’可於整個基板表面上達 成相同的塗佈條件。然而，此方法較為費力，因為必須 提供一傳輸裝置以使基板連續移動。為了保護昂貴的設 備（如傳輸裝置與基板載具）以免於被塗佈，必須提供 遮罩。根據習知技術，必須提供配置在基板載具處以保 護基板載具之遮罩以及固定配置在塗佈腔室中以保護傳 輸機制之遮罩。第三種類型之沉積製程也有相同的情 ❹ i，其中在塗佈製程期間，基板係移動至不同的塗佈位 置或震盪；然而，由於需要額外的遮罩，這種塗佈方法 之設備係更昂貴《此外，相應設備的運作也會導致基板 載具及其遮罩的潔淨相關問題，在每一次運行通過不同 塗佈站台之後都必須實施。 【發明内容】 本發明之目的 201016885 因此本發明的目的之一 種運作一塗佈腔室 '、種塗佈腔室以及一 伟者’其可在相同時間、且花 =盪塗 沉積(特別是關於沉積塗層的均質性與二生二品質塗層 塗佈腔室在設計與製造上應簡單，而在使用：廄此外， :藉由"度的使用變化性，運作也會變得簡單。 技術解決方案 早 ❹201016885 VI. Description of the Invention: [Technical Field] The present invention relates to a coating chamber and a method for operating a coating chamber, and in particular a vacuum coating chamber in which, for example, chemistry is carried out Thin film deposition techniques such as vapor deposition (CVD) processes, plasma assisted chemical vapor deposition (PECVD) processes, physical vapor deposition (PVD) processes, or sputtering processes. [Prior Art] Coating technology is widely used in the industry to produce different products. For example, a glass substrate that is used for construction or related to a display, such as a thin film transistor (TFT) display, an organic light emitting diode display, etc., requires a coating film. For all of these products, a homogeneous and uniform coating is required. In addition, coating processes require high efficiency to maintain low cost and achieve competitive results. Therefore, various methods and apparatus have been proposed in the prior art to obtain high quality coatings at reasonable prices. Various methods for performing coating deposition can be classified into three different types: the first type is a static coating of a substrate, according to which the substrate to be coated is maintained at a single coating position throughout the coating process; Therefore, the coating area defined by the source of the coating must cover the entire surface to be coated. Although this method is relatively simple and therefore cost effective and suitable for a variety of applications, the disadvantage of this method is that the 201016885 coating deposited on the overall surface is not homogeneous and uniform; different regions of the substrate surface due to space conditions There are coating differences, especially at the edges of the surface. The second type of coating system is designed as a continuous coating method, and is characterized in that the substrate to be coated is continuously moved through the coating region, which is defined by the source of the coating as a movable substrate carrier; A large-area substrate (for example, a structured glass) can be uniformly coated. Due to the continuous movement of the substrate, each point of the surface to be coated passes through different regions of the coated region, so at least along the transport direction The same coating conditions were achieved on the entire substrate surface. However, this method is laborious because a transport device must be provided to continuously move the substrate. In order to protect expensive equipment (such as conveyors and substrate carriers) from being coated, a mask must be provided. According to the prior art, it is necessary to provide a mask disposed at the substrate carrier to protect the substrate carrier and a mask fixedly disposed in the coating chamber to protect the transmission mechanism. The third type of deposition process also has the same situation i, in which the substrate is moved to a different coating position or oscillated during the coating process; however, due to the need for additional masking, the coating system is More expensive "In addition, the operation of the corresponding equipment can also lead to the cleaning-related problems of the substrate carrier and its mask, which must be implemented after each operation through different coating stations. SUMMARY OF THE INVENTION The object of the present invention is 201016885. Therefore, one of the objects of the present invention is to operate a coating chamber, a coating chamber, and a great one, which can be deposited at the same time and with a flower coating (especially The homogeneity of the deposited coating and the coating coating chamber of the second-quality coating should be simple in design and manufacture, and in use: 廄 In addition, the operation becomes simpler by the variability of the degree of use. Technical solutions

這些目的係藉由具有申請專㈣圍第ι項之特徵的塗 佈腔至以極具有申請專利範園第29項之特徵的運作一 塗佈腔室之方法而達成。其他的實施例為申請專利範圍 附屬項的標的内容。 本發明之解決方案的特徵在於，塗佈腔室具有一塗層 來源以及用於移動一基板載具通過該塗佈職的一傳輸 裝置；提供至少一可移遮罩’其包括一移動設備以及用 於賴合該遮罩與該基板載具之一耦合裝置，使得該遮罩 與該基板載具一起移動。該移動設備係定義為與該可移 遮罩相關之一特定組件，其使遮罩得以移動，特初是其 係獨立於基板或基板載具。因此，移動設備係包括與基 板載具之傳輸裝置不同或獨立的至少一組件。由於這種 設計’即可省去配置在基板載具處之遮罩，其大幅降低 了花費’這是因為不只可節省一個遮罩，同時也節省了 在對應的塗佈設備中所使用的複數個基板载具之複數個 遮罩。 此外，由於所有不同類型或模式的運作皆可由此一塗 201016885These objects are achieved by a coating chamber having the characteristics of the application (4) of the first item, and a method of operating a coating chamber having the characteristics of the patent application No. 29. Other embodiments are the subject matter of the patent application scope. The solution of the present invention is characterized in that the coating chamber has a source of coating and a transport device for moving a substrate carrier through the coating station; providing at least one removable mask that includes a mobile device and A coupling device for tying the mask to the substrate carrier such that the mask moves with the substrate carrier. The mobile device is defined as a particular component associated with the removable mask that allows the mask to be moved, primarily independent of the substrate or substrate carrier. Accordingly, the mobile device includes at least one component that is different or separate from the transmission device of the substrate carrier. Because of this design, the mask disposed at the substrate carrier can be omitted, which greatly reduces the cost. This is because not only can one mask be saved, but also the plural used in the corresponding coating device. a plurality of masks of the substrate carriers. In addition, since all the different types or modes of operation can be painted this way 201016885

佈腔室執行，田/JU 而塗佈腔室的使用變化性亦可提升。當 該遮罩保持靜止， P了進行靜止式塗佈。在半靜止式塗 佈的情況中（亦gp，a i 特別疋在震盪塗佈的情況中），其中 基板係於㈣來源前方震盪；且在連續塗佈的情況中， 遮罩可與傳載待塗佈基板之基板載具—起移動。藉由輛 裝置可移遮罩係附接至基板载具，如同遮罩（mask) 然而在此塗佈腔室中，於塗佈製程中可移遮罩 僅轉合至基板載且，gg ^ 、ώThe cloth chamber is executed, and the field/JU and the use of the coating chamber can be improved. When the mask remains stationary, P is applied statically. In the case of semi-stationary coating (also gp, ai especially in the case of oscillating coating), where the substrate is oscillated in front of the source of (iv); and in the case of continuous coating, the mask can be carried and The substrate carrier of the coated substrate moves up. The removable mask is attached to the substrate carrier by a device, like a mask. However, in the coating chamber, the movable mask is only transferred to the substrate during the coating process, and gg ^ ώ

八 因此’遮罩的移動即可限制在靠近 塗佈區域的區域，並μ 八中塗佈區域係定義為沉積率高於一 預定值之區域〇特別县，、疮 付別疋’遮罩的移動設備係經設計，使 得遮罩係僅於腔室內銘叙，相4*丄A 至門移動’但不會藉由移動設備而移動 進出腔室。 本發明之塗佈腔室係用於不同的沉積技術，且可特別 設計為真空腔室以實施真空沉積技術，例如化學氣相沉 積CVD、電聚輔助化學氣相沉積pEcvD、物理氣相沉積 PVD «及特別疋濺鍍製程；然而，也可使用其他沉積 技術（例如藉由熱蒸鍍之氣相沉積）。因此，塗佈腔室係 包含一塗層來源，其係經設計供這些沉積技術之用；特 別疋，塗層來源包含處理工具，包括電極磁電極淋 灑頭電極、旋轉電極、雙電極、微波源、加熱器、濺鍍 靶材、氣體入口與蒸發源、以及其組合。一般而言，沉 積一膜層或執行塗佈製程所需之所有處理工具係包括 於、或附接於塗佈腔室。塗層來源包含如濺鍍磁電極之 單一處理工具（即所謂線性源）、或包含數種處理工具以 201016885 形成延長於塗佈腔室的特定區域之上之塗層來源，這種 二維之塗層來源例如包含了彼此相鄰並肩配置之電極陣 列’因此可達成較大的塗佈區域。特別是，電極在縱向 轴上彼此平行配置並橫切基板傳輸方向；故，具有小於 二維塗層來源之維度的基板係可以靜止式塗佈製程加以 塗佈’而待塗佈表面在傳輸方向上大於二維塗層來源之 延長部分的基板則以半靜止式或連續式塗佈製程加以塗 佈。 ’. . ❹ 較佳為，塗層來源在長度方向上的延長部分係經選 擇，使得在此維度上，待塗佈之基板的維度小於塗層來 源；因此，可確保在此方向上待由塗層來源塗佈之表面 的整體覆盖。因此，半靜止式或連績式塗佈之傳輸方向 應選擇於橫切長度方向的方向，以藉由基板之適當移動 來覆蓋待塗佈基板之所有其他區域。 傳輸裝置係包含一驅動器及/或一引導裝置，藉由驅動 礬 器，基板載具係經驅動以執行半靜止式或連續式塗佈之 基板移動。為了增進移動，引導裝置係於移動期間引導 及支撐基板載具。 本發明適用於基板的水平式與垂直式傳輸，特定實施 例係特別設計以垂直傳輸板狀基板，例如玻璃基板等。 傳輸裝置的引導裝置係包含一支撐部，其定義了與基 板栽具接合之一傳輸路徑與一相對導軌。支撐部係由支 撐滾輪形成，基板載具係於其上移動。某些支撐滾輪係 同時形成為驅動滾輪，以驅動基板載具。引導褒置係包 201016885 含一非接觸式？丨導件，特别 力之故，基板載具係引導於 相距一距離。 疋一磁性引導件，其中因磁 一導軌中，其與導軌的壁部 根據另一實施例’傳輸裝置包含數個引導裝置 義數個傳輸路捏；因此，數 、 数個基板載具係同時於傳輸裝 置中移動。藉由此方式，可有利地增加處理量。 數個傳輸路徑係彼此平行配置，藉由傳輸路徑的平行 配置，可增進待移動於傳輸路徑上之基板載具與塗佈腔 室其他組件之間的互動。VIII Therefore, the movement of the mask can be restricted to the area close to the coating area, and the coating area is defined as the area where the deposition rate is higher than a predetermined value, the special county, and the sore The mobile device is designed such that the mask is only inscribed in the chamber, and the phase 4*丄A moves to the door' but does not move into and out of the chamber by the mobile device. The coating chamber of the present invention is used in different deposition techniques, and can be specifically designed as a vacuum chamber to implement vacuum deposition techniques such as chemical vapor deposition CVD, electropolymerization assisted chemical vapor deposition pEcvD, physical vapor deposition PVD. «And special 疋 sputtering process; however, other deposition techniques (such as vapor deposition by thermal evaporation) can also be used. Thus, the coating chamber comprises a source of coating designed for use in these deposition techniques; in particular, the coating source comprises processing tools, including electrode magnetic electrode shower head electrodes, rotating electrodes, dual electrodes, microwaves Source, heater, sputtering target, gas inlet and evaporation source, and combinations thereof. In general, all of the processing tools required to deposit a film or perform a coating process are included in, or attached to, a coating chamber. The source of the coating comprises a single processing tool such as a sputtered magnetic electrode (so-called linear source), or a coating source comprising several processing tools to form a coating over a specific area of the coating chamber at 201016885, such a two-dimensional The source of the coating, for example, comprises an array of electrodes arranged adjacent to each other side-by-side so that a larger coating area can be achieved. In particular, the electrodes are arranged parallel to each other on the longitudinal axis and transverse to the substrate transport direction; therefore, the substrate having a dimension smaller than the source of the two-dimensional coating can be applied by a static coating process while the surface to be coated is in the transport direction. Substrates that are larger than the extension of the two-dimensional coating source are coated in a semi-stationary or continuous coating process. Preferably, the extension of the coating source in the length direction is selected such that the dimension of the substrate to be coated is smaller than the source of the coating in this dimension; therefore, it is ensured that The overall coverage of the coated surface of the coating source. Therefore, the transport direction of the semi-static or continuous coating should be selected in the direction transverse to the length direction to cover all other areas of the substrate to be coated by appropriate movement of the substrate. The transport device includes a driver and/or a guiding device that is driven to perform substrate movement for semi-stationary or continuous coating by driving the device. To enhance movement, the guiding device guides and supports the substrate carrier during movement. The present invention is applicable to horizontal and vertical transfer of substrates, and specific embodiments are specifically designed to vertically transport a plate-like substrate, such as a glass substrate or the like. The guiding device of the transport device includes a support portion defining a transport path and an opposing guide rail that engage the substrate carrier. The support portion is formed by a support roller on which the substrate carrier moves. Some of the support rollers are simultaneously formed as drive rollers to drive the substrate carrier. Guide the mounting system 201016885 with a non-contact? For the purpose of the 丨 guide, the substrate carrier is guided at a distance. a magnetic guide member, wherein the wall portion of the magnetic guide rail and the guide rail according to another embodiment of the transmission device includes a plurality of guiding means for a plurality of transmission paths; therefore, the number of the plurality of substrate carriers is simultaneously Move in the transmission device. In this way, the amount of processing can be advantageously increased. The plurality of transmission paths are arranged in parallel with each other, and the parallel arrangement of the transmission paths enhances the interaction between the substrate carrier to be moved on the transmission path and other components of the coating chamber.

可移遮罩之移動設備係以類似於傳輸裝置的方式加以 設計。故，移動設備係包含至少一個驅動器與至少一個 引導設備。 移動設備係適於移動塗佈區域周圍的環形遮罩、或移 動帶狀遮罩及/或數個遮罩。 移動設備的引導設備係包含一遮罩支撑部，.其定義了 一遮罩傳輸路徑與相對的遮罩導軌》 移動設備也包含滾輪’用於以類似於在傳輸裝置處支 撐及/或驅動基板載具之滾輪的方式來支撐及/或驅動遮 罩。因此，某些滾輪也是用於驅動遮罩之驅動滾輪。 傳輸裝置與移動設備具有單一共同驅動器或數個獨立 驅動器。單一共同驅動器具有優勢可輕易實現移動的同 步化。 用於耦合一可移遮罩與基板載具之耦合裝置包含不同 的搞合機構以柄合該可移遮罩與基板載具。可容許輕易 201016885 處理的一種連接方β 式疋由一外型相配連接所實現· 耦σ元件包括外型 ，故， Α τ ώ 相配70件，如接腳與對應的凹部等。 為了耦合遮罩蛊飞寻 與基板载具，外型相配元件俜彼^ 合。至少對於這此据番& ^^ 仟係彼此接 ^ # ^ ^ 二裝置與設備中的部分而言，茲可由傳 現。這種移動可為=Γ備相對於彼此之移動而實 的傳輸方向）。為了2 方向（亦即橫切基板載具 ”了增進傳輸裝置的移動及/或移動設Mobile devices with removable masks are designed in a manner similar to transmission devices. Therefore, the mobile device includes at least one drive and at least one boot device. The mobile device is adapted to move an annular mask around the coated area, or to move the strip mask and/or several masks. The guiding device of the mobile device comprises a mask support, which defines a mask transmission path and an opposite mask rail. The mobile device also includes a roller 'for supporting and/or driving the substrate similar to that at the transport device. The rollers of the carrier support and/or drive the mask. Therefore, some of the rollers are also the drive rollers for driving the mask. The transmission device has a single common drive or several independent drives with the mobile device. A single common drive has the advantage of easily synchronizing the movement. The coupling means for coupling a removable mask to the substrate carrier includes different engagement mechanisms for aligning the movable mask with the substrate carrier. A connection type β type that can be easily handled by 201016885 is realized by an external type matching connection. The coupling σ element includes an outer shape, so Α τ ώ matches 70 pieces, such as a pin and a corresponding recess. In order to couple the mask and the substrate carrier, the external matching components are combined. At least for this part of the & ^^ 仟 彼此 ^ ^ ^ ^ ^ 2 devices and parts of the device, can be reproduced. This movement can be the actual transmission direction of the equipment relative to each other. Enhance the movement and/or movement of the transport unit for 2 directions (ie, cross-cutting the substrate carrier)

m 相對於彼此之移動，導執係配置在相對於傳輸裝置及 移動設備的傳輸踉牺♦τη二Α〆 ^之不同尚度處；因此，在往復移動 期間’導軌不會碰揸。在此椹相φ樯私壯 復在此構想中，傳輸裝置的導軌或 移動設備的導軌係配置在離彼此對傳輸路徑的更大距離 處。 除了第一可移遮罩外，相對於塗層來源而固定之第二 可移遮罩係可配置以保護移動設備以及可移遮罩。 由於本發明之塗佈腔室的設計，塗佈腔室可以不同方 式使用，因而增加了使用的變化性。特別是，塗佈腔室 係可用於靜止式塗佈、連續式塗佈以及半靜止式塗佈。 由於遮罩的移動能力，在每一種運作模式中都可以沉積 出在均勻性與均質性上之高品質塗層。 【實施方式】 — 第1圖繪示了根據本發明第一實施例之塗佈腔室的部 分截面圖。第1圖中所示之實施例的塗佈腔室包含一腔 201016885 室壁體10’其僅部分可見。根據該截面圖，腔室壁體10 分為上腔室壁體部分10a與下腔室壁體部分i〇b ;壁體 部分10a與1 〇b定義了 一開口，其由一蓋體9予以關閉。 在蓋體9處係配置一塗層來源8，例如為一可旋轉磁性 陰極以供濺鍍沉積之用。由於可分離配置之蓋體9，可 輕易更換塗層來源8。 相對於塗層來源8，可經由一傳輸裝置5而裝設容納 於基板截具2内的基板 根據該截面圖，基板載具2係以兩個部分2&與汕加 以繪示，然而，應知基板載具係形成為環繞框體或板狀 接收器之形式，也可推知其他運載基板的實施例。 用於支撐與移動基板載具2之傳輸裝置5包含一引導 裝置6與一驅動器13;引導裝置6包括上導執24與下 支撑滾輪15、16’支撐滾輪15、16的承載表面包括一 周圍的凹處’以與基板載具2下端處的滑動元件19接合。 由第1圖可知’引導裝置包含兩支撐滾輪15、16以及 導執24，其係設計為包含兩接合通道26與27以容置基 板載具上端之雙重導執；因此，導軌24係設計為具有「E 字形」截面之輪廓。 基板載具2的上端28係與接合通道26、27其中之一 接σ在第1圖中，基板載具2係繪示為與導轨24的接 σ通道26接合’而未使用接合通道27。m relative to each other's movement, the guidance system is arranged at a different degree of transmission relative to the transmission device and the mobile device; therefore, the track does not touch during the reciprocating movement. In this concept, the guide rails of the transmission device or the guide rails of the mobile device are disposed at a greater distance from each other to the transmission path. In addition to the first moveable mask, a second removable mask that is fixed relative to the source of the coating can be configured to protect the mobile device as well as the removable mask. Due to the design of the coating chamber of the present invention, the coating chamber can be used in different ways, thereby increasing the variability in use. In particular, the coating chamber can be used for static coating, continuous coating, and semi-stationary coating. Due to the ability of the mask to move, high quality coatings in uniformity and homogeneity can be deposited in each mode of operation. [Embodiment] - Fig. 1 is a partial cross-sectional view showing a coating chamber according to a first embodiment of the present invention. The coating chamber of the embodiment shown in Figure 1 comprises a cavity 201016885 chamber wall 10' which is only partially visible. According to the cross-sectional view, the chamber wall 10 is divided into an upper chamber wall portion 10a and a lower chamber wall portion i〇b; the wall portions 10a and 1 〇b define an opening which is provided by a cover 9 shut down. A coating source 8 is disposed at the cover 9, such as a rotatable magnetic cathode for sputter deposition. The coating source 8 can be easily replaced due to the detachable cover 9 . The substrate contained in the substrate holder 2 can be mounted via a transport device 5 with respect to the coating source 8. According to the cross-sectional view, the substrate carrier 2 is depicted in two parts 2& The substrate carrier is formed in the form of a surrounding frame or a plate-shaped receiver, and other embodiments of the carrier substrate are also inferred. The transport device 5 for supporting and moving the substrate carrier 2 comprises a guiding device 6 and a driver 13; the guiding device 6 comprising the upper guiding roller 24 and the lower supporting roller 15, 16' supporting the rollers 15, 16 comprises a surrounding surface The recess ' engages with the sliding element 19 at the lower end of the substrate carrier 2. As can be seen from Fig. 1, the guiding device comprises two supporting rollers 15, 16 and a guide 24 designed to include two engaging passages 26 and 27 for accommodating the double guide of the upper end of the substrate carrier; therefore, the guide rail 24 is designed as Has the outline of the E-shaped section. The upper end 28 of the substrate carrier 2 is connected to one of the joint passages 26, 27 in FIG. 1 , and the substrate carrier 2 is illustrated as being engaged with the joint channel 26 of the guide rail 24 without using the joint passage 27 .

I 為提供相觸“丨導，磁鐵25聽置在接合通道26、 27的侧壁處’以保持基板載具2的上端與接合通道26、 11 201016885 27間之接合， 基於此一意圖 當材料製成。 其距離接合通道26、27之側壁一距離。 ，基板載具2也可包含適當的磁鐵或由適 在第1圖之實施例中，基板載具2係由支撲滾輪16 予以支樓，並接合於導軌24的接合通道％中。然而， -第二基板载具（未圖示）係裝設在第二支撐滾輪"處 以及在接合通道27中，因此除了支擇滾輪㈣接合通 道26所定義之第一傳輸通道之外，支撐滾輪15與接合 ❹ 通道27係定義了一第二平行傳輸路徑。 支撐滚輪15與16係配置在一可旋轉軸桿14上，其係 由連接至-馬達（未圖不）之一驅動滾輪13予以驅動。 因此，當驅動滾輪13旋轉時，支撐滾輪15、16也會由 可旋轉軸桿驅動，以移動配置在支撐滾輪15、16上之基 板載具2 ^ 在與垂直於所繪製截面或截面平面的方向上延長的導 φ 軌24相同’數個支撐滾輪15、16係彼此相鄰並肩配置 於與所緣製平面垂直的方向，以於垂直於所緣製平面或 截面平面的方向分別支撐及/或驅動板狀基板1或基板載 具2 〇 雖然所有支撐滾輪係由一驅動器予以驅動，但並非必 須驅動所有的支撐滾輪，這是因為基板載具2的延長部 分之故’因而只驅動配置於線上的某些支撐滾輪即已足 夠0 藉由傳輸裝置5,基板載具2可與基板1於與所會製 12 201016885 平面垂直的方向一起移動，因此基板1係配置在相對於 塗層來源8的一或多個塗佈位置處，或可移動而使得基 板通過塗層來源8 —或數次" 由於塗層來源8係設計為使得在長度方向31中的延長 部分至少與待塗佈基板1之延長部分相同與甚至更大， 當配置在相對於塗層來源8處時，基板1係可於此方向 完全被塗佈。然而，由於在與塗層來源長度方向垂直（亦 即與所繪製平面垂直）的方向中，待塗佈基板1的延長 部分較大’基板1在此方向中無法完全被塗佈。因此， 基板係於沉積期間由傳輸裝置5加以移動，使得在移動 期間’基板的整個表面運行通過塗層來源8所定義之塗 佈Q域’並因而可完全被塗佈。或者是，可以陣列方式 知供數個塗層來源8，因此整個塗層來源的塗佈區域會 增加以覆蓋待塗佈之整個基板表面。舉例而言，複數個 處理工具所形成之這種增大塗層來源係可於與所繪製平 面垂直的方向成列配置。在一實施例中，一系列的可旋 轉磁性電極係彼此相鄰並肩配置，其長度方向31係為平 行。 因此，根據塗佈條件而定，當基板载具2及基板4 整個塗佈製程是保持於卜位置或數個塗佈位置，則基 板1係以靜止式模式予以塗佈；或者是，在塗佈期間， 基板載具2與基板丨係連續地以—傳輪方向移動或以交 替的傳輸方向進行震盪。 為避免不當塗佈基板載具2、傳輪裝置5及，或塗佈腔 13 201016885 至的其他組件，歲备 、塗佈腔室相關之一可移遮罩3係配置 在塗佈腔室壁微_ . , 至壁體處1罩3具有圍繞__塗錢域之環形 形狀，其中其上^ P3a與下部3b可見於第1至4圖之截 面圖中。或者，也可考吾Α戰 J亏量其他的遮罩形狀，例如僅包含 在帶狀等形狀的上部與 丨兴下部中的遮罩功能之結構。第1 圖所示之遮罩3的翁vcw么 上 们戳面係杯狀或凸緣狀結構，其具有一 開口以提供一塗佈孔徑。 雖然遮罩3係用於餹，μ 士 β _I is to provide a contact "guide, the magnet 25 is placed at the side wall of the joint passages 26, 27" to maintain the joint between the upper end of the substrate carrier 2 and the joint passages 26, 11 201016885 27, based on this intention as a material The substrate carrier 2 may also be provided with a suitable magnet or by the embodiment of the first embodiment, the substrate carrier 2 is supported by the support roller 16 The floor is joined to the joint passage % of the guide rail 24. However, the second substrate carrier (not shown) is mounted at the second support roller " and in the joint passage 27, so that in addition to the selection roller (4) In addition to the first transmission channel defined by the engagement channel 26, the support roller 15 and the engagement channel 27 define a second parallel transmission path. The support rollers 15 and 16 are disposed on a rotatable shaft 14, which is The drive roller 13 is driven by one of the motors (not shown). Therefore, when the drive roller 13 rotates, the support rollers 15, 16 are also driven by the rotatable shaft to be moved and disposed on the support rollers 15, 16. The substrate carrier 2 ^ is perpendicular to The guide rails 24 extending in the direction in which the cross-section or the cross-sectional plane is drawn are the same. 'Several support rollers 15, 16 are adjacent to each other and disposed in a direction perpendicular to the plane of the edge so as to be perpendicular to the plane of the edge or the plane of the section. The direction supports and/or drives the plate substrate 1 or the substrate carrier 2 respectively. Although all the supporting rollers are driven by a driver, it is not necessary to drive all the supporting rollers because of the extension of the substrate carrier 2. 'Therefore only some of the support rollers arranged on the line are sufficient. By means of the transport device 5, the substrate carrier 2 can move with the substrate 1 in a direction perpendicular to the plane of the 12 201016885, so the substrate 1 is arranged in At one or more coating locations relative to the coating source 8, or may be moved such that the substrate passes through the coating source 8 - or several times "because the coating source 8 series is designed such that the extension in the length direction 31 At least the same as or greater than the extension of the substrate 1 to be coated, when disposed at a position relative to the coating source 8, the substrate 1 can be completely coated in this direction. In the direction in which the length direction of the coating source is perpendicular (that is, perpendicular to the plane drawn), the extension of the substrate 1 to be coated is large. The substrate 1 cannot be completely coated in this direction. Therefore, the substrate is deposited during deposition. The transport device 5 is moved such that during transport the 'surface of the substrate runs through the coated Q domain defined by the coating source 8' and thus can be completely coated. Alternatively, several coating sources can be known in an array. 8. The coating area of the entire coating source is then increased to cover the entire substrate surface to be coated. For example, the increased coating source formed by a plurality of processing tools can be perpendicular to the plane being drawn. The directions are arranged in a row. In one embodiment, a series of rotatable magnetic electrodes are arranged adjacent to each other side-by-side with their longitudinal directions 31 being parallel. Therefore, depending on the coating conditions, when the entire coating process of the substrate carrier 2 and the substrate 4 is maintained at a position or a plurality of coating positions, the substrate 1 is applied in a static mode; or, During the cloth, the substrate carrier 2 and the substrate are continuously oscillated in the direction of the transfer wheel or in the alternate transfer direction. In order to avoid improper coating of the substrate carrier 2, the transfer device 5 and/or the other components of the coating chamber 13 201016885, one of the transfer chambers and the coating chamber may be disposed on the coating chamber wall. Micro-., to the wall body 1 cover 3 has a ring shape around the __-coating area, wherein the upper portion P3a and the lower portion 3b can be seen in the cross-sectional views of the first to fourth figures. Alternatively, it is also possible to use other mask shapes such as the upper portion of the strip shape and the mask function in the lower part of the Zhaoxing. The mask 3 of the mask 3 shown in Fig. 1 has a cup-shaped or flange-like structure with an opening to provide a coating aperture. Although the mask 3 is used for 餹, μ士 β _

、靜止方式，亦即該遮罩在沉積期間 保持不移動’但遮罩3亦可以類似於基板載具2之傳輸 裝置5的方式配置在移動設備11中，以提供移動之能力。 移動設備包含一遮罩引導裝置12與一驅動器13，其 係與傳輸裝置5 —起使用。遮罩引導裝置12包含與傳輸 裝置的支撐滾輪15、16類似的支撐滾輪17，以及與傳 輸裝置5的導軌24部分類似的遮罩導軌24，遮罩導軌 21僅包含一接合通道，其中遮罩3的上部23係以非接 觸方式接合。 為此，遮罩導軌21於接合通道的側壁處也包含磁鐵 22,在截面中’遮罩導轨21具有u字形，遮罩導軌21 係藉由彎管2〇而固定至腔室壁體1〇β 在下部處’遮罩3係支撐於支撐滾輪17上，其也包含 一承載表面中的凹部。類似於基板載具2，遮罩3包含 一滑動元件18以與支撐滚輪1 7的凹部接合。 支撐滾輪17係以抗扭矩方式配置在轴桿14處，因此 支樓滾輪17"^*由驅動滚輪13驅動。此外，支撐滚輪17 201016885 可沿著輛杯14的縱轴滑動，因此軸 中左下部分所示之雙箭頭而移動。為此，艮據第1圖 動方式裝設在腔室壁體1〇中。 桿係以可滑 與軸桿14的移動類似，基板載具 軌Μ係根㈣i时右上部分所示傳輪裝置5的導 於支撐滾輪Η係固定地配置在轴桿:項而移動。由 抽桿14根據雙箭頭而移動時’支撐滚輪15、二2 桿14 一扭兹由《 16係與轴The stationary mode, i.e., the mask remains unmoved during deposition, but the mask 3 can also be disposed in the mobile device 11 in a manner similar to the transport device 5 of the substrate carrier 2 to provide the ability to move. The mobile device includes a mask guiding device 12 and a driver 13, which are used in conjunction with the transmitting device 5. The mask guiding device 12 comprises a support roller 17 similar to the support rollers 15, 16 of the transport device, and a mask rail 24 similar to the portion of the rail 24 of the transport device 5, the mask rail 21 comprising only one engagement channel, wherein the mask The upper portion 23 of the 3 is joined in a non-contact manner. To this end, the mask rail 21 also includes a magnet 22 at the side wall of the joint passage. In the cross section, the mask rail 21 has a U-shape, and the shield rail 21 is fixed to the chamber wall body by the bent tube 2 〇β At the lower portion, the mask 3 is supported on the support roller 17, which also contains a recess in a bearing surface. Similar to the substrate carrier 2, the mask 3 includes a sliding member 18 for engaging the recess of the support roller 17. The support roller 17 is disposed at the shaft 14 in a torque-proof manner, so that the branch roller 17"^* is driven by the drive roller 13. In addition, the support roller 17 201016885 can slide along the longitudinal axis of the cup 14 and thus move with the double arrow shown in the lower left portion of the shaft. For this purpose, it is installed in the chamber wall 1〇 according to the first embodiment. The rod is slidable similarly to the movement of the shaft 14, and the substrate carrier traverse base (4) i is shown in the upper right portion of the transfer device 5, which is supported by the support roller and is fixedly disposed on the shaft: movement. When the pumping rod 14 moves according to the double arrow, the support roller 15 and the two rods 14 are twisted by the 16-series and the shaft.

桿 起移動。導軌24係柄合至轴桿14, _牛^ 導軌24與轴桿14。 从问步移動 愈：樣從第1圓可知’叙接裝置7係提供以轉合遮罩3 载具2。搞合裝置7包含一接腳3〇,其接合於基 板载具2中之-凹部29’以提供外型相配連接。由於轴 桿Μ以及帶動支撐滾輪16與導軌24的移動，基板載具 2可移動，使得遮罩3的接腳3〇接合凹部29,因此可達 成遮罩3與基板載具2的耦合。當基板載具2與遮罩3 藉由耦合裝置7耦合在一起時，遮罩3與基板載具2可 由傳輪裝置5與移動設備u 一起移動；因此，在墓板載 具2與遮罩3都於塗佈製程期間移動的運作模式中可 僅為塗佈製程而以一簡單方式建立可移遮罩，其係藉由 耦合遮罩3與基板載具2而行。因此’基板i的整個表 面係由塗層來源8予以塗佈，雖然塗層來源8定義的塗 佈區域不會覆蓋待塗佈之整體表面。特別是，基板載具 與遮罩3係於位置間震盪，因此可達成均質且均勻的塗 層°由於可移遮罩3係與塗佈腔室相關，在沉積之後遮 15 201016885 罩3不需與基板載具2移出塗佈腔室且也不需與待塗佈 之新基板再次引入。再者，可減少遮罩的數目；此外， 可移遮罩不僅用於發生基板移動之操作模式也可用於 靜止式塗佈。 、 、為了保護移動設備11免於其上沉積塗層材料，一第二 遮罩4係固定至腔室壁體1〇。與遮罩 ❿ 鲁 :不限於第1至4圖之截面圖中所示之上下遮罩帶一4:: 4b，而也可包括環形結構。 、 式：二發明之塗佈腔室的設計’有三種不同的操作模 你番"、仃：即基板1在整個塗佈製程期間位於-塗佈 向中：：止式塗佈、基板1在整個塗佈製程期間於-方 A中基板=之連續式塗佈、以及-種第三操作模式， 於塗佈期間移動至不同的塗佈位置 3^供Ϊ时式。對於所有的三種操作模式而言，遮罩 域，而同避免塗層材料沉積在不當區 層的始： 塗層沉積’特別是就沉積之塗 係位於靜:ΠΤ言，止式操作期間，遮罩3 、、土板载具2一起移動，其中基板】 個不同塗佈位置、或在塗佈製程期間震盪。係移動至數 為在第:二圖之相同塗伟腔室，其差異僅 4圖中’蓋體9與塗層來源8係未 外’第2圖繪示了在具有支撐 27之第-槽私A 15與接合通道 第一傳輸路徑中基板載具2與基板1西 <配置。由於 16 201016885 轴桿14與導軌24的位移，基板載具2與遮罩3也由耦 合裝置7耦合。 由於傳輸裝置5提供了兩個平行傳輸路徑可實現高 基板處理量；這是因為一個基板可配置在至少一塗佈位 置中，而另一個基板係自塗佈位置移除。 第4圖繪示了以傳輸裝置5在傳輸裝置5提供的兩個 傳輸路徑中傳輸兩個基板la與lb的情形，因此，接腳 30並未接合於基板載具2a與2b的凹部29a與29b中， ® 如緣示於第3圖。 第5圖與第6圖缯示了本發明一第二實施例的截面 圖’其大部分都與第1-4圖所示之實施例相同，因此省 略了整個實施例的重複說明以求簡潔。以下僅說明差異 處。 第5圖與第6圓所示之實施例與第1>>4圖所示之實施 例不同處在於遮罩引導裝置12的遮罩導軌21與傳輸裝 ❹ 置3的導軌24之配置 '根據第5圖與第6圖所示之實施 例’遮覃導軌21並非與導執24並肩裝設於塗佈方向， 而是在相對於支採部或轴桿之導軌上方，因而實現了節 省空間之設計’因為導軌24可移動至更靠近遮罩3處。 第7圖與第8圖中繪示了一種類似的實施例。在此實 施例中，導軌24係配置在遮罩導軌21上方，因此，特 別是在使用導軌24之接合通道27的情形中，可實現一 種非常節省空間之傳輸裝置5的配置。 本發明係已參照特定實施例而加以說明，然該領域技 17 201016885 ,士應知本發明並不限於這些實施例，而是可以涵蓋 替代方式與修舞方式，例如在不脫離如附中請專利範 圍下省略單—特徵或是所述特徵之不同組合。特別是， 本發明涵蓋了此處所描述之特徵的所有組合。 【圖式簡單說明】 本發明之其他優勢、特徵與特性係可從實施例說明並 ⑩ #照如附圖式而瞭解。這些圖式僅為示意之用，其中： 第1圖為根據本發明第一實施例之塗佈腔室的部分截 面圖； 第2圖為第1圖之塗佈腔室在一第二運作狀態下之部 分截面圖； 第3圖為第丨圖與第2圖之塗佈腔室在一第三運作狀 態下之部分截面圖； 第4圈為第！圖至第3圖之塗佈腔室在一第四運作狀 ❿ 態下之部分截面圖； 第5圖為根據本發明第二實施例之塗佈腔室的部分截 面圖； 第6圖為第5圖之塗佈腔室在一第二運作狀態下之部 分截面圖； 第7圖為第5圖與第6圖之塗佈腔室在一第三運作狀 態下之部分截面圖；以及 第8圖為第7圖之塗佈腔室在一第二運作狀熊 〜P <部 18 201016885 分截面圖。 【主要元件符號說明】The rod moves. The guide rail 24 is stalked to the shaft 14, _ _ ^ rail 24 and the shaft 14. From the step of moving, the more the sample is known from the first circle, the splicing device 7 is provided to turn the mask 3 carrier 2. The engagement device 7 includes a pin 3 接合 that engages the recess 29' in the substrate carrier 2 to provide an external mating connection. Due to the movement of the shaft Μ and the movement of the support roller 16 and the guide rail 24, the substrate carrier 2 is movable, so that the pin 3 of the mask 3 engages the recess 29, so that the coupling of the mask 3 and the substrate carrier 2 can be achieved. When the substrate carrier 2 and the mask 3 are coupled together by the coupling device 7, the mask 3 and the substrate carrier 2 can be moved together with the mobile device u by the roller device 5; therefore, the tomb carrier 2 and the mask are 3 In the mode of operation during the coating process, the movable mask can be established in a simple manner only for the coating process, which is performed by coupling the mask 3 and the substrate carrier 2. Thus, the entire surface of the substrate i is coated by the coating source 8, although the coating area defined by the coating source 8 does not cover the entire surface to be coated. In particular, the substrate carrier and the mask 3 are oscillated between positions, so that a uniform and uniform coating can be achieved. Since the movable mask 3 is associated with the coating chamber, after deposition, the cover 10 201016885 is not required. The substrate carrier 2 is removed from the coating chamber and does not need to be reintroduced with the new substrate to be coated. Furthermore, the number of masks can be reduced; in addition, the movable mask can be used not only for the operation mode in which the substrate is moved but also for the static coating. In order to protect the mobile device 11 from depositing the coating material thereon, a second mask 4 is fixed to the chamber wall 1〇. And the mask : Lu: not limited to the upper mask band 4:: 4b shown in the cross-sectional views of Figures 1 to 4, but may also include a ring structure. , formula: The design of the coating chamber of the second invention has three different operating modes: 仃: that is, the substrate 1 is located in the coating process during the entire coating process:: coating, substrate 1 The continuous coating of the substrate = in the square A during the entire coating process, and the third mode of operation, moved to a different coating position during the coating process. For all three modes of operation, the mask domain, while avoiding the deposition of coating material at the beginning of the improper zone: Coating deposition 'especially the deposited coating is located in static: rumors, during the dead operation, The cover 3 and the soil carrier 2 are moved together, wherein the substrates are in different coating positions or are oscillated during the coating process. The system moves to the same number in the second: Figure 2, the difference is only 4 in the 'cover 9 and the coating source 8 is not outside' Figure 2 shows the first trough with support 27 The private A 15 and the bonding channel are in the first transmission path in the substrate carrier 2 and the substrate 1 west < Due to the displacement of the shaft 14 and the guide rail 24 of 16 201016885, the substrate carrier 2 and the mask 3 are also coupled by the coupling means 7. Since the transfer device 5 provides two parallel transfer paths, high substrate throughput can be achieved; this is because one substrate can be disposed in at least one coating position and the other substrate is removed from the coating position. 4 shows the case where the two substrates 1a and 1b are transported by the transport device 5 in the two transport paths provided by the transport device 5. Therefore, the pins 30 are not bonded to the recesses 29a of the substrate carriers 2a and 2b. In 29b, ® is shown in Figure 3. 5 and 6 illustrate a cross-sectional view of a second embodiment of the present invention, which is mostly the same as the embodiment shown in Figs. 1-4, and thus the repeated description of the entire embodiment is omitted for brevity. . Only the differences are explained below. The embodiment shown in Figs. 5 and 6 is different from the embodiment shown in the first >> 4 in the arrangement of the mask rail 21 of the mask guiding device 12 and the rail 24 of the transport device 3' According to the embodiment shown in Figures 5 and 6, the concealing guide 21 is not mounted side by side with the guide 24 in the coating direction, but above the guide rail relative to the support or the shaft, thereby achieving savings. The design of the space 'because the guide rail 24 can be moved closer to the mask 3. A similar embodiment is illustrated in Figures 7 and 8. In this embodiment, the guide rails 24 are disposed above the mask rails 21, and thus, particularly in the case of using the joint passages 27 of the guide rails 24, a configuration of a very space-saving transporting device 5 can be realized. The present invention has been described with reference to the specific embodiments. However, it should be understood that the present invention is not limited to the embodiments, but may cover alternatives and manners of training, for example, without departing from the patents. The single-features or different combinations of the features are omitted in the scope. In particular, the present invention encompasses all combinations of the features described herein. BRIEF DESCRIPTION OF THE DRAWINGS Other advantages, features, and characteristics of the present invention will be apparent from the description of the embodiments. These drawings are for illustrative purposes only, wherein: Figure 1 is a partial cross-sectional view of a coating chamber in accordance with a first embodiment of the present invention; and Figure 2 is a coating chamber of Figure 1 in a second operational state. The lower part of the cross-sectional view; Figure 3 is a partial cross-sectional view of the coating chamber of the second and second drawings in a third operating state; the fourth lap is the first! Figure 5 is a partial cross-sectional view of the coating chamber in a fourth operational state; Figure 5 is a partial cross-sectional view of the coating chamber in accordance with a second embodiment of the present invention; 5 is a partial cross-sectional view of the coating chamber in a second operating state; FIG. 7 is a partial cross-sectional view of the coating chamber of FIGS. 5 and 6 in a third operating state; and 8th Figure 7 is a cross-sectional view of the coating chamber of Figure 7 in a second operational bear ~ P < section 18 201016885. [Main component symbol description]

1 基板 2 基板載具 2a、 2b 載具部分 3、 4 遮罩 3a、 4a 上部 3b、 4b 下部 5 傳輸裝置 6 引導裝置 7 耦合裝置 8 塗層來源 9 蓋體 10 腔室壁體 10a 、10b 壁體部分 11 移動設備 12 遮罩引導裝置 13 驅動器 14 轴桿 15 ' 16' 17 支撐滾輪 18 ' 19 滑動元件 20 彎管 19 2010168851 substrate 2 substrate carrier 2a, 2b carrier part 3, 4 mask 3a, 4a upper 3b, 4b lower 5 transport device 6 guiding device 7 coupling device 8 coating source 9 cover 10 chamber wall 10a, 10b wall Body part 11 mobile device 12 mask guiding device 13 drive 14 shaft 15 ' 16' 17 support roller 18 ' 19 sliding element 20 elbow 19 201016885

21 遮罩導軌 22 磁鐵 23 上部 24 導軌 25 磁鐵 26 > 27 接合通道 28 上端 29a ' 29b 凹部 30 接腳 31 長度方向21 Mask rail 22 Magnet 23 Upper 24 Rail 25 Magnet 26 > 27 Engagement channel 28 Upper end 29a ' 29b Recess 30 Pin 31 Length direction

Claims (1)

201016885 七、申請專利範圍： 1. 一種塗佈腔室，其包含： 一塗層來源； 一傳輸裝置，用於移動一基板載具，其適於可傳栽一 待塗佈基板至相對於該塗層來源之至少一個塗佈位置，使 得該基板得以被塗佈；以及 至少一個第一遮罩，其係配置在該基板之該塗佈位置 與該塗層來源之間的一區域中’以避免該待塗佈基板表面 ❿外之區域的塗佈，及 其中該第一遮罩包含一移動設備以及用於耦合該第一 遮罩與該基板載具之一耦合裝置，使得該第一遮罩與該基 板載具一起移動。 2. 如申請專利範圍第1項之塗佈腔室，其中該塗佈腔室 係一真空腔室》 3. 如申請專利範圍第1項之塗佈腔室，其中該塗層來源 係選自包含CVD源、PECVD源、PVD源、濺鍍源與氣相 沉積源之一群組。 4. 如申請專利範圍第1項之塗佈腔室，其中該塗層來源 定義一塗佈區域，其一沉積率高於一預定值，該塗佈區域 係於至少一個維度上小於該待塗佈基板。 21 201016885 5. 如申請專利範圍第1項之塗佈腔室，其中該塗層來源 包含分佈於該塗層來源之上的一個或數個處理工具。 6. 如申請專利範圍第5項之塗佈腔室，其中該處理工具 係選自包含電極、磁電極、淋灑頭電極、旋轉電極、雙電 極、微波源、加熱器、濺鍍靶材、氣體入口與蒸發源之群 組》 參 7·如前述申請專利範圍第1項之塗佈腔室，其中該傳輸 裝置係適於配置該基板載具與該待塗佈基板於相對於該塗 層來源之數個塗佈位置。 8. 如申請專利範圍第1項之塗佈腔室，其中該傳輸裝置 係適於相對於該塗層來源而震盪該基板載具與該基板。 ❿ 9. 如申請專利範圍第1項之塗佈腔室，其中該傳輸裝置 之一傳輸方向係橫切於該塗層來源的一長度方向。 1〇.如申請專利範圍第4項之塗佈腔室，其中該傳輸裝置 之一傳輪方向係與該塗佈區域小於該待塗佈基板之表面的 方向平行。 η·如前述申請專利範圍第1項之塗佈腔室，其中該傳輪 22 201016885 裝置包含一驅動器及/或一引導裝置。 12. 如申請專利範圍第11項之塗佈腔室，其中該傳輪裝 置係適於板狀基板的垂直傳輸’及/或該引導裝置包含定義 一傳輸路徑與一相對導軌之一支撑部。 13. 如申請專利範圍第11項之塗佈腔室，其中該傳輪裝 置包含滾輪以支撐及/或驅動該基板載具。 〇 14·如申請專利範圍第u項之塗佈腔室，其中該引導裝 置包含一非接觸式引導件或一磁性引導件。 15.如申請專利範圍第1項之塗佈腔室，其中該傳輪裝置 包含數個引導裝置’其定義了彼此平行配置的數個傳輪路 徑。 參 16·如前述申請專利範圍第1項之塗佈腔室，其中該第一 遮罩之該移動設備包含至少一個驅動器及/或至少一個引 導設備。 17.如申請專利範圍第16項之塗佈腔室，其中該移動設 備係適於一環形遮罩的移動，及/或該引導設備包含定義一 遮罩傳輸路徑與一相對遮罩導軌之一遮罩支撐部。 23 201016885 18. 如申請專利範圍第16項之塗佈腔室其中該移動設 備包含滾輪以支撐及/或驅動該遮罩。 19. 如申請專利範圍第16項之塗佈腔室其中該引導設 備包含一非接觸式引導件或一磁性引導件。 20. 如申請專利範圍第丨項之塗佈腔室，其中該傳輸裝置 與該移動設備具有一單一共用驅動器或數個獨立驅動器。 21. 如申請專利範圍第1項之塗佈腔室，其中該耦合裝置 包含外型相配元件。 22. 如申請專利範圍第1項之塗佈腔室，其中該傳輸裝置 及/或該移動設備至少部分向彼此移動及/或相對於該塗層 來源移動。 23. 如前述申請專利範圍第1項之塗佈腔室，其中該傳輸 裝置及/或該移動設備係至少部分橫切於該基板載具之一 傳輸方向而移動，及/或以自該塗層來源至該待塗佈基板之 一塗佈方向移動。 24. 如申請專利範圍第1項之塗佈腔室，其中該傳輸裝置 及/或該移動設備包括導軌，該等導軌係彼此並肩配置且具 有離相對支撐部之相同距離，或是彼此前後配置且具有離 24 201016885 相對支撐部之不同距離。 25. 如申請專利範園第1項之塗佈腔室，其中係提供至少 一個第二遮罩，該第二遮罩係相對於該塗層來源而固定。 26. 如申請專利範圍第25項之塗佈腔室，其中該第二遮 罩覆蓋該第一遮罩及/或該移動設備。 癱 27.如申請專利範圍第1項之塗佈腔室，其中該第一遮罩 覆蓋該待塗佈基板之表面及/或該基板載具周圍之一區域。 28. 如申請專利範圍第1項之塗佈腔室，其中該第一遮罩 之該移動設備係設計以使該第一遮罩僅於該腔室中移動。 29. —種用於運作一塗佈腔室之方法，其包含以下步驟： 0 提供一基板於一基板舞具上，· 選擇不同運作模式中的一種運作模式，其中 一第一運作模式，包含：在塗佈期間，將該塗佈腔室 的一可移遮罩保持靜止，該基板載具連續移動通過該塗佈 腔室的一塗佈區域， 一第二運作模式，包含以下步驟： 移動具有該基板之該基板載具至一耦合位置， 耦合該基板載具與提供於該塗佈腔室中提供之一 可移遮罩，以及 25 201016885 移動該基板載具與該可移遮罩於至少一另一位 置，使得該基板係於相對於一塗層來 置中進行塗佈，且 塗層來源之至少兩個不同位 一第三運作模式，包含：在塗佈期間，將該塗佈腔室 的該可移遮罩係保持靜止，靜止式塗佈該基板。201016885 VII. Patent Application Range: 1. A coating chamber comprising: a coating source; a transport device for moving a substrate carrier adapted to be capable of implanting a substrate to be coated to At least one coating location of the coating source such that the substrate is coated; and at least one first mask disposed in a region between the coating location of the substrate and the source of the coating Avoiding coating of the area outside the surface of the substrate to be coated, and wherein the first mask comprises a mobile device and coupling means for coupling the first mask and the substrate carrier such that the first cover The cover moves with the substrate carrier. 2. The coating chamber of claim 1, wherein the coating chamber is a vacuum chamber. 3. The coating chamber of claim 1, wherein the coating source is selected from the group consisting of A group comprising a CVD source, a PECVD source, a PVD source, a sputtering source, and a vapor deposition source. 4. The coating chamber of claim 1, wherein the coating source defines a coating region, wherein a deposition rate is higher than a predetermined value, the coating region being smaller than the coating to be coated in at least one dimension Cloth substrate. 21 201016885 5. The coating chamber of claim 1, wherein the source of the coating comprises one or more processing tools distributed over the source of the coating. 6. The coating chamber of claim 5, wherein the processing tool is selected from the group consisting of an electrode, a magnetic electrode, a shower head electrode, a rotating electrode, a dual electrode, a microwave source, a heater, a sputtering target, The coating chamber of the first aspect of the invention, wherein the transport device is adapted to configure the substrate carrier and the substrate to be coated relative to the coating Several coating locations from the source. 8. The coating chamber of claim 1, wherein the transport device is adapted to oscillate the substrate carrier and the substrate relative to the source of the coating. 9. The coating chamber of claim 1, wherein the transport direction of one of the transport devices is transverse to a length direction of the source of the coating. The coating chamber of claim 4, wherein the conveying direction of one of the conveying means is parallel to a direction in which the coating area is smaller than a surface of the substrate to be coated. The coating chamber of the first aspect of the invention, wherein the transmission wheel 22 201016885 device comprises a driver and/or a guiding device. 12. The coating chamber of claim 11, wherein the transfer device is adapted for vertical transport of the plate substrate' and/or the guiding device comprises a support portion defining a transport path and an opposing rail. 13. The coating chamber of claim 11, wherein the transfer device includes a roller to support and/or drive the substrate carrier. The coating chamber of claim U, wherein the guiding device comprises a non-contact guide or a magnetic guide. 15. The coating chamber of claim 1, wherein the transfer device comprises a plurality of guiding devices' which define a plurality of transfer paths arranged in parallel with one another. The coating chamber of claim 1, wherein the mobile device of the first mask comprises at least one driver and/or at least one guiding device. 17. The coating chamber of claim 16 wherein the mobile device is adapted for movement of an annular mask and/or the guiding device comprises one of defining a mask transmission path and an opposing mask rail Mask support. 23 201016885 18. The coating chamber of claim 16 wherein the moving device comprises a roller to support and/or drive the mask. 19. The coating chamber of claim 16 wherein the guiding device comprises a non-contacting guide or a magnetic guide. 20. The coating chamber of claim 3, wherein the transport device and the mobile device have a single shared drive or a plurality of independent drives. 21. The coating chamber of claim 1, wherein the coupling device comprises an exterior matching component. 22. The coating chamber of claim 1, wherein the transport device and/or the mobile device are at least partially moved toward each other and/or moved relative to the source of the coating. 23. The coating chamber of claim 1, wherein the transport device and/or the mobile device are moved at least partially transverse to a direction of transport of the substrate carrier, and/or from the coating The layer is sourced to move in one of the coating directions of the substrate to be coated. 24. The coating chamber of claim 1, wherein the transport device and/or the mobile device comprises rails that are disposed side by side with each other and have the same distance from the opposing support portions, or are configured one behind the other And has a different distance from the support of 24 201016885. 25. The coating chamber of claim 1, wherein at least one second mask is provided, the second mask being fixed relative to the source of the coating. 26. The coating chamber of claim 25, wherein the second mask covers the first mask and/or the mobile device. The coating chamber of claim 1, wherein the first mask covers a surface of the substrate to be coated and/or a region around the substrate carrier. 28. The coating chamber of claim 1, wherein the mobile device of the first mask is designed to move the first mask only in the chamber. 29. A method for operating a coating chamber, comprising the steps of: 0 providing a substrate on a substrate dancer, selecting one of a plurality of modes of operation, wherein the first mode of operation comprises : maintaining a movable mask of the coating chamber stationary during coating, the substrate carrier continuously moving through a coating area of the coating chamber, a second mode of operation comprising the steps of: The substrate carrier having the substrate to a coupling position, coupling the substrate carrier and providing a movable mask provided in the coating chamber, and 25 201016885 moving the substrate carrier and the movable mask At least one other location such that the substrate is coated with respect to a coating, and at least two different bits of the coating source - a third mode of operation, comprising: coating during coating The removable mask of the chamber remains stationary and the substrate is applied statically. /〇·如申請專利範圍第29項之方法其中在該第二運作 、式中’該基板載具與該可移料震錢得減板載具與 該可移遮罩重複移動通過該塗佈腔室的—塗佈區域。 26The method of claim 29, wherein in the second operation, the substrate carrier and the movable shock reduction plate carrier and the movable mask are repeatedly moved through the coating The coated area of the chamber. 26
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