JP7439253B2 - Idle Shield, Deposition Apparatus, Deposition System, and Methods of Assembling and Operating - Google Patents

Description

TECHNICAL FIELD This disclosure relates to shielding of deposition systems and to deposition systems configured to deposit vaporized materials, particularly vaporized organic materials, onto one or more substrates. Embodiments of the present disclosure further relate to an idle shield configured to shield, block, and/or collect evaporated material, for example, at an idle position of a deposition source. Embodiments of the present disclosure further relate to a deposition apparatus with a deposition system for depositing evaporative material onto a substrate. Another embodiment relates to a method of operating an evaporation source, a method of assembling an idle shield, and a method of operating a deposition system, particularly a system for depositing evaporation material onto a substrate in a vacuum processing chamber.

Organic evaporators are tools for manufacturing organic light emitting diodes (OLEDs). OLEDs are a special type of light emitting diode whose light emitting layer comprises a thin film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, and other handheld devices, such as for displaying information. OLEDs can also be used for general spatial lighting. The color range, brightness and viewing angle of OLED displays can be greater than traditional LCD displays because OLED pixels emit light directly and do not require a backlight. Therefore, the energy consumption of OLED displays is significantly lower than traditional LCD displays. Additionally, OLEDs can be manufactured on flexible substrates, creating additional applications.

Typically, the vaporized material is directed to the substrate from one or more outlets of the vapor source. For example, the vapor source may include a plurality of nozzles configured to direct a plume of vaporized material toward the substrate. A vapor source can be moved relative to the substrate to coat the substrate with evaporated material.

To deposit a pattern of material onto a substrate with a predetermined uniformity, it may be advantageous for the plume of evaporated material from one or more vapor outlets of the vapor source to be stable. It may take some time for the steam source to stabilize after startup. Therefore, frequent interruptions and startups of the steam source may be undesirable, and the steam source may be left running during idle periods. During such idle periods, there may be a risk that the walls of the vacuum processing chamber become coated with evaporated material ("sprinkle coating").

Furthermore, it is advantageous to deposit the various substrates in succession, ie without unnecessary evaporation pauses between processing of the next substrate. For example, the evaporation source can be rotated to switch between processing substrates in a first deposition region and a second deposition region opposite the first deposition region. During rotation from the first deposition region to the second deposition region, the walls of the vacuum processing chamber may also be coated with evaporated material.

Accordingly, it is advantageous to provide idle shields in deposition devices, apparatuses, and systems configured to accurately deposit evaporated material onto a substrate while reducing sprinkle coating on the surface of the device or system.

In view of the above, a method for assembling a shield for shielding deposition source material, a deposition apparatus for sequentially depositing multiple substrates in a vacuum chamber, and a method for assembling a shield for shielding deposition source material; , a method of accessing a deposition source of a deposition apparatus having a vacuum chamber. Further advantages, features, aspects and details emerge from the dependent claims, the description and the drawings.

According to one embodiment, a shield is provided for shielding material of a deposition source of a deposition apparatus having a vacuum chamber. The shield includes a frame configured to be attached to the deposition apparatus and a shield assembly coupled to the frame, the shield including a first lateral shield portion, a second lateral shield portion, and a first lateral shield portion. a shield assembly including a central shield portion between the shield portion and a second side shield portion, the shield assembly being in contact with a wall of the vacuum chamber to shield deposited material in a closed position of the shield assembly; the shield further includes a door arrangement configured to move at least a portion of the shield assembly to provide access to the deposition source in an open position of the shield assembly.

According to one embodiment, a deposition apparatus is provided for sequentially depositing multiple substrates within a vacuum chamber. The deposition apparatus includes a first substrate processing position adjacent to a first sidewall of the vacuum chamber and a second substrate processing position adjacent to a second sidewall of the vacuum chamber, the second substrate processing position being opposite to the first sidewall. a second substrate processing position located at the substrate processing position; a deposition source between the first substrate processing position and the second substrate processing position; and translating the deposition source between the first substrate processing position and the second substrate processing position. a deposition source cart configured to deposit material on the substrate at a first substrate processing position and a second direction for depositing material on the substrate at a second substrate processing position; an actuator configured to rotate a deposition source therebetween, and a shield according to any of the embodiments described herein.

According to one embodiment, a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber is provided. The method includes guiding a recess in the tile over a pin coupled to a screw and securing the tile to a plate assembly or frame by applying torque to the screw.

According to one embodiment, a method of accessing a deposition source of a deposition apparatus having a vacuum chamber is provided. The method includes opening a door arrangement of a shield assembly disposed between a wall of a vacuum chamber and a deposition source to shield deposition material from a closed position of the door arrangement.

The present disclosure is also directed to an apparatus for carrying out the disclosed method, including apparatus parts for carrying out the method. The method may be implemented by hardware components, a computer programmed with appropriate software, any combination of the two, or in any other manner. Additionally, the present disclosure is also directed to methods of operating the described apparatus. The present disclosure includes methods for performing all functions of the device.

In order that the above-listed features of the disclosure described herein may be understood in detail, a more specific description may be obtained by reference to the embodiments, briefly summarized above. The accompanying drawings relate to embodiments of the disclosure and are described below.

1A and 1B are schematic illustrations of a deposition apparatus in a deposition position (FIG. 1A) and an idle position (FIG. 1B) according to embodiments described herein; FIG. FIG. 2 is a perspective view of a shield of a deposition apparatus according to embodiments described herein. 1 is a schematic cross-sectional view of a portion of a deposition apparatus according to embodiments described herein; FIG. FIG. 2 is a perspective view of a shield of a deposition apparatus according to embodiments described herein. FIG. 3 is an enlarged view of a tile of a shield of a deposition device according to embodiments described herein. 1 is a schematic diagram illustrating the attachment of a shield tile to a portion of a shield of a deposition apparatus according to embodiments described herein; FIG. 2 is a schematic diagram of a portion of a shield of a deposition apparatus according to an embodiment of the present disclosure; FIG. 1 is a schematic diagram of a portion of a deposition apparatus according to an embodiment of the present disclosure, including a shield, such as an idle shield, according to an embodiment of the present disclosure; FIG. FIG. 2 is a perspective view of a shield of a deposition apparatus according to embodiments described herein. 1 is a schematic diagram of a shield of a deposition apparatus according to embodiments described herein; FIG. 1 is a schematic diagram of a deposition apparatus with a deposition apparatus according to embodiments described herein; FIG. 1 is a schematic cross-sectional view of a deposition apparatus according to embodiments described herein; FIG. 1 is a flowchart illustrating a method of operating a deposition system according to embodiments described herein.

Reference will now be made in detail to various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numbers refer to like elements. Differences regarding the individual embodiments will be described below. Each example is presented to illustrate the disclosure and not to limit the disclosure. Additionally, features illustrated or described as part of one embodiment can be used on or in combination with other embodiments to yield a still further embodiment. This specification includes such modifications and variations.

FIG. 1A is a schematic diagram of a deposition system 100 according to embodiments described herein. Deposition system 100 includes a deposition source, such as a vapor source 120 having one or more vapor outlets 125. A vapor source 120 is in a deposition position (II) for coating the substrate 10. At the deposition location, one or more vapor outlets are directed toward the deposition area where the substrate 10 is located.

FIG. 1B is a schematic diagram of the deposition system 100 of FIG. 1A with the vapor source 120 in the idle position (I). In the idle position, one or more steam outlets 125 are directed toward shield 110.

The steam source 120 is moved from the deposition position (II) to the idle position (I) where the one or more steam outlets 125 are directed toward the shield 110 and/or from the idle position (I) to the idle position (I) where the one or more steam outlets 125 are directed toward the shield 110. 125 can be moved into a deposition position (II) where it is directed towards the deposition area. For example, a deposition source, such as vapor source 120, can be moved through an angle. The deposition source can be rotated about axis A.

Deposition source or vapor source 120 may be configured as an evaporation source for depositing evaporative material onto substrate 10 disposed in the deposition region. In some embodiments, the steam source 120 includes one or more crucibles and one or more distribution pipes, and one or more steam outlets 125 are provided in each of the one or more distribution pipes. be able to. Each crucible can be in fluid communication with an associated distribution pipe. Evaporated material can flow from the crucible to the coupled distribution pipe. A plume of evaporated material can be directed from one or more vapor outlets of the distribution pipe to the deposition region when the deposition system is in the deposition position.

In FIG. 1A, vaporized material is directed toward substrate 10 from one or more vapor outlets 125. A material pattern can be formed on the substrate. In some embodiments, a mask (not shown) is placed in front of substrate 10 (ie, between substrate 10 and vapor source 120) during deposition. A material pattern corresponding to the aperture pattern of the mask can be deposited on the substrate. In some embodiments, the evaporative material is an organic material. The mask may be a fine metal mask (FMM) or another type of mask, such as an edge exclusion mask.

After or before deposition onto substrate 10, vapor source 120 may be moved to an idle position (I), exemplarily shown in FIG. 1B. Movement of steam source 120 to the idle position (I) may be a relative movement between steam source 120 and shield 110. In the idle position, one or more vapor outlets are directed toward the surface of shield 110.

In some embodiments, the steam source 120 is not deactivated in and/or while moving to the idle position. Thus, vaporized material may be directed from one or more vapor outlets 125 to the shield 110 and condense on the surface of the shield when the vapor source is in the idle position (I). By continuing evaporation in an idle position, for example during idle time of the system, the vapor pressure within the vapor source can be kept substantially constant, and deposition then continues even without stabilization time of the vapor source. be able to.

The shield 110 is arranged such that at least 80%, particularly at least 90%, and more particularly at least 99% of the evaporated material from the one or more steam outlets 125 when the steam source 120 is in the idle position (I). It can be formed to be directed toward the surface of the shield 110. When the vapor source 120 is in the idle position, the vapor plume can be blocked and shielded by the shield 110, thereby reducing or avoiding contamination of other surfaces within the vacuum processing chamber. In particular, coating the chamber walls, devices disposed within the vacuum processing chamber, mask carriers, and substrate carriers may be reduced or avoided. In some embodiments, the surface of the shield 110 is large, e.g., 0.5 m ² or more, to ensure that most of the evaporated material condenses on the face of the shield rather than on other faces at the idle location. In detail, it can be 1 m ² or more, more specifically 2 m ² or more.

Steam source 120 is used for the following purposes: (i) heating the steam source; and (ii) stabilizing the steam source, such as during heating, until a substantially constant steam pressure develops within the steam source. (iii) servicing or maintaining the steam source; (iv) shutting down the steam source, e.g., during cool-down; (v) cleaning the steam source, e.g., cleaning one or more steam outlets. (vi) during mask and/or substrate alignment; and (vii) during a waiting period. and during idle periods, it can be moved to the idle position (I). For example, the idle position may be used as a park position for the deposition system during idle periods of the deposition system. In some embodiments, a vacuum processing chamber and/or a mask that can be placed in the deposition region can prevent sprinkle coating by shield 110, for example, while moving the vapor source to an idle position.

According to some embodiments, the deposition or vapor source moves from the substrate 10 toward another substrate past the idle position (I), as shown in more detail in FIGS. 10 and 11. I can do it. Therefore, this idle position may alternatively be used to prevent sprinkle coating while the deposition source, such as steam source 120, is moving (ie, rotating).

According to embodiments described herein, a cooling device 112 is provided for cooling the shield 110. The shielding effectiveness of the shield can be improved by lowering the temperature of the shield using a cooling device. Additionally, cooling the shield 110 can reduce heat radiation from the shield toward the vapor source, toward the mask, and/or toward the substrate. Thermal movement can be reduced or avoided and deposition quality can be improved.

The evaporated material may be at a temperature of hundreds of degrees, such as 100°C or higher, 300°C or higher, or 500°C or higher. Compared to the evaporation of organic materials, the heat load can be particularly high for the evaporation of metallic materials.

The shield 110 may become hot in the idle position as vaporized material condenses on the surface of the shield. In some embodiments, the steam source 120 remains in the idle position for a significant period of time, such as tens of seconds for alignment or cleaning, or minutes for heating and servicing the steam source. There is. The temperature of the shield 110 can be lowered by the cooling device 112 and the thermal radiation from the shield towards the vapor source and mask can be reduced. For example, the temperature of the shield can be kept below 100°C. Deposition quality can be improved because thermal transfer through the mask is reduced. Note that in some embodiments, the mask may have structures in the range of a few μm, so a constant temperature of the mask is beneficial to reduce movement of the mask structures due to heat. I want to be Additionally, cooling the surface of the shield 110 may facilitate condensation of evaporated material on the shield.

The cooling device may include at least one or more of cooling conduits, cooling lines or channels coupled to the shield, fluid cooling such as water cooling, gas cooling such as air cooling, and/or thermoelectric cooling. In some embodiments, the cooling device includes a cooling circuit that includes cooling conduits within the frame of the shield and/or cooling conduits within the plate assembly of the shield. A cooling fluid, such as water, may be circulated within the cooling circuit.

In some embodiments, cooling conduits may be provided in the central shield portion 115 of the shield. The one or more steam outlets 125 may be directed into the center shield portion 115 in the idle position such that the center shield portion 115 can receive a majority of the heat load in the idle position. Shield 110 may further include one or more side shield portions 116 positioned adjacent central shield portion 115. One or more side shields 116 may be provided to shield evaporated material while the vapor source is moving to or past the idle position. The mask can prevent sprinkle coating while the vapor source is in motion because the one or more side shields 116 can block evaporated material while the vapor source is in motion. In some embodiments, two side shield portions 116 are provided on either side of center shield portion 115. The side shield portions 116 can be curved.

In some embodiments that can be combined with other embodiments described herein, the deposition system 100 moves the vapor source 120 along the vapor source transport path P (see FIG. 11) with the shield 110. a first drive device configured to cause the first drive device to move. For example, the vapor source transport path may extend past the deposition region where the substrate 10 is located. The vapor source 120 can be moved past the substrate 10 with the shield 110, for example at a substantially constant speed. For example, shield 110 and steam source 120 can be placed on a steam source support configured to be guided along a track, such as on a steam source cart. In some embodiments, the first drive device can be configured to move the steam source support following a trajectory along the steam source transport path P, and the steam source and the shield ie by a steam source cart. In some embodiments, the vapor source support can be transported along the track without contacting the track, such as by a magnetic levitation system. In particular, the first drive device may be configured to move the steam source linearly, ie in translation, along with the shield following a trajectory extending along the steam source transport path P.

If the shield 110 is movable with the vapor source 120 along the vapor source transport path P, the distance between the vapor source and the shield can be kept small or constant during the deposition process. For example, the maximum distance between the vapor source and the shield during deposition can be less than or equal to 0.5 m, in particular less than or equal to 0.2 m.

In some embodiments that can be combined with other embodiments described herein, the deposition system further includes a second drive for moving the vapor source 120 relative to the shield 110 to an idle position (I). may include. In other words, the first drive can be configured to move the steam source together with the shield, and the second drive can be configured to move the steam source relative to the shield. In the embodiment of FIGS. 1A and 1B, vapor source 120 is rotatable about axis of rotation A from a deposition position to an idle position relative to shield 110. For example, the vapor source can be rotated from the deposition position to the idle position by an angle of greater than or equal to 45° and less than or equal to 135°, particularly about 90°. Furthermore, the deposition source, such as a vapor source, can be rotated from a first deposition position to a second deposition position by an angle of greater than or equal to 170° and less than or equal to 190°, in particular about 180°. For example, the vapor source may be rotated, e.g., by rotating the vapor source toward the original deposition area, e.g., by an angle of about 90 degrees, or It can be moved from the idle position to the deposition position by rotating it by an angle of about 90°, for example, towards a possible second deposition area.

Rotation of the steam source may include any type of swinging or pivoting movement of the steam source that results in a change in direction of evaporation direction of one or more steam outlets. In particular, the axis of rotation may traverse the steam source, traverse the periphery of the steam source, or not traverse the steam source at all.

The axis of rotation A may be a substantially vertical axis of rotation. Steam source 120 may be rotatable about a substantially vertical axis of rotation between an idle position and a deposition position. In particular, steam source 120 may include one or more distribution pipes, each of which may extend substantially vertically. A plurality of steam outlets may be provided along the entire length of each distribution pipe, ie along a substantially vertical direction. A compact and space-saving deposition system can be provided. According to some embodiments, the axis of rotation can be vertical. Furthermore, additionally or alternatively, the one or more distribution pipes may be arranged in a substantially vertical direction, i.e. in a vertical direction, or at an angle of 15° or less, such as 7° or less, from a vertical orientation. It can extend in a direction that deviates only by a certain amount.

In some embodiments that can be combined with other embodiments described herein, the radially inner surface of the shield 110 can face the vapor source. In particular, shield 110 may include a curved portion that extends partially around the vapor source. For example, the shield may include two side shield portions 116 that may be curved and extend partially around the vapor source. In some embodiments, the shield portion may extend partially around the axis of rotation A of the steam source.

The curvature of the vapor shield can improve the shielding effectiveness of the shield while the shield 110 is rotating about the axis of rotation A. In particular, during rotation of the shield, the distance between the steam outlet or outlets and the surface of the shield may remain substantially constant.

In some embodiments, at least a portion of the shield is formed as part of a cylindrical surface extending around the steam source, in particular around the axis of rotation A of the steam source.

In some embodiments, the curved portion of the shield 110 may extend around the vapor source 120 by an angle of 60° or more, particularly 90° or more. Thus, the evaporated material can be substantially continuously shielded by the shield when the vapor source is rotated from the deposition position to the idle position by an angle of 60° or more, in particular 90° or more. Contamination of the vacuum processing chamber can be reduced and heat radiation to the vacuum processing chamber can be reduced.

In some embodiments that can be combined with other embodiments described herein, the distance D1 between the one or more steam outlets and the shield is 5 cm or more when the steam source is in the idle position. The length can be 30 cm or less. In detail, the distance D1 can be 5 cm or more and 10 cm or less. The shielding effectiveness of the shield 110 can be further improved by placing a small distance between the shield and the vapor outlet or outlets. Furthermore, because most of the heat load of the steam source is localized to a small portion of the shield in the idle position, smaller cooling devices can be used.

FIG. 2 is a perspective view of a shield 110 of a deposition system according to embodiments described herein. Since the shield 110 may be similar to the shield of the embodiment of FIG. 1A, reference may be made to the above description, which will not be repeated here. The embodiments described with reference to other figures may be equally applicable to the details forming further embodiments described with respect to FIG.

The shield 110 may be positioned adjacent to the steam source such that one or more steam outlets of the steam source are directed toward a surface of the shield when the steam source is in an idle position. A cooling device 112 may be provided for cooling at least a portion of the shield. For example, a central shield portion 115 of the shield or shield assembly may be cooled using a cooling device 112. The central shield portion 115 can be understood to be the portion of the shield toward which one or more steam outlets are directed when the steam source is in the idle position. In some embodiments, central shield portion 115 is the central portion of shield 110 or shield assembly, respectively.

The shield 110 can be curved and extend partially around the area where the vapor source is to be placed. In particular, the shield may include one or more curved portions. For example, the shield assembly of the shield may include a center shield portion 115 and two side shield portions 116 disposed adjacent to the center shield portion 115 on opposite sides of the center shield portion 115. The two lateral shield parts 116 can be curved around the area where the steam source is to be placed.

In some embodiments that may be combined with other embodiments described herein, the shield assembly may include a plurality of shield portions formed as sheet elements (eg, as metal sheets or tiles). For example, a shield or shield assembly can be coupled to a frame. The shield or shield assembly may include a first side shield portion, a second side shield portion, and a center shield portion between the first side shield portion and the second side shield portion.

For example, the shield may include a bottom shield portion 119 extending in a substantially horizontal orientation at a location below the one or more steam outlets and an upper portion extending in a substantially horizontal orientation at a location above the one or more steam outlets. a shield portion 118, a central shield portion 115 that can extend in a substantially vertical orientation in front of the one or more steam outlets when the steam source is in an idle position, a first side shield portion and a second side shield portion 115; and one or more side shield portions. Two side shield portions that may extend in a substantially vertical orientation on either side of the central shield portion 115.

In some embodiments, shield 110 may include frame 111. The sheet portion of shield 110 can be secured to frame 111. In particular, frame 111 may be configured to retain and support at least one of the center shield portion and/or the side shield portions. Frame 111 may be supported by a steam source support configured to support and transport the steam source along with the shield. At least a portion of the cooling conduit 113 may extend along the frame 111 of the shield 110. For example, cooling conduit 113 may be fixed to or integrated with support frame 111.

The sheet portion or tile of the shield can be configured as a consumable item. In other words, one or more of the tiles or the shield parts can be removably attached to the shield, in particular to the adjacent sheet parts and/or to the support frame 111 of the shield. For example, it may be beneficial to periodically replace and/or clean one or more of the sheet portions or tiles if a layer of coating material has formed on the surface of the sheet portion. For example, in some embodiments, center shield portion 115 can be removably secured to support frame 111 such that the center shield portion can be removed from the shield for cleaning. Similarly, the side shield portions can be separated from the shield for cleaning and/or replacement. Thus, rapid replacement of separate areas or parts of the shield may be possible without, for example, separating the support frame 111 from the steam source support. System downtime can be reduced.

Cooling device 112 may include one or more cooling lines or conduits 113 of cooling fluid for cooling central shield portion 115 and/or for cooling other sheet portions of the shield.

In some embodiments, the height of the shield 110 is 1 m or more, in particular 2 m or more. In particular, the height of the shield 110 can be greater than the vapor source 120, such that evaporated material from the vapor source can be shielded by the shield in the idle position. The steam source 120 may have a height of 1 m or more, in particular 1.5 m or more.

In some embodiments that can be combined with other embodiments described herein, the width W of the shield can be 50 cm or more, in particular 1 m or more. The width W may be the maximum dimension of the shield 110 in a horizontal direction (eg, oriented perpendicular to the orientation of the substrate 10 during deposition), as shown in FIGS. 1A and 1B. In some embodiments that can be combined with other embodiments described herein, the average radius of curvature of the shield can be 60 cm or more.

FIG. 3 is a schematic cross-sectional view of a portion of a deposition system according to embodiments described herein. Vapor source 120 is shown in an idle position in which vaporized material 15 is directed toward shield 110, and in particular toward central shield portion 115 of the shield. The central shield portion 115 can be cooled by a cooling device so that the temperature of the shield can be kept low and the heat radiation to the deposition area can be reduced.

As shown schematically in FIG. 3, two side shield portions 116 may be placed on either side of the central shield portion 115 and in close proximity to the central shield portion 115. The side shield portions can shield the evaporator 15 while the vapor source 120 is moving to and from the idle position. Specifically, the steam source may be rotated about the axis of rotation toward an idle position, and the shield may extend curvedly about the axis of rotation. Cooling conduits may be provided in the support frame of the shield. By providing the cooling conduits in the support frame, the seat portion can be replaced without having to replace the cooling conduits. Center shield portion 115 may be secured to a portion of support frame 111 that includes a portion of cooling conduit 113 .

FIG. 2 shows shield 110 having a shield assembly that includes tiles 410. FIG. Tile 410 may form central shield portion 115, for example. As shown in FIG. 2, the tiles may be elongated in the vertical direction, for example. For example, according to some embodiments that can be combined with other embodiments described herein, the tile width to height aspect ratio can be 1:5 or less. The tiles may extend along the entire length of each shield or vapor source 120. The elongated tiles allow portions of the shield assembly to be replaced in several pieces. For example, the center shield portion may include two or more, such as three or more, tiles forming the center shield portion. However, due to the weight of the tiles, replacing elongated tiles can be difficult.

According to some embodiments, which can be combined with other embodiments described herein, small tiles may be utilized. Therefore, easy tile replacement for maintenance can be achieved. According to some embodiments, which can be combined with other embodiments described herein, the tile width to height aspect ratio can be from 1:4 to 4:1.

FIG. 4A shows shield 110. FIG. Shield 110 includes a frame 111. The shield includes a shield assembly coupled to a frame. The shield assembly may include a first side shield portion 116, a second side shield portion (not shown in FIG. 4A), and a center shield portion 115. A portion of the shield assembly, particularly the center shield portion, may include a plurality of tiles 410. FIG. 4A further illustrates top shield portion 118 and hinge 420, which will be discussed in more detail with respect to FIG. The rear side of the shield may further include a plate assembly having a plate 550. For example, multiple plates may be provided, which may optionally correspond to multiple shields within the shield assembly.

A close-up view of tile 410 is shown in FIG. 4B. According to some embodiments, the tiles of the shield may include a tile body. The tiles can be configured to shield the deposition source material within the vacuum processing chamber. The tile body includes a first side, for example the side shown in FIG. 4B. The first side has a structured surface. Accordingly, material buildup from the deposition source can be improved and delamination of material from the tile can be reduced.

According to some embodiments, which can be combined with other embodiments described herein, the structured surface may include macrostructures 412. For example, the macrostructure may include a rolled structure, such as the diamond-shaped structure shown in FIG. 4B. Additionally or alternatively, the structured surface can include microstructures. The microstructures can be blasted structures or blasted surfaces. For example, a structured surface with microstructures can be sandblasted or have other particles attached to them. Microstructures can be formed on top of microstructures. By creating macro- and microstructures, material adhesion to the tiles can be further improved. Uptime of the deposition apparatus can be improved because the time between maintenance cycles can be increased. As described herein, a macrostructure can include a structure having a pattern in which the size of the patterned structures is 2 mm or more and/or the pitch of the patterned structures is 4 mm or more. A microstructure may include a structure having a pattern where the size of the patterned structure is 1 mm or less.

According to one embodiment, a tile is provided for shielding a deposition source in a vacuum processing chamber. This tile includes a tile body. The tile body has a first side of the tile body configured to face the deposition source and a second side of the tile body opposite the first side. The second side includes at least one recess for attaching the tile to the shield. The first side has a structured surface.

According to some embodiments, which can be combined with other embodiments, one or more tiles are provided adjacent to each other to form a shield assembly or a portion of a shield assembly, such as a center shield portion. I can do it. The first side has a structured surface as each of one or more edges (ie, as a peripheral edge). For example, the perimeter can have a rectangular shape or other polygonal shape. An edge can form a boundary between the first side and the side of the tile. For example, a rectangular tile may have a first side, a second side, a third side, and a fourth side. The side surface connects the first side and a second side opposite the first side. One or more edges of the first side can be radiused, according to some embodiments that can be combined with other embodiments described herein. For example, the edge can have a radius of 0.5 mm or more, in particular 1 mm or more. The rounded edges reduce delamination of material collected on the first side of the tile, ie, the tile with a structured surface.

Other aspects, details, modifications, and embodiments of tiles and shields are now described with respect to FIGS. 5A and 5B. FIG. 5A shows a tile 410. The tile has a first side 512 and a second side 514 opposite the first side. The first side is positioned to face the deposition source during operation of the deposition apparatus. The second side is positioned to attach the tile to the shield.

According to some embodiments, which can be combined with other embodiments, one or more tiles of the shield assembly can be attached to a frame (eg, frame 411 shown in FIG. 4A). Additionally or alternatively, tiles can be attached to plate 550 of the plate assembly. The plate (or corresponding frame) may include an opening 552. The opening may have the shape of a keyhole. The screw 562 and pin 564 can be coupled and extend at least partially through the opening 552. The keyhole shape of the opening allows screws and pins to be assembled from one side. The pin can be inserted into the larger portion of the keyhole-shaped opening and moved to lock the pin within the keyhole. Tile 410 may have one or more recesses in second side 514 of tile 410. The one or more recesses can be keyhole slots. Tiles can be attached to plate 550 by inserting one or more pins into one or more keyhole slots in the tile. Tile 410 can be secured to plate 550 by applying torque to one or more screws. In particular, four or more screws may be utilized to improve the connection of the tile to the water cooling component. Therefore, good thermal contact can be achieved. Therefore, the tile temperature can be brought below some predetermined temperature to improve material growth (eg, organic material growth) without delamination. Similar fixings can be made if the tile is additionally or alternatively attached to the frame.

According to some embodiments, which can be combined with other embodiments described herein, some tiles of a plurality of tiles included in a shield assembly are connected to a corresponding plate of a plate assembly. can be combined with At least one recess in the second side of the tile may be a keyhole slot. For example, at least one recess is one or more patterns of keyhole slots 522, such as the rectangular shape shown in FIG. 5B. In another optional modification, at least four keyhole slots are provided corresponding to the corners of the tile, and/or the spacing between two adjacent keyhole slots is 10 cm or less.

FIG. 6 illustrates another aspect of a tile embodiment that can be combined with other embodiments described herein. The tile shown in FIG. 6 may have a protrusion 622 and/or a recess 624 at the end of the tile. For example, one tile may have a protrusion on one end and a recess on the opposite end. Therefore, an overlapping portion can be provided between adjacent tiles. This overlap can reduce the amount of deposited material accidentally passing through gaps between adjacent tiles. According to one embodiment that can be combined with other embodiments described herein, the tile has a side surface of the tile body including a first side, a second side, a third side and a fourth side. the sides may connect a first side of the tile body and a second side of the tile body, and at least two sides are configured with a recess and such that the tile overlaps an adjacent tile. and at least one of the protrusions and the protrusions.

FIG. 7 shows a portion of the deposition apparatus. One side of vacuum chamber 702 is shown. A first substrate transport 712 is shown for transporting substrates in the deposition region. A second substrate can be provided for transporting a second substrate to another deposition region within the vacuum chamber. A source cart guide 722 is provided on the deposition device. The deposition source can be moved along the guide, for example using a first drive. For example, the deposition source can be moved from left to right in FIG. 7, and vice versa. The deposition source can be moved together with the shield 110.

According to one embodiment, a shield is provided that shields the material of the deposition source of the deposition apparatus with a vacuum chamber. The shield includes a frame 411 configured to be attached to a deposition device. For example, frame 411 can be attached to a vacuum chamber 702 of a deposition apparatus. A shield assembly is coupled to the frame. The shield assembly includes a first side shield section 116 and a second side shield section 116. The shield further includes a center shield portion between the first side shield portion and the second side shield portion, and the shield assembly is connected to the vacuum chamber 702 for shielding deposited material in the closed position of the shield assembly. Configured to be positioned between the wall 705 and the deposition source. The shield further includes a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in the open position of the shield assembly.

In FIG. 7, the center shield portion includes a first side 715A and a second side 715B. The center shield portion can open as a hinged door, for example, using the hinge shown in FIG. 4A. The door arrangement includes a hinge coupled to the center shield portion for moving a first side of the center shield portion an angle and for moving a second side of the center shield portion an angle. obtain.

Referring back to FIG. 6, adjacent tiles may also be provided with overlaps and recesses when the door arrangement is in the closed position. For example, a recess can be provided on the first side 715A and a protrusion can be provided on the second side 715B. Further, a protrusion may be provided on the first side surface 715A, and a recess may be provided on the second side surface 715B.

FIG. 8 shows yet another embodiment of a door arrangement. A door arrangement may also be provided by supporting a portion of the shield 110 or shield assembly on a guide rail. The shield or a portion of the shield can thus be moved by a sliding movement along the guide rail. Thus, in addition to or as an alternative to hinged door operation, sliding door operation may also be provided. By sliding and moving at least a portion of the shield, the source can be accessed for maintenance or the like. According to some embodiments, which can be combined with other embodiments described herein, the door arrangement slides at least a central portion of the shield assembly to allow access to the deposition source. may include guide rails for.

9A and 9B illustrate yet another aspect of an embodiment that can be combined with other embodiments described herein. FIG. 9A shows shield 110. FIG. The shield may include, for example, a frame 411 with several frame tubes. The lateral shield portions 116 of the shield assembly may be supported by a frame. Additionally, tiles 410 can be coupled to a frame or to a plate assembly supported by a frame. Cooling channels or conduits 113 may be provided. Cooling channels may extend into frame 411. Tiles coupled to frame 411 are cooled by contacting the frame. For example, the center tile 910 of the center shield portion can be cooled. Cooling the center can be advantageous as the idle position can be advantageously centrally provided. Therefore, the center tile is likely to experience the most heat load.

As explained above, the tiles can be elongated, for example along the height of the shield assembly. Heating of the central two, three or four tiles can additionally be carried out for organic evaporation, the heat load of which can be small compared to metal evaporation. Accordingly, the shield shown in FIG. 9A can be utilized in an organic deposition or vapor source and/or in a deposition apparatus for organic material deposition. The hinge of the door arrangement shown in FIG. 9B can also be presented in FIG. 9A.

In the case of metal deposition, for example, the cooling zone of the central shield part can be increased. This is illustrated in Figure 9B. Shield 110 includes a frame 411. A plate assembly with cooling channels is attached to frame 411. Multiple tiles can also be attached to the plate assembly, for example in close proximity to each other, or arranged vertically. Cooling channels 913 can be attached to or embedded in the plates of the plate assembly. The center shield portion 115 between the side shield portions 116 may be cooled. The increased heating area as well as the cooling conduits within the plate (ie, over the enlarged area) can improve cooling of the shield assembly. Therefore, higher thermal loads can be handled by the shield described with respect to FIG. 9B.

According to some embodiments, which can be combined with other embodiments described herein, providing a cooling unit for cooling at least a center shield portion, or a portion of a center shield portion, of a shield assembly. I can do it. The cooling unit includes at least one of a cooling conduit within the frame and a cooling conduit within the plate assembly of the shield assembly. Some tiles of the plurality of tiles may be coupled to corresponding plates of the plate assembly. The tiles may be cooled by contacting the frame portion and/or by contacting the plate assembly.

FIG. 10 is a schematic diagram of a deposition apparatus 1000 according to embodiments described herein. The deposition apparatus can be configured to sequentially deposit material onto multiple substrates within a vacuum chamber, such as vacuum processing chamber 101. According to one embodiment, a deposition apparatus is provided for sequentially processing multiple substrates within a vacuum chamber. The apparatus includes a first substrate processing position adjacent to a first sidewall of the vacuum chamber and a second substrate processing position adjacent to a second sidewall of the vacuum chamber, the second sidewall being adjacent to the first sidewall. facing the side wall. A deposition source is provided between the first substrate processing location and the second substrate processing location. The apparatus further includes a deposition source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position, and to deposit material onto the substrate at the first substrate processing position. An actuator configured to rotate the deposition source between a first direction for depositing and a second direction for depositing material on the substrate at a second substrate processing location. The deposition apparatus further includes a shield according to any of the embodiments of the present disclosure.

According to some embodiments, the shield can be attached to the source cart. Furthermore, additionally or alternatively, the door arrangement of the shield faces a third sidewall 1013 of the vacuum chamber connecting the first and second sidewalls. For example, the third sidewall is positioned to allow service access to the shield in the closed position of the door arrangement and to allow service access to the deposition source in the open position of the door arrangement. Ru.

FIG. 10 shows a deposition apparatus 1000. The deposition apparatus includes a vacuum processing chamber 101 having at least one deposition region for placing a substrate. A pressure below atmospheric pressure, for example below 10 mbar, can be provided within the vacuum processing chamber. A deposition apparatus 100 according to embodiments described herein is placed within a vacuum processing chamber 101 .

In the exemplary embodiment of FIG. 10, there are two deposition regions within the vacuum processing chamber 101, a first deposition region 103 for locating the substrate 10 to be coated, and a second deposition region 103 for locating the substrate 10 to be coated. 20 is provided. Additionally, a deposition system 100 according to any of the embodiments described herein is disposed within a vacuum processing chamber 101. The first deposition region 103 and the second deposition region 104 may be provided on opposite sides of the deposition system 100.

In some embodiments, the deposition system 100 includes a vapor source 120 with one or more distribution pipes having one or more vapor outlets for directing a plume of evaporated material toward the substrate. Additionally, deposition system 100 includes a shield 110 and a cooling device 112 for cooling shield 110. Steam source 120 can be moved from the deposition position shown in FIG. 10 to an idle position where one or more steam outlets are directed toward shield 110. At the deposition location, one or more vapor outlets are directed to the first deposition region or the second deposition region.

In some embodiments that can be combined with other embodiments described herein, the vapor source 120 is movable past the first deposition region 103 and the first deposition region 103 and the second is rotatable between two deposition regions 104 and is movable past a second deposition region 104 . The idle position may be an intermediate rotational position of the vapor source 120 between the first deposition region 103 and the second deposition region 104. In particular, the steam source may be rotated by approximately 90°, eg, clockwise, from the (first) deposition position shown in FIG. 10 to the idle position. The vapor source is rotated from the idle position to the second deposition position by about 90° in the same direction, e.g. clockwise, to direct the vaporized material to a second deposition region 104 where a second substrate 20 can be placed. I can do it. Alternatively, the vapor source can be rotated from the second deposition region 104 to the idle position, and/or vice versa, eg, counterclockwise, from the idle position to the (first) deposition position.

Steam source 120 may be movable along a steam source transport path P, which may be a linear path. In particular, a first A drive device can be provided.

In some embodiments, shield 110 and steam source 120 may be supported on a steam source support 128 movable along steam source track 131 within vacuum processing chamber 101, such as on a steam source cart. . An example of a vapor source support 128 holding a vapor source 120 and shield 110 is shown in FIG. The steam source support 128 can be driven contactlessly along the steam source trajectory 131, for example by a magnetic levitation system.

As shown in more detail in the cross-sectional view of FIG. 11, the steam source 120 may include one or more distribution pipes 122 that may extend substantially vertically. Each distribution pipe of the one or more distribution pipes 122 may be in fluid communication with a crucible 126 configured to vaporize material. Additionally, each distribution pipe of the one or more distribution pipes may include a plurality of steam outlets 125, such as nozzles, disposed along the length of the one or more distribution pipes 122. For example, ten or more steam outlets may be provided along the entire length of the distribution pipe, for example in a substantially vertical direction. The shield 110 may extend at least partially around one or more distribution pipes of the vapor source. For example, the shield may surround one or more distribution pipes 122 by an angle of 45 degrees or more, particularly by an angle of 60 degrees or more, and more particularly by an angle of 90 degrees or more. In some embodiments, the opening angle of the plume of evaporated material extending from the vapor outlet in the plane of horizontal cross-section may be between 30° and 60°, in particular about 45°.

FIG. 11 shows the deposition system in an idle position with multiple vapor outlets 125 directed toward shield 110. The surface of shield 110 may be cooled using cooling device 112. Thermal radiation toward the vapor source 120 and toward the deposition region may be reduced.

As shown in more detail in FIG. 10, the deposition apparatus 1000 coats a substrate 10 located in a first deposition region 103 and then coats a second substrate 10 located in a second deposition region 104. It can be configured to coat 20. As the steam source 120 moves between these deposition regions, the steam source 120 can be stopped in an idle position with one or more steam outlets directed to the cooling shield. For example, the vapor source 120 may be shut down for at least one of inspection, maintenance, cleaning, standby, and substrate or mask alignment. Alternatively, the vapor source moves continuously between deposition zones rather than stopping at an idle position.

Deposition apparatus 1000 can be configured for mask deposition of one or more substrates. A mask 11 can be arranged in a first deposition region 103 in front of the substrate 10 and/or a second mask 21 can be arranged in a second deposition region 104 in front of the second substrate 20. can.

In some embodiments, which can be combined with other embodiments described herein, the shielding arrangement 12 is located at the periphery of the mask 11, e.g., in the vapor source transport path, as shown in FIG. They may be placed adjacent to both sides of the mask 11 in the P direction. In some embodiments, shielding structure 12 can frame mask 11. The shielding arrangement may include a plurality of shielding units that can be attached to a mask carrier holding the mask 11. For example, the shielding structure 12 can be removably attached to the periphery of the mask so that it can be easily and quickly replaced, eg, for cleaning.

The shielding arrangement 12 may be configured to shield evaporated material directed from the one or more vapor outlets to the periphery of the mask 11. Coating of the mask carrier and/or walls of the vacuum processing chamber 101 can be reduced or avoided. For example, after deposition on the substrate 10, the evaporated material can be directed to a shielding arrangement 12, which can extend substantially parallel to the substrate 10, and a vapor source transport path P. can be placed adjacent to the mask 11 along. In the deposition position shown in FIG. 10, the evaporative material is directed toward the shielding structure 12. Thereafter, the vapor source 120 can be rotated toward an idle position and the vaporized material can be directed toward the shield 110. Cleaning effort may be reduced.

In some embodiments, the shielding structure 12 is disposed proximate the mask 11 in the first deposition region 103 and the second shielding structure 22 is disposed proximate the mask 11 in the second deposition region 104. located close to. For example, the second shielding arrangement 22 is disposed around the periphery of the second mask 21 and is configured to shield evaporated material directed toward the periphery of the second mask 21 . In particular, the shielding arrangement 12 can be arranged in the first deposition region 103 to shield evaporated material directed to the periphery of the mask 11 in the first deposition region 103; The structure 22 may be arranged in the second deposition region 104 to shield evaporated material directed to the periphery of the second mask 21 in the second deposition region 104 . A shield 110 can shield evaporated material while the vapor source is moving between deposition regions.

In some embodiments, the minimum distance between the shielding arrangement 12 and the shield 110 may be 10 cm or less, particularly 5 cm or less, more particularly 2 cm or less, and/or the second shielding The minimum distance between construct 22 and shield 110 may be less than or equal to 10 cm, particularly less than or equal to 5 cm, and more particularly less than or equal to 2 cm. Sprinkle coating past each shielding surface of the shield and shielding arrangement at the transition between the shield and the shielding arrangement can be reduced or avoided. In particular, the shield may extend over 50% or more, in particular over 80%, of the width of the vacuum processing chamber 101 between the mask 11 and the second mask 21.

In some embodiments that can be combined with other embodiments described herein, the minimum distance between the vapor source 120 and the shield 110 while the vapor source moves from the deposition position to the idle position is 5 cm or less; Specifically, it is 1 cm or less. In other words, steam source 120 and shield 110 may approach each other while the steam source is rotating to the idle position.

In some embodiments, which can be combined with other embodiments described herein, the distance between the one or more vapor outlets during deposition on the substrate and the substrate is 30 cm or less, in particular 20 cm. Hereinafter, in more detail, it can be set to 15 cm or less. A small distance between the vapor outlet and the substrate results in a small protrusion of evaporated material in the edge region of the mask 11 during deposition. Therefore, the area of the evaporation plume that impinges on the mask and substrate can be reduced, resulting in a smaller shielding arrangement. Furthermore, the deposition quality can be improved.

In accordance with other aspects described herein, a method of operating a deposition system is described. The deposition system may be a deposition system according to any of the embodiments described herein. In particular, the deposition system includes a steam source having one or more steam outlets, the steam source being movable to an idle position.

FIG. 12 is a flow diagram schematically illustrating a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber and/or a method of accessing a deposition source of a deposition apparatus having a vacuum chamber. In operation 710, a recess in the tile is guided over a pin coupled to a screw. Additionally, the tiles are secured to the plate assembly or frame by applying torque to the screws. One or more tiles can be secured to the shield to form a shield assembly having side shield sections and a center shield section between the side shield sections. For example, the tile can be attached to the door arrangement of the shield assembly at an open location.

A shield assembly is positioned between the wall of the vacuum chamber and the deposition source to shield deposition material in the closed position of the door arrangement. At operation 720, a door may be closed, for example, when the deposition source is placed in an idle position or moved past an idle position, to retain material to be deposited on the wall during operation. At operation 730, the door may be opened to access the deposition source and/or tiles of the shield assembly for maintenance.

In light of the above, multiple embodiments are presented below that can be combined with other embodiments described herein.

Embodiment 1. A shielding tile configured to shield material from a deposition source in a vacuum processing chamber, the shielding tile comprising: a tile body; a first side of the tile body configured to face the deposition source; a second side of the tile body opposite the first side, the second side including at least one recess for attaching the tile to the shield, the first side being structured; A tile with a surface.

Embodiment 2. The tile of embodiment 1, wherein the structured surface includes macrostructures and microstructures.

Embodiment 3. 3. The tile of embodiment 2, wherein the macrostructure comprises a rolled structure.

Embodiment 4. A tile according to embodiment 3, wherein the rolled structure is diamond-shaped.

Embodiment 5. The tile according to embodiment 2, wherein the microstructure is a blasted structure.

Embodiment 6. A tile according to any of embodiments 1 to 5, wherein there is no opening on the first side and the recess is closed towards the first side.

Embodiment 7. further comprising sides of the tile body, including a first side, a second side, a third side and a fourth side, the sides being the first side of the tile body and the second side of the tile body. 7. The tile of any of embodiments 1-6, wherein at least two sides include at least one of a recess and a protrusion configured such that the tile overlaps an adjacent tile.

Embodiment 8. 8. The tile according to any of embodiments 1-7, wherein at least one recess in the second side is a keyhole slot.

Embodiment 9. 9. The tile of embodiment 8, wherein the at least one recess is one or more patterns of keyhole slots.

Embodiment 10. The tile of embodiment 9, wherein the one or more patterns are rectangular.

Embodiment 11. The tile of any of embodiments 8-10, wherein at least four keyhole slots are provided corresponding to the corners of the tile.

Embodiment 12. The tile of any of embodiments 8-10, wherein the spacing between two adjacent keyhole slots is 18 cm or less.

Embodiment 13. The tile of any of embodiments 1-12, wherein the tile has an aspect ratio of width to height of 1:4 to 4:1.

Embodiment 14. The tile according to any one of embodiments 1 to 12, wherein the aspect ratio of the width and height of the tile is 1:5 or less.

Embodiment 15. The tile of any of embodiments 1-14, wherein the first side has one or more edges with a radius of 0.5 mm or more.

Embodiment 16. A shield for shielding material from a deposition source of a deposition apparatus having a vacuum chamber, the frame configured to be attached to the deposition apparatus, and a shield assembly coupled to the frame, the shield comprising: a first side shield; a shield assembly including a portion, a second side shield portion, and a center shield portion between the first side shield portion and the second side shield portion; The shield is further configured to be disposed between a wall of the vacuum chamber and the deposition source to shield the deposited material in the open position of the shield assembly to provide access to the deposition source in the open position of the shield assembly. A shield including a door arrangement configured to move at least a portion.

Embodiment 17. The door arrangement includes a hinge coupled to the center shield portion for moving a first side of the center shield portion an angle and for moving a second side of the center shield portion an angle. , the shield according to embodiment 16.

Embodiment 18. 18. The shield of embodiment 17, wherein the first side of the center shield portion and the second side of the center shield portion are configured to open as a hinged door.

Embodiment 19. 19. The shield of any of embodiments 16-18, wherein the door arrangement includes a guide rail for sliding at least the center shield portion of the shield assembly to provide access to the deposition source.

Embodiment 20. Embodiments further comprising a cooling unit for cooling at least a portion of a center shield portion of the shield assembly, the cooling unit including at least one of a cooling conduit in the frame and a cooling conduit in a plate assembly of the shield assembly. 20. The shield according to any one of 16 to 19.

Embodiment 21. The shield according to any of embodiments 16-19, wherein the shield assembly further comprises a plurality of tiles according to any of embodiments 1-15.

Embodiment 22. The shield of embodiment 20, wherein the shield assembly further includes a plurality of tiles as in any of embodiments 1-15.

Embodiment 23. 23. The shield according to any of embodiments 21-22, wherein the plurality of tiles are cooled by contacting the frame.

Embodiment 24. 23. The shield of embodiment 22, wherein some tiles of the plurality of tiles are coupled to corresponding plates of the plate assembly.

Embodiment 25. 25. The shield of embodiment 24, wherein the plurality of tiles are cooled by contacting the plate assembly.

Embodiment 26. The shield assembly further includes a top shield portion disposed at least partially over the first side shield portion, the second side shield portion, and the center shield portion, the top shield portion being substantially horizontally oriented. 26. The shield according to any of embodiments 16-25, including a top shield portion that is

Embodiment 27. A deposition apparatus for sequentially depositing a plurality of substrates within a vacuum chamber, the deposition apparatus comprising: a first substrate processing position adjacent a first sidewall of the vacuum chamber; and a second substrate processing position adjacent a second sidewall of the vacuum chamber. a second substrate processing position opposite the first sidewall; a deposition source between the first substrate processing position and the second substrate processing position; and a first substrate processing position. a deposition source cart configured to translate the deposition source between a substrate processing position and a first substrate processing position; and a first direction and a second substrate processing position for depositing material onto the substrate at the first substrate processing position. 27. A deposition apparatus comprising: an actuator configured to rotate a deposition source between a second direction and a second direction to deposit material onto a substrate;

Embodiment 28. 28. The deposition apparatus of embodiment 27, wherein the shield is attached to the deposition source cart.

Embodiment 29. 29. The deposition apparatus of any of embodiments 17-28, wherein the door arrangement of the shield faces a third sidewall of the vacuum chamber connecting the first and second sidewalls.

Embodiment 30. a third sidewall is arranged to allow maintenance access to the shield in the closed position of the door arrangement and to allow maintenance access to the deposition source in the open position of the door arrangement; The deposition apparatus according to embodiment 29.

Embodiment 31. A method of assembling a shield for shielding material from a deposition source of a deposition apparatus having a vacuum chamber, the method comprising: guiding a recess in a tile over a pin coupled to a screw; and applying a torque to the screw. , securing the tile to the plate assembly or frame.

Embodiment 32. 32. The method of embodiment 31, wherein the tiles are secured with four or more recesses using screws to obtain effective heat transfer.

Embodiment 33. A method of accessing a deposition source of a deposition apparatus having a vacuum chamber, the method comprising: opening a door arrangement of a shield assembly disposed between a wall of the vacuum chamber and the deposition source; and depositing material in a closed position of the door arrangement. A method comprising the step of shielding.

Although the foregoing is directed to embodiments of the present disclosure, other further embodiments of the present disclosure may be devised without departing from the essential scope of the present disclosure, and the scope of the present disclosure is Determined by the claims.

Claims (14)

A shield for shielding material in a deposition source of a deposition apparatus having a vacuum chamber, the shield comprising:
a frame configured to be attached to the deposition device;
a shield assembly coupled to the frame, the shield assembly comprising:
a first side shield portion;
a shield assembly comprising: a second side shield portion; and a center shield portion between the first side shield portion and the second side shield portion;
the shield further comprising a door arrangement;
the shield assembly is configured to be disposed between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the door arrangement ;
The shield , wherein the door arrangement is configured to move at least a portion of the shield assembly to allow maintenance access to the deposition source in an open position of the door arrangement . The door structure includes:
A hinge coupled to the center shield portion for moving a first side of the center shield portion an angle and for moving a second side of the center shield portion an angle. The shield described in item 1. 3. The shield of claim 2, wherein the first side of the center shield portion and the second side of the center shield portion are configured to open as a hinged door. The door structure includes:
The shield of claim 1, comprising a guide rail for sliding at least the center shield portion of the shield assembly to allow maintenance access to the deposition source. A cooling unit for cooling at least a portion of the center shield portion of the shield assembly, the cooling unit comprising:
a cooling conduit within the frame;
A shield according to any preceding claim, further comprising a cooling unit including at least one of a cooling conduit in a plate assembly of the shield assembly. A shield according to any preceding claim, comprising a plurality of tiles cooled by contacting the frame. 6. The shield of claim 5, wherein some tiles of the plurality of tiles are coupled to corresponding plates of the plate assembly. 8. The shield of claim 7, wherein some tiles of the plurality of tiles are cooled by contacting the plate assembly. The shield assembly further includes:
an upper shield portion disposed at least partially over the first side shield portion, the second side shield portion, and the center shield portion, the upper shield portion being substantially horizontally oriented; The shield according to any one of claims 1 to 4, comprising an upper shield portion that includes an upper shield portion. A deposition apparatus for successively depositing a plurality of substrates in a vacuum chamber, the deposition apparatus comprising:
a first substrate processing location adjacent to a first sidewall of the vacuum chamber;
a second substrate processing position adjacent to a second sidewall of the vacuum chamber and opposite the first sidewall;
a deposition source between the first substrate processing location and the second substrate processing location;
a deposition source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position;
rotating the deposition source between a first direction for depositing material on a substrate at the first substrate processing position and a second direction for depositing material on the substrate at the second substrate processing position; an actuator configured to;
A deposition apparatus comprising a shield according to any one of claims 1 to 4. 11. The deposition apparatus of claim 10 , wherein the shield is attached to the source cart. 11. The deposition apparatus of claim 10 , wherein the door arrangement of the shield faces a third sidewall of the vacuum chamber connecting the first and second sidewalls. The third sidewall is configured to allow maintenance access to the shield in the closed position of the door arrangement and to allow maintenance access to the deposition source in the open position of the door arrangement. 13. The deposition apparatus according to claim 12 , wherein the deposition apparatus is arranged as follows. 1. A method of accessing a deposition source of a deposition apparatus having a vacuum chamber, the method comprising:
a shield assembly with a door arrangement configured to be disposed between a wall of the vacuum chamber and the deposition source;
The method includes:
shielding deposited material in the closed position of the door arrangement;
A method comprising opening the door arrangement of the shield assembly to allow maintenance access to the deposition source .

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