CN211814626U

CN211814626U - Tile for a protective cover, protective cover and deposition apparatus

Info

Publication number: CN211814626U
Application number: CN201921823091.3U
Authority: CN
Inventors: 贝克尔·雷蒙; 里斯·弗洛里安
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2019-10-28
Filing date: 2019-10-28
Publication date: 2020-10-30
Anticipated expiration: 2029-10-28

Abstract

A tile for a shield, a shield and a deposition apparatus are described, wherein the shield is configured to shield a material of a deposition source in a vacuum processing chamber. The tile includes a tile body; a first side of the tile body configured to face the deposition source; a second side of the tile body opposite the first side, the second side having at least one groove for mounting the tile to the protective enclosure, wherein the first side has a structured surface.

Description

Tile for a protective cover, protective cover and deposition apparatus

Technical Field

The present disclosure relates to a shield for a deposition system and to a deposition system configured for depositing an evaporation material, in particular an organic evaporation material, on one or more substrates. Embodiments of the present disclosure also relate to an idle (idle) shield configured to shield, block and/or collect vaporized material, for example, in an idle position of a deposition source. Embodiments of the present disclosure also relate to a deposition apparatus having a deposition system for depositing an evaporated material on a substrate. Further embodiments relate to a method of operating an evaporation source, a method of assembling a free shield and a method of operating a deposition system, in particular for depositing an evaporation material on a substrate in a vacuum processing chamber.

Background

Organic vaporizers are tools for producing Organic Light Emitting Diodes (OLEDs). An OLED is a special type of light emitting diode in which the light emitting layer comprises thin films of certain organic compounds. Organic Light Emitting Diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand held devices, for example for displaying information. OLEDs are also used for general space illumination. The range of color, brightness, and viewing angle of OLED displays may be greater than that of conventional LCD displays because the OLED pixels emit light directly without involving a backlight. Therefore, the power consumption of the OLED display is much lower than that of the conventional LCD display. Furthermore, the fact that OLEDs can be manufactured onto flexible substrates leads to further applications.

Typically, the vaporized material is directed toward the substrate through one or more outlets of a vapor source. For example, the vapor source may be provided with a plurality of nozzles configured to direct a fly-away (plume) of vaporized material toward the substrate. The vapor source is movable relative to the substrate for coating the substrate with the vaporized material.

A steady drift of evaporated material from one or more vapor outlets of a vapor source may be beneficial in order to deposit a pattern of material with a predetermined uniformity on a substrate. After the vapor source is started, it may take some time for the vapor source to stabilize. Therefore, frequent shut down and start up of the vapor source may not be desired, and the vapor source may also remain operational during idle periods. During such idle periods, there may be a risk that the walls of the vacuum processing chamber may be coated ("sprinkled") with evaporated material.

Furthermore, it may be beneficial to deposit the various substrates sequentially, i.e., without unnecessary evaporation pauses between the processing of subsequent substrates. For example, the evaporation source may be rotated to switch between substrate processing in a first deposition area and a second deposition area opposite the first deposition area. The walls of the vacuum processing chamber may also be coated with evaporated material during the rotation from the first deposition zone to the second deposition zone.

Accordingly, it would be beneficial to provide a deposition apparatus, and deposition system configured to deposit an evaporative material on a substrate in a precise manner with a vacant shield while reducing the spread on the surface of the apparatus or system.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is provided a tile (tile) for a shield configured to shield a material, a shield configured to shield a material of a deposition source, and a deposition apparatus for sequential (subsquently) deposition of substrates in a vacuum chamber. Further advantages, features, aspects and details are apparent from the claimed scope, description and drawings.

According to one embodiment, a tile for a shield configured to shield a material of a deposition source in a vacuum processing chamber is provided. The tile includes: a tile body; a first side of the tile body configured to face the deposition source; a second side of the tile body opposite the first side, the second side having at least one recess for mounting the tile to the shield, wherein the first side has a structured surface.

According to some embodiments, the structured surface may comprise macro-structures and micro-structures. Therefore, peeling of the material can be reduced.

The macrostructures can include milled (milled) structures. For example, the milled structure may be diamond shaped (diamondshaped).

The microstructure may be a blasted (blasted) structure.

According to some embodiments, which can be combined with other embodiments described herein, the first side is free of openings and wherein the groove is closed towards the first side.

According to some embodiments, which may be combined with other embodiments described herein, the tile may further comprise a side surface of the tile body, the side surface comprising a first side surface, a second side surface, a third side surface, and a fourth side surface, the side surface connecting the first side portion of the tile body and the second side portion of the tile body, wherein at least two side surfaces comprise at least one of a groove and a protrusion configured for overlapping the tile with an adjacent tile.

According to some embodiments, which can be combined with other embodiments described herein, the at least one groove of the second side portion can be a keyhole slot. For example, the at least one groove is one or more patterns of keyhole slots. The one or more patterns may be rectangular. According to some embodiments, which can be combined with other embodiments described herein, at least 4 keyhole slots corresponding to corners of a tile can be provided. Further, additionally or alternatively, the distance of two adjacent keyhole slots is 18cm or less. Thus, the keyhole slot may be used to bring the tile into good thermal contact with the shield.

According to some embodiments, which can be combined with other embodiments described herein, the aspect ratio of the width and height of the tiles can be 1:4 to 4:1, or the aspect ratio of the width and height of the tiles can be 1:5 or lower.

According to some embodiments, which can be combined with other embodiments described herein, the first side has one or more edges having a radius of 0.5mm or more.

According to one embodiment, a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber is provided. The protection casing includes: a frame configured to be mounted to the deposition apparatus; a shield assembly coupled to the frame, the shield assembly comprising: a first side shield portion; a second side shield portion; and a central shield portion between the first side shield portion and the second side shield portion, the shield assembly being configured to be disposed between a wall of a vacuum chamber and the deposition source to shield deposition material when the shield assembly is in a closed position; the protective cover further comprises: a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly; and a plurality of tiles according to embodiments described herein.

According to some embodiments, which can be combined with other embodiments described herein, the door arrangement can comprise a hinge coupled to the central hood portion to move a first side of the central hood portion by an angle and to move a second side of the central hood portion by an angle. For example, the first side of the central hood portion and the second side of the central hood portion may be configured to open as a hinged door.

According to some embodiments, which can be combined with other embodiments described herein, the door arrangement can comprise a guide rail for sliding at least the central shield portion of the shield assembly to allow access to the deposition source.

According to some embodiments, which can be combined with other embodiments described herein, the shield can further comprise a cooling unit for cooling at least a portion of the central shield portion of the shield assembly, the cooling unit comprising: at least one of the following catheters: a cooling conduit in the frame; and cooling conduits in the plate assembly of the shield assembly.

According to some embodiments, which can be combined with other embodiments described herein, the tiles of the plurality of tiles are coupled to corresponding plates of the plate assembly. In some embodiments, a tile of the plurality of tiles is cooled by contact with the plate assembly. In some embodiments, the plurality of tiles are cooled by contact with the frame.

According to some embodiments, which can be combined with other embodiments described herein, the protective cover assembly can further comprise: a top shield portion disposed at least partially over the first side shield portion, the second side shield portion, and the central shield portion, wherein the top shield portion is oriented substantially horizontally.

According to one embodiment, a deposition apparatus for sequentially depositing substrates in a vacuum chamber is provided. The deposition apparatus includes: a first substrate processing location adjacent a first sidewall of the vacuum chamber; a second substrate processing position adjacent a second sidewall of the vacuum chamber, the second sidewall being opposite the first sidewall; a deposition source between the first substrate processing position and the second substrate processing position; a source cart (source cart) configured for translating the deposition source between the first substrate processing position and the second substrate processing position; an actuator configured to rotate the deposition source between a first direction to deposit material on a substrate at the first substrate processing position and a second direction to deposit material on a substrate at the second substrate processing position; and a protective cover according to any embodiment described herein.

According to some embodiments, which can be combined with other embodiments described herein, the shield is mounted on the source cart. In some embodiments, the door arrangement of the protective cover faces a third side wall of the vacuum chamber, the third side wall connecting the first and second side walls. In some embodiments, the third side wall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to the deposition source in the open position of the door arrangement.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:

FIGS. 1A and 1B show schematic views of a deposition apparatus according to embodiments described herein in a deposition position (FIG. 1A) and in an idle position (FIG. 1B);

FIG. 2 shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

FIG. 3 shows a schematic cross-sectional view of a portion of a deposition apparatus according to embodiments described herein;

FIG. 4A shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

FIG. 4B shows an enlarged view of a tile of a shield cap for a deposition apparatus according to embodiments described herein;

FIGS. 5A and 5B show schematic views of a portion of a shield for a deposition apparatus according to embodiments described herein, and illustrating installation of shield tiles;

FIG. 6 shows a schematic view of a portion of a shield for a deposition apparatus according to an embodiment of the present disclosure;

fig. 7 shows a schematic view of a portion of a deposition apparatus according to an embodiment of the present disclosure, and the portion includes a shield, e.g., a spare shield, according to an embodiment of the present disclosure;

FIG. 8 shows a perspective view of a shield of a deposition apparatus according to embodiments described herein;

FIGS. 9A and 9B show schematic views of a shield for a deposition apparatus according to embodiments described herein;

FIG. 10 shows a schematic view of a deposition apparatus according to embodiments described herein;

FIG. 11 shows a schematic cross-sectional view of a deposition system according to embodiments described herein; and is

Fig. 12 is a flow chart illustrating a method of operating a deposition system according to embodiments described herein.

Detailed Description

Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals designate like parts. Hereinafter, differences with respect to the respective embodiments are described. Various examples are provided by way of explanation of the disclosure, and are not meant as limitations of the disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the present specification includes such modifications and variations.

Fig. 1A is a schematic view of a deposition system 100 according to embodiments described herein. The deposition system 100 includes a deposition source, such as a vapor source 120 having one or more vapor outlets 125. The vapor source 120 is in a deposition position (II) for coating the substrate 10. In this deposition position, the one or more vapor outlets are directed towards the deposition area where the substrate 10 is arranged.

Fig. 1B is a schematic view of the deposition system 100 of fig. 1A, with the vapor source 120 in an idle position (I). In the idle position, the one or more vapor outlets 125 are directed toward the shield 110.

The vapor source 120 can be movable from a deposition position (II) in which the one or more vapor outlets 125 are directed at the shield 110, to an idle position (I) in which the one or more vapor outlets 125 are directed at the deposition area, and/or can be movable from the idle position (I) to a deposition position (II) in which the one or more vapor outlets 125 are directed at the deposition area. For example, a deposition source, such as vapor source 120, may be moved through an angle. The deposition source may be rotated about axis a.

The deposition source or vapor source 120 may be configured as an evaporation source for depositing an evaporation material on the substrate 10 disposed in the deposition area. In some embodiments, the vapor source 120 includes one or more crucibles and one or more distribution tubes, wherein the one or more vapor outlets 125 may be disposed in each of the one or more distribution tubes. Each crucible may be fluidly connected with an associated distribution tube. The vaporized material may flow from the crucible into the associated distribution tube. When the deposition system is in the deposition position, the drift of vaporized material may be directed from the one or more vapor outlets of the distribution tube into the deposition area.

In fig. 1A, the vaporized material is directed from one or more vapor outlets 125 toward the substrate 10. A pattern of material may be formed on the substrate. In some embodiments, a mask (not shown) is disposed in front of the substrate 10, i.e., between the substrate 10 and the vapor source 120, during deposition. A pattern of material corresponding to the pattern of openings of the mask may be deposited on the substrate. In some embodiments, the evaporation material is an organic material. The mask may be a Fine Metal Mask (FMM) or another type of mask, such as an edge exclusion mask.

After or before deposition on the substrate 10, the vapor source 120 may be moved into an idle position (I) as exemplarily shown in fig. 1B. The movement of the vapor source 120 into the idle position (I) may be a relative movement between the vapor source 120 and the shield 110. In the idle position, the one or more vapor outlets are directed toward the surface of the shield 110.

In some implementations, the vapor source 120 is not deactivated while in the idle position and/or during movement to the idle position. Thus, when the vapor source is in the idle position (I), the vaporized material may be directed from the one or more vapor outlets 125 toward the shield 110 and condense on the surface of the shield. By continuing to evaporate also at idle positions (e.g., during idle times of the system), the vapor pressure in the vapor source can be kept substantially constant, and deposition can then continue without a vapor source stabilization time.

The shield 110 may be formed such that 80% or more, particularly 90% or more, more particularly 99% or more of the evaporated material from the one or more vapor outlets 125 is directed towards the surface of the shield 110 when the vapor source 120 is in the idle position (I). When the vapor source 120 is in an idle position, contamination of other surfaces in the vacuum processing chamber can be reduced or avoided because evaporation drift can occurIs blocked and masked by the shield 110. In particular, coating of the chamber walls, of devices arranged in the vacuum processing chamber, of the mask carrier and of the substrate carrier can be reduced or avoided. In some embodiments, the surface of the shield 110 may be large, such as 0.5m²Or more, in particular 1m²Or larger, more particularly 2m²Or larger, to ensure that most of the evaporated material condenses on the surface of the shield rather than on another surface in the idle position.

The vapor source 120 can be moved to an idle position (I) for at least one or more of the following purposes: (i) heating a source of vapor; (ii) stabilizing the vapor source, e.g., during heating, until a substantially constant vapor pressure is formed in the vapor source; (iii) servicing or maintaining the vapor source; (iv) turn off the vapor source, e.g., during cool down; (v) cleaning the vapour source, for example cleaning one or more vapour outlets and/or cleaning a styling (zaper) shield arranged in front of the vapour outlets; (vi) during mask and/or substrate alignment; (vii) during the waiting time and idle period. For example, the idle position may be used as a shutdown (park) position for the deposition system during idle periods of the system. In some embodiments, the vacuum processing chamber and/or the mask, which may be disposed in the deposition area, may be protected from being spilled, for example, by the shield 110 during movement of the vapor source to the idle position.

According to some embodiments, the deposition source or vapor source may be moved from the substrate 10 past an idle position (I) toward another substrate, as shown in more detail in fig. 10 and 11. Thus, the idle position may alternatively be used to prevent smearing from occurring during movement (i.e., rotation) of the deposition source (e.g., vapor source 120).

According to embodiments described herein, a cooling device 112 for cooling the shield 110 is provided. By lowering the temperature of the shield with the cooling device, the masking effect of the shield can be improved. Further, heat radiation from the shield toward the vapor source, toward the mask, and/or toward the substrate may be reduced by cooling the shield 110. Thermally induced movement can be reduced or avoided and deposition quality can be improved.

The evaporation material may have a temperature of several hundred degrees, such as 100 ℃ or more, 300 ℃ or more, or 500 ℃ or more. The thermal load may be particularly high for the evaporation of metallic materials compared to the evaporation of organic materials.

The shield 110 may heat up in the idle position as the vaporized material condenses on the surface of the shield. In some embodiments, the vapor source 120 may remain in an idle position for a significant period of time, such as tens of seconds for alignment or cleaning, or minutes for heating and maintenance of the vapor source. The temperature of the shield 110 can be reduced by the cooling device 112 and the heat radiation from the shield towards the vapor source and towards the mask can be reduced. For example, the temperature of the shield can be maintained at 100 ℃ or less. Since the thermal movement of the mask is reduced, the deposition quality can be improved. It should be noted that in some embodiments, the mask may have a structure in the range of a few microns, such that a constant temperature of the mask is beneficial for reducing thermally induced movement of the mask structure. In addition, by cooling the surface of the shield 110, condensation of the evaporation material on the shield can be promoted.

The cooling means may comprise at least one or more of the following: a cooling conduit, cooling line or cooling channel connected to the shield; fluid cooling structures, such as water cooling; gas cooling structures such as air cooling and/or thermoelectric cooling. In some embodiments, the cooling arrangement comprises a cooling circuit having cooling conduits in a frame of the shield and/or cooling conduits in a plate assembly of the shield. A cooling fluid, such as water, may be circulated in the cooling circuit.

In some embodiments, the cooling conduit may be disposed at the central shield portion 115 of the shield. The one or more vapor outlets 125 may be directed toward the central shroud portion 115 in the idle position so that the central shroud portion 115 may bear a majority of the thermal load in the idle position. The shield 110 may further include one or more side shield portions 116 disposed adjacent the central shield portion 115. One or more sideshield portions 116 may be provided for shielding evaporative material during movement of the vapor source into or past the idle position. The mask can be protected from smearing during movement of the vapor source because the one or more sideshield portions 116 can block vaporized material during movement of the vapor source. In some embodiments, two side shield portions 116 are disposed on two opposing sides of the central shield portion 115. The sideshield portion 116 may be curved.

In some embodiments, which can be combined with other embodiments described herein, the deposition system 100 can include a first drive configured to move the vapor source 120 along the source delivery path P with the shield 110 (see fig. 10). For example, the source conveyance path may extend through a deposition area in which the substrate 10 is disposed. The vapor source 120 can be moved with the shield 110 across the substrate 10, for example, at a substantially constant speed. For example, the shield 110 and the vapor source 120 can be disposed on a source support, such as on a source cart, that is configured to be guided along a track. In some embodiments, the first drive can be configured to move the source support along a track along the source transport path P, wherein the vapor source and the shield can be supported by the source support (i.e., the source cart). In some embodiments, the source support may be transported along the track without contacting the track, for example by a magnetic levitation system. In particular, the first drive can be configured to linearly move, i.e., translationally move, the vapor source with the shield along a track extending along the source transport path P.

When the shield 110 is movable along the source delivery path P with the vapor source 120, the distance between the vapor source and the shield can be kept small or constant during deposition. For example, the maximum distance between the vapor source and the shield can be 0.5m or less, in particular 0.2m or less, during deposition.

In some embodiments, which can be combined with other embodiments described herein, the deposition system can further include a second driver for moving the vapor source 120 to an idle position (I) relative to the shield 110. In other words, the first driver may be configured to move the vapor source with the shield, while the second driver may be configured to move the vapor source relative to the shield. In the embodiment of fig. 1A and 1B, the vapor source 120 is rotatable relative to the shield 110 about an axis of rotation a from a deposition position to an idle position. For example, the vapor source may be rotated from the deposition position to the idle position at an angle of 45 ° or more and 135 ° or less, particularly about 90 °. Furthermore, the deposition source, such as a vapor source, may be rotated from the first deposition position to the second deposition position at an angle of 170 ° or more and 190 ° or less, in particular about 180 °. The vapor source may be movable from an idle position to a deposition position, for example, by rotating the vapor source back towards the deposition area, for example, at an angle of about 90 °, or by rotating the vapor source towards a second deposition area where a second substrate may be disposed, for example, at an angle of about 90 °.

Rotation of the vapor source, which may include any type of oscillating or pivoting movement of the vapor source, causes a change in direction of evaporation of one or more of the vapor outlets. In particular, the axis of rotation may intersect the vapor source, may intersect the periphery of the vapor source, or may not intersect the vapor source at all.

The axis of rotation a may be a substantially vertical axis of rotation. The vapor source 120 can be rotatable about a substantially vertical axis of rotation between an idle position and a deposition position. In particular, the vapor source 120 may include one, two, or more distribution tubes, which may each extend in a substantially vertical direction. A plurality of vapour outlets may be provided along the length of each distribution pipe, i.e. in a substantially vertical direction. A compact and space-saving deposition system may be provided. According to some embodiments, the axis of rotation may be vertical. Furthermore, additionally or alternatively, the one or more distribution pipes may extend in a substantially vertical direction, i.e. a vertical direction or an angle deviating from a vertical orientation by 15 ° or less, such as 7 ° or less.

In some embodiments, which may be combined with other embodiments described herein, the radially inner surface of the shield 110 may be directed toward the vapor source. In particular, the shield 110 can include a curved portion that extends partially around the vapor source. For example, the shield may include two side shield portions 116, which two side shield portions 116 may be curved and may extend partially around the vapor source. In some embodiments, these portions of the shield can extend partially around the axis of rotation a of the vapor source.

Due to the curvature of the vapor shield, the shielding effect of the shield may be improved during rotation of the shield 110 about the rotation axis a. In particular, the distance between the one or more vapor outlets and the surface of the shield may remain substantially constant during rotation of the shield.

In some embodiments, at least a portion of the shield is shaped as a portion of a cylindrical surface extending around the vapor source, in particular around the axis of rotation a of the vapor source.

In some embodiments, the curved portion of the shield 110 can extend around the vapor source 120 by an angle of 60 ° or more, particularly 90 ° or more. Thus, the vaporized material can be substantially continuously masked by the shield when the vapor source is rotated from the deposition position to the idle position at an angle of 60 ° or more, particularly 90 ° or more. Contamination of the vacuum processing chamber can be reduced and heat radiation into the vacuum processing chamber can be reduced.

In some embodiments, which can be combined with other embodiments described herein, the distance D1 between the one or more vapor outlets and the shield can be 5cm or more and 30cm or less when the vapor source is in the idle position. In particular, the distance D1 may be 5cm or more and 10cm or less. The masking effect of the shield 110 may be further enhanced by providing a small distance between the shield and the one or more vapor outlets. Furthermore, a more compact cooling arrangement can be used, since the majority of the heat load of the vapour source is localized in a small portion of the shield in the idle position.

Fig. 2 is a perspective view of a shield 110 of a deposition system according to embodiments described herein. The shield 110 may be similar to the shield of the embodiment of fig. 1A, and thus reference may be made to the above description and will not be repeated herein. The embodiments described with reference to the other figures may equally be applied to the details described with respect to fig. 2, thus forming a further embodiment.

The shield 110 may be arranged adjacent to the vapor source such that one or more vapor outlets of the vapor source are directed towards a surface of the shield when the vapor source is in an idle position. A cooling device 112 may be provided to cool at least a portion of the shield. For example, the cooling device 112 may be used to cool a central shroud portion 115 of the shroud or shroud assembly. The central shield portion 115 can be understood as a shield portion to which one or more vapor outlets are directed when the vapor source is in an idle position. In some embodiments, the central shield portion 115 is a central portion of the shield 110 or shield assembly, respectively.

The shield 110 may be curved and may extend partially around the area where the source of vapour is to be arranged. In particular, the shield may comprise one or more curved portions. For example, the shield assembly of the shield may comprise a central shield portion 115 and two side shield portions 116, the two side shield portions 116 being arranged adjacent to the central shield portion 115 on two opposite sides of the central shield portion 115. The two sideshield portions 116 may be bent around the area where the vapor source is to be disposed.

In some embodiments, which can be combined with other embodiments described herein, the shield assembly can include a plurality of shield portions formed as sheet elements (e.g., metal sheets or tiles). For example, a hood or hood assembly may be coupled to the frame. The shield or shield assembly may include a first side shield portion, a second side shield portion, and a central shield portion between the first side shield portion and the second side shield portion.

For example, the shield may include one or more of the following: a bottom hood portion 119, the bottom hood portion 119 extending in a substantially horizontal orientation at a location below the one or more vapor outlets; a top shield portion 118, the top shield portion 118 extending in a substantially horizontal orientation at a location above the one or more vapor outlets; a central shield portion 115, the central shield portion 115 may extend in a substantially vertical orientation in front of the one or more vapor outlets when the vapor source is in an idle position; and a first side shield portion and a second side shield portion. The two side shield portions may extend in a substantially vertical orientation on two opposing sides of the central shield portion 115.

In some embodiments, the shield 110 may include a frame 111. The sheet portion of the shield 110 may be fixed to the frame 111. In particular, the frame 111 may be configured to hold and support at least one or more of the central cover portion and/or the side cover portions. The frame 111 may be supported on a source support configured to support and transport the vapor source along with the shield. At least a portion of the cooling conduit 113 may extend along the frame 111 of the shield 110. For example, the cooling conduit 113 may be fixed to or integrated in the support frame 111.

The sheet portion or tile of the protective cover may be configured as a consumable. In other words, one or more of the tiles or canopy sections may be removably mounted at the canopy, in particular to the adjacent sheet section and/or the support frame 111 of the canopy. It may be beneficial to periodically replace and/or clean one or more of the sheet portions or tiles, for example, when a layer of coating material is formed on the surface of the sheet portion. For example, in some embodiments, the central hood portion 115 may be removably secured to the support frame 111 such that the central hood portion may be removed from the hood for cleaning. Similarly, the side shield portions may be disconnected from the shield for cleaning and/or replacement. Accordingly, individual sections or portions of the shield can be quickly replaced, for example, without disconnecting the support frame 111 from the source support. The down time of the system can be reduced.

The cooling device 112 may include one or more cooling lines or conduits 113 for a cooling fluid to cool the central shroud portion 115 and/or to cool other sheet portions of the shroud.

In some embodiments, the height of the shield 110 is 1m or more, particularly 2m or more. In particular, the height of the shield 110 may be greater than the height of the vapor source 120 so that vaporized material from the vapor source may be shielded by the shield in an idle position. The height of the vapor source 120 can be 1m or greater, and particularly 1.5m or greater.

In some embodiments, which can be combined with other embodiments described herein, the width W of the shield can be 50cm or more, in particular 1m or more. The width W may be a maximum dimension of the shield 110 in a horizontal direction, for example, a direction perpendicular to an orientation of the substrate 10 during deposition, as shown in fig. 1A and 1B. In some embodiments, which can be combined with other embodiments described herein, the average radius of curvature of the shield can be 60cm or greater.

Fig. 3 is a schematic cross-sectional view of a portion of a deposition system according to embodiments described herein. The vapor source 120 is shown in an idle position in which the vaporized material 15 is directed toward the shield 110, particularly toward the central shield portion 115 of the shield. The central shield portion 115 may be cooled by a cooling device so that the temperature of the shield can be kept low and the heat radiation into the deposition area can be reduced.

As schematically depicted in fig. 3, two side shield portions 116 may be arranged next to the central shield portion 115 on both sides of the central shield portion 115. The sideshield portions may shield the evaporative material 15 during movement of the vapor source 120 into and out of the idle position. In particular, the vapor source can be rotated about the axis of rotation into an idle position, and the shield can extend in a curved manner about the axis of rotation. The cooling duct may be provided at the support frame of the shield. By providing the cooling duct at the support frame, the sheet portion can be replaced without replacing the cooling duct. The central shroud portion 115 may be secured to a portion of the support frame 111 that includes a portion of the cooling conduit 113.

Fig. 2 shows a shield 110, the shield 110 having a shield assembly with tiles 410. The tiles 410 may, for example, form the central shroud portion 115. As shown in fig. 2, the tiles may be, for example, vertically elongated. For example, according to some embodiments, which can be combined with other embodiments described herein, the aspect ratio of the width and height of the tiles can be 1:5 or lower. The tiles may extend along the height of the shield or vapor source 120, respectively. Having elongated tiles allows for replacement of a portion of the protective cover assembly in several pieces. For example, the central cover portion may comprise two or more tiles, for example three or more tiles, thereby forming the central cover portion. However, due to the weight of the tiles, it may be difficult to replace the elongated tiles.

According to some embodiments, which can be combined with other embodiments described herein, smaller tiles can be utilized. Thus, replacement of the tiles for easier maintenance may be provided. According to some embodiments, which can be combined with other embodiments described herein, the aspect ratio of the width and height of the tiles can be 1:4 to 4: 1.

Fig. 4A shows the shield 110. The shield 110 includes a frame 111. The hood includes a hood assembly coupled to the frame. The shield assembly may include a first side shield portion 116, a second side shield portion (not shown in fig. 4A), and a central shield portion 115. Portions of the shroud assembly, particularly the central shroud portion, may include a plurality of tiles 410. Fig. 4A further illustrates the top shield portion 118 and the hinge 420 discussed in more detail with respect to fig. 5. The back side of the shield may also include a plate assembly having a plate 550. For example, a plurality of plates may be provided, which may optionally correspond to a plurality of shields in the shield assembly.

An enlarged view of the tile 410 is shown in FIG. 4B. According to some embodiments, a tile for a protective enclosure may include a tile body. The tiles may be configured to shield material of a deposition source in a vacuum processing chamber. The tile body includes a first side, such as the side shown in FIG. 4B. The first side has a structured surface. Thus, the accumulation of material from the deposition source may be improved and flaking of material from the tiles may be reduced.

According to some embodiments, which can be combined with other embodiments described herein, the structured surface can comprise macrostructures 412. For example, the macrostructures may include milled structures, such as diamond-shaped structures as shown in FIG. 4B. Additionally or alternatively, the structured surface may comprise microstructures. The microstructure may be a blasted structure or a blasted surface. For example, the structured surface with the microstructure can be sandblasted or painted with other particles (plaster). The microstructures may be formed on the microstructures. Providing both macrostructures and microstructures can further improve the adhesion of the material to the tile. The time between maintenance cycles can be increased and thus the uptime of the deposition apparatus can be improved. As described herein, a macrostructure can include a structure having a pattern with pattern features having a dimension of 2mm or greater and/or pattern features having a pitch of 4mm or greater. The microstructures may include structures having a pattern with pattern structures having a dimension of 1mm or less.

According to one embodiment, a tile for a shield that shields a material of a deposition source in a vacuum processing chamber is provided. The tile includes a tile body. The tile main body has: a first side of the tile body configured to face a deposition source; and a second side of the tile body opposite the first side. The second side includes at least one recess for mounting the tile to the shield. The first side has a structured surface.

According to some embodiments, which can be combined with other embodiments, one or more tiles can be disposed adjacent to each other to form a shield assembly or a portion of a shield assembly, such as a central shield portion. The first side has a structured surface that is one or more edges (i.e., perimeters), respectively. For example, the perimeter may have a rectangular shape or another polygonal shape. The edge may form a boundary between the first side and the side surface of the tile. For example, for a rectangular tile, there may be a first side surface, a second side surface, a third side surface, and a fourth side surface. The side surface combines a first side and a second side opposite the first side. According to some embodiments, which can be combined with other embodiments described herein, one or more edges of the first side portion can be rounded. For example, the radius of the edge may be 0.5mm or more, particularly 1mm or more. The rounded edges reduce flaking of material collected on the first side of the tile (i.e., the tile having the structured surface).

Other aspects, details, modifications and embodiments of the tiles and protective cover will now be described with reference to fig. 5A and 5B. Fig. 5A shows a tile 410. The tile has a first side 512 and a second side 514 opposite the first side. The first side portion is configured for facing the deposition source during operation of the deposition apparatus. The second side is configured for mounting the tile to the protective cover.

According to some embodiments, which can be combined with other embodiments, one or more tiles of the enclosure assembly can be mounted to a frame, such as frame 411 shown in fig. 4A. Additionally or alternatively, the tiles may be mounted to the plate 550 of the plate assembly. The plate (or corresponding frame) may include an opening 552. The opening may have a keyhole shape. The screw 562 and pin 564 may be coupled to reach at least partially through the opening 552. The keyhole shape of the opening allows assembling the screw and the pin from one side. The pin may be inserted into a larger portion of the keyhole shaped opening and may be moved to clamp the pin in the keyhole. The tile 410 may have one or more grooves at the second side 514 of the tile 410. One or more of the recesses may be keyhole slots. The tiles may be mounted to the plate 550 by inserting one or more pins into one or more keyhole slots of the tiles. Torque may be applied to one or more screws to secure the tile 410 to the plate 550. In particular, four or more screws may be utilized to improve the connection of the tiles to the water cooled component. Thus, good thermal contact can be provided. Thus, the temperature of the tiles may be set below some predetermined temperature to improve the growth of materials without peeling, such as the growth of organic materials. Similar fixings may be provided if the tiles are additionally or alternatively mounted to the frame.

According to some embodiments, which may be combined with other embodiments described herein, tiles of the plurality of tiles included in the protective cover assembly may be coupled to respective plates of the plate assembly. The at least one recess of the second side of the tile may be a keyhole slot. For example, at least one of the grooves is one or more patterns of keyhole slots 522, e.g., rectangular, as shown in FIG. 5B. As a further optional modification, at least four keyhole slots are provided corresponding to corners of the tile and/or the distance of two adjacent keyhole slots is 10cm or less.

FIG. 6 illustrates another aspect of an embodiment of a tile, which may be combined with other embodiments described herein. The shoe shown in fig. 6 may have at least one of a protrusion 622 and a recess 624 at the end of the shoe. For example, the tiles may have a male portion at one end and a female portion at the opposite end. Thus, an overlap between adjacent tiles may be provided. The overlap may reduce the chance of deposited material passing through the gap between adjacent tiles. According to one embodiment, which may be combined with other embodiments described herein, a tile may include side surfaces of a tile body, the side surfaces including a first side surface, a second side surface, a third side surface, and a fourth side surface, the side surfaces connecting a first side of the tile body and a second side of the tile body, wherein at least two of the side surfaces include at least one of a groove and a projection configured for overlapping the tile with an adjacent tile.

Fig. 7 shows a part of a deposition apparatus. One side of the vacuum chamber 702 is shown. A first substrate transporter 712 is shown for transporting substrates in the deposition area. A second substrate may be provided for transporting the second substrate in another deposition area in the vacuum chamber. A guide 722 for the source cart is provided in the deposition apparatus. The deposition source may be moved along the guide, for example, by a first drive. For example, the deposition source may be moved from left to right in FIG. 7, or vice versa. The deposition source may move together with the shield 110.

According to one embodiment, a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber is provided. The shield includes a frame 411 configured to be mounted to the deposition apparatus. For example, the frame 411 may be mounted to the vacuum chamber 702 of the deposition apparatus. The hood assembly is coupled to the frame. The shield assembly includes a first side shield portion 116 and a second side shield portion 116. The shield also includes a central shield portion between the first and second side shield portions, the shield assembly being configured to be disposed between the walls 705 of the vacuum chamber 702 and the deposition source to shield the deposition material in the closed position. The shield also includes a door arrangement configured for moving at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly.

In fig. 7, the central shield portion includes a first side 715A and a second side 715B. The central hood portion may be opened as a hinged door, for example, using the hinge shown in fig. 4A. The door arrangement may include a hinge coupled to the central hood portion to move a first side of the central hood portion through an angle and to move a second side of the central hood portion through an angle.

Returning to fig. 6, adjacent tiles may also be provided with overlaps and grooves when the door arrangement is in the closed position. For example, a groove may be provided on the first side 715A, and a protrusion may be provided on the second side 715B. Further, a convex portion may be provided on the first side portion 715A, and a concave portion may be provided on the second side portion 715B.

Fig. 8 shows a further embodiment of a door arrangement. The door arrangement may also be provided by supporting the shield 110 or a portion of the shield assembly on a guide rail. Thus, the shield or a part of the shield may be moved by a sliding movement along the guide rail. Thus, sliding door operation may be provided in addition to or instead of hinged door operation. By sliding and moving at least a portion of the shield, access to the deposition source may be provided for maintenance or the like. According to some embodiments, which can be combined with other embodiments described herein, the door arrangement can comprise a guide rail for sliding at least a central portion of the shield assembly to allow access to the deposition source.

Fig. 9A and 9B illustrate further aspects of embodiments that may be combined with other embodiments described herein. Fig. 9A shows the shield 110. The shield may comprise a frame 411 with e.g. several frame tubes. The side shield portions 116 of the shield assembly may be supported by the frame. Further, the tiles 410 may be coupled to the frame or a panel assembly supported by the frame. Cooling channels or ducts 113 may be provided. The cooling channel may extend into the frame 411. The tiles coupled to the frame 411 are cooled by contact with the frame. For example, the tiles 910 in the center of the center shield portion may be cooled. Cooling the center may be beneficial because it may be advantageous to provide a free location in the center. Thus, the center tile may be subjected to the greatest thermal load.

As noted above, the tiles may be elongated, for example, along the height of the protective cover assembly. Heating of two, three or four watts in the center may further be provided for organic evaporation, where the heat load may be smaller compared to metal evaporation. Thus, the shield shown in FIG. 9A can be used in an organic deposition source or vapor source and/or a deposition apparatus for organic material deposition. A hinge for a door arrangement as shown in figure 9B may also be provided for figure 9A.

For metal deposition, the cooling area may be increased, for example, at the central shield portion. This is exemplarily shown in fig. 9B. The shield 110 includes a frame 411. A plate assembly with cooling channels is attached to the frame 411. The plurality of tiles may be mounted to the plate assembly, for example adjacent to each other, or may also be arranged vertically. The cooling channels 913 may be attached to or embedded in the plates of the plate assembly. The central shroud portion 115 between the side shroud portions 116 may be cooled. The increased heating area in the plate and the cooling ducts, i.e. over an enlarged area, may improve the cooling of the shield assembly. Thus, as described with respect to fig. 9B, higher heat loads may be handled by the shield.

According to some embodiments, which can be combined with other embodiments described herein, a cooling unit for cooling at least a central shield portion or a portion of a central shield portion of a shield assembly can be provided. The cooling unit includes at least one of cooling ducts in the frame and cooling ducts in the plate assembly of the shield assembly. The tiles of the plurality of tiles may be coupled to respective plates of the plate assembly. The tiles may be cooled by contacting the frame portions and/or by contacting the plate assemblies.

Fig. 10 is a schematic view of a deposition apparatus 1000 according to embodiments described herein. The deposition apparatus may be configured to sequentially deposit materials on substrates in a vacuum chamber, such as vacuum processing chamber 101. According to one embodiment, a deposition apparatus for sequentially processing substrates in a vacuum chamber is provided. The apparatus includes a first substrate processing position adjacent a first sidewall of the vacuum chamber and a second substrate processing position adjacent a second sidewall of the vacuum chamber, the second sidewall being opposite the first sidewall. A deposition source is disposed between the first substrate processing position and the second substrate processing position. The apparatus further comprises: a source cart configured to translate a deposition source between a first substrate processing position and a second substrate processing position; and an actuator configured to rotate the deposition source between a first direction to deposit material on the substrate at the first substrate processing position and a second direction to deposit material on the substrate at the second substrate processing position. The deposition apparatus further comprises a shield according to any embodiment of the present disclosure.

According to some embodiments, the shield may be mounted on the source cart. Furthermore, additionally or alternatively, the door arrangement of the protective cover faces a third side wall 1013 of the vacuum chamber connecting the first and second side walls. For example, the third side wall is arranged to provide a service access to the shield in the closed position of the door arrangement and to provide a service access to the deposition source in the open position of the door arrangement.

Fig. 10 shows a deposition apparatus 1000. The deposition apparatus includes a vacuum processing chamber 101 having at least one deposition area for disposing a substrate. A sub-atmospheric pressure, for example a pressure of 10mbar or less, may be provided in the vacuum processing chamber. A deposition system 100 according to embodiments described herein is disposed in a vacuum processing chamber 101.

In the exemplary embodiment of fig. 10, two deposition areas, namely, a first deposition area 103 for arranging the substrate 10 to be coated and a second deposition area 104 for arranging the second substrate 20 to be coated, are provided in the vacuum processing chamber 101. Furthermore, a deposition system 100 according to any embodiment described herein is arranged in the vacuum processing chamber 101. The first deposition area 103 and the second deposition area 104 may be disposed on opposite sides of the deposition system 100.

In some embodiments, the deposition system 100 includes a vapor source 120 having one or more distribution tubes with one or more vapor outlets for directing a drift of vaporized material toward the substrate. In addition, the deposition system 100 includes a shield 110 and a cooling device 112 for cooling the shield 110. The vapor source 120 can be moved from the deposition position shown in fig. 10 to an idle position in which one or more vapor outlets are directed toward the shield 110. In the deposition position, the one or more vapor outlets are directed to the first deposition area or the second deposition area.

In some embodiments, which can be combined with other embodiments described herein, the vapor source 120 can be movable through the first deposition area 103, can be rotatable between the first deposition area 103 and the second deposition area 104, and can be movable through the second deposition area 104. The idle position may be an intermediate rotational position of the vapor source 120 between the first deposition area 103 and the second deposition area 104. In particular, the vapor source may be rotated about 90 ° from the (first) deposition position depicted in fig. 10, e.g., clockwise, to an idle position. The vapor source may be rotated in the same direction, e.g., clockwise, by about 90 deg. from the idle position to a second deposition position for directing the vaporized material toward a second deposition region 104, in which second deposition region 104 a second substrate 20 may be disposed. Alternatively, the vapor source may be rotated, for example, counter-clockwise, from the second deposition area 104 back to the idle position, and/or from the idle position to the (first) deposition position.

The vapor source 120 can be movable along a source delivery path P, which can be a straight path. In particular, a first drive may be provided to move the vapor source 120 along with the shield 110 along the source delivery path P through the first deposition region 103 and/or through the second deposition region 104.

In some embodiments, the shield 110 and the vapor source 120 can be supported on a source support 128, such as on a source cart, which source support 128 can be moved along a source track 131 in the vacuum processing chamber 101. An example of a source support 128 carrying the vapor source 120 and the shield 110 is shown in fig. 11. The source support 128 may be driven contactlessly along the source rail 131, for example by a magnetic levitation system.

As shown in more detail in the cross-sectional view of fig. 11, the vapor source 120 may include one, two, or more distribution tubes 122, and the distribution tubes 122 may extend in a substantially vertical direction. Each of the one, two, or more distribution tubes 122 may be fluidly connected to a crucible 126 configured to vaporize material. Further, each of the one, two or more distribution tubes may comprise a plurality of vapor outlets 125, e.g. nozzles, arranged along the length of the one, two or more distribution tubes 122. For example, ten, twenty or more vapour outlets may be provided along the length of the distribution pipe, for example in a substantially vertical direction. The shield 110 may extend at least partially around one, two or more distribution tubes of the vapor source. For example, the shield may surround one, two or more distribution pipes 122 at an angle of 45 ° or more, particularly 60 ° or more, more particularly 90 ° or more. In some embodiments, the opening angle of the evaporated material drift propagating from the vapour outlet in horizontal cross section may be between 30 ° and 60 °, in particular about 45 °.

FIG. 11 shows the deposition system in an idle position in which the plurality of vapor outlets 125 are directed toward the shield 110. The surface of the shield 110 may be cooled by a cooling device 112. The thermal radiation towards the vapour source 120 and towards the deposition area can be reduced.

As described in more detail in fig. 10, the deposition apparatus 1000 may be configured for sequentially coating the substrate 10 disposed in the first deposition area 103 and the second substrate 20 disposed in the second deposition area 104. As the vapor source 120 moves between deposition zones, the vapor source 120 can be stopped in an idle position in which one or more vapor outlets are directed at the cooled shield. For example, the vapor source 120 can be shut down for at least one of the following: repair, maintenance, clean, wait, align substrate or mask. Alternatively, the vapor source is continuously moved between deposition zones without stopping at an idle position.

The deposition apparatus 1000 may be configured for masked deposition on one or more substrates. The mask 11 may be disposed in a first deposition area 103 in front of the substrate 10, and/or the second mask 21 may be disposed in a second deposition area 104 in front of the second substrate 20.

In some embodiments, which may be combined with other embodiments described herein, the mask arrangement 12 may be arranged at the periphery of the mask 11, for example adjacent to two opposite sides of the mask 11 in the direction of the source conveying path P, as shown in fig. 10. In some embodiments, the mask arrangement 12 may surround the mask 11 in a frame-like manner. The mask arrangement may comprise a plurality of mask units, which may be attached to a mask carrier holding the mask 11. For example, the mask arrangement 12 may be detachably attached at the periphery of the mask, so as to be easily and quickly exchangeable, e.g. for cleaning.

The mask arrangement 12 may be configured to mask evaporated material directed from the one or more vapour outlets towards the periphery of the mask 11. Coating of the mask carrier and/or the walls of the vacuum processing chamber 101 can be reduced or avoided. For example, after deposition on the substrate 10, the evaporated material may be directed towards a mask arrangement 12, which may extend substantially parallel to the substrate 10 and may be arranged adjacent to the mask 11 along the source transport path P. In the deposition position shown in fig. 10, the evaporated material may be directed towards the mask arrangement 12. Thereafter, the vapor source 120 can be rotated toward the idle position and the vaporized material can be directed toward the shield 110. The cleaning work can be reduced.

In some embodiments, the mask arrangement 12 is arranged adjacent to the mask 11 in the first deposition area 103 and the second mask arrangement 22 is arranged adjacent to the second mask 21 in the second deposition area 104. For example, the second mask arrangement structure 22 is arranged at the periphery of the second mask 21, and is configured to mask the evaporation material directed to the periphery of the second mask 21. In particular, a mask arrangement 12 may be arranged in the first deposition area 103 for masking evaporated material guided in the first deposition area 103 to the periphery of the mask 11, and a second mask arrangement 22 may be arranged in the second deposition area 104 for masking evaporated material guided in the second deposition area 104 to the periphery of the second mask 21. The shield 110 may shield the vaporized material during movement of the vapor source between deposition regions.

In some embodiments, the minimum distance between the mask arrangement 12 and the shield 110 may be 10cm or less, particularly 5cm or less, more particularly 2cm or less, and/or the minimum distance between the second mask arrangement 22 and the shield 110 may be 10cm or less, particularly 5cm or less, more particularly 2cm or less. The smearing over the mask surface of the shield and the mask arrangement at the transition between the shield and the mask arrangement can be reduced or avoided. In particular, the shield may extend between the mask 11 and the second mask 21 over 50%, in particular over 80%, of the width of the vacuum processing chamber 101.

In some embodiments, which can be combined with other embodiments described herein, the minimum distance between the vapor source 120 and the shield 110 during movement of the vapor source from the deposition position to the idle position is 5cm or less, in particular 1cm or less. In other words, the vapor source 120 and the shield 110 can be brought into proximity with one another during rotation of the vapor source to the idle position.

In some embodiments, which can be combined with other embodiments described herein, the distance between the one or more vapor outlets and the substrate during deposition on the substrate can be 30cm or less, particularly 20 cm or less, more particularly 15cm or less. The small distance between the vapor outlet and the substrate results in a small overflow (overflow) of evaporated material in the edge area of the mask 11 during deposition. Thus, a more compact mask arrangement may be provided, as the area where the evaporated drift impinges on the mask and the substrate may be small. In addition, the deposition quality can be improved.

According to another aspect described herein, a method of operating a deposition system is described. The deposition system may be a deposition system according to any embodiment described herein. In particular, the deposition system includes a vapor source having one or more vapor outlets, wherein the vapor source is movable to an idle position.

Fig. 12 is a flow chart schematically illustrating a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber and/or a method of accessing a deposition source of a deposition apparatus having a vacuum chamber. In operation 710, a groove of a shoe is guided on a pin coupled to a screw. In addition, the tiles are secured to the panel assembly or frame by applying torque to the screws. One or more tiles may be secured to the hood and may form a hood assembly having side hood portions and a central hood portion between the side hood portions. For example, the tiles may be mounted in an open position of a door arrangement of the enclosure assembly.

A shield assembly is arranged between the wall of the vacuum chamber and the deposition source to shield the deposition material in the closed position of the door arrangement. In operation 720, for example, when the source is placed in or moved past an idle position, the door may be closed to keep material deposited on the wall during operation. In operation 730, the door may be opened to allow access to the deposition source and/or to the tiles of the shield assembly for maintenance.

In view of the above, there are provided multiple embodiments that can be combined with other embodiments described herein. The implementation mode is as follows:

embodiment 1. a tile for a shield configured to shield a material of a deposition source in a vacuum processing chamber, the tile comprising: a tile body; a first side of the tile body configured to face the deposition source; and a second side of the tile body opposite the first side, the second side having at least one groove for mounting the tile to the protective cover, wherein the first side has a structured surface.

Embodiment 2 the tile of embodiment 1, wherein the structured surface comprises a macro-structure and a micro-structure.

Embodiment 3 the tile of embodiment 2, wherein the macrostructures comprise milled structures.

Embodiment 4. the tile of embodiment 3, wherein the milled structure is diamond shaped.

Embodiment 5. the tile of embodiment 2, wherein the microstructure is a grit blasted structure.

Embodiment 6 the tile of any of embodiments 1-5, wherein the first side is not open and wherein the groove is closed toward the first side.

Embodiment 7. the tile of any of embodiments 1-6, further comprising: a side surface of a tile body, the side surface comprising a first side surface, a second side surface, a third side surface, and a fourth side surface, the side surface connecting the first side of the tile body and the second side of the tile body, wherein at least two side surfaces comprise at least one of a groove and a protrusion configured for overlapping the tile with an adjacent tile.

Embodiment 8 the tile of any of embodiments 1-7, wherein the at least one groove of the second side portion is a keyhole slot.

Embodiment 9 the tile of embodiment 8, wherein the at least one groove is one or more patterns of keyhole slots.

Embodiment 10 the tile of embodiment 9, wherein the one or more patterns are rectangular.

Embodiment 11 the tile of any of embodiments 8-10, wherein at least 4 keyhole slots are provided corresponding to corners of the tile.

Embodiment 12 the tile of any of embodiments 8-10, wherein the distance between two adjacent keyhole slots is 18cm or less.

Embodiment 13 the tile of any of embodiments 1-12, wherein the tile has an aspect ratio of width to height of 1:4 to 4: 1.

Embodiment 14 the tile of any of embodiments 1-12, wherein the aspect ratio of the width and height of the tile is 1:5 or less.

Embodiment 15 the tile of any of embodiments 1-14, wherein the first side has one or more edges having a radius of 0.5mm or greater.

Embodiment 16. a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, the shield comprising: a frame configured to be mounted to the deposition apparatus; a shroud assembly coupled to the frame, the shroud assembly comprising: a first side shield portion; a second side shield portion; and a central shield portion between the first side shield portion and the second side shield portion, the shield assembly being configured to be disposed between a wall of a vacuum chamber and the deposition source to shield deposition material when the shield assembly is in a closed position; the protective cover further comprises: a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly.

Embodiment 17 the protective cover of embodiment 16, wherein the door arrangement comprises: a hinge coupled to the central shield portion to move a first side of the central shield portion through an angle and to move a second side of the central shield portion through an angle.

Embodiment 18. the shield of embodiment 17, wherein the first side of the central shield portion and the second side of the central shield portion are configured to open as a hinged door.

Embodiment 19. the protective hood according to any of embodiments 16 to 18, wherein the door arrangement comprises: a guide rail for sliding at least the central shield portion of the shield assembly to allow access to the deposition source.

Embodiment 20 the protective cover of any of embodiments 16 to 19, further comprising: a cooling unit for cooling at least a portion of the central shroud portion of the shroud assembly, the cooling unit comprising: at least one of the following catheters: a cooling conduit in the frame; and cooling conduits in the plate assembly of the shield assembly.

Embodiment 21. the protective cover of any of embodiments 16 to 19, the protective cover assembly further comprising: a plurality of tiles according to any one of embodiments 1 to 15.

Embodiment 22. the protective cover of embodiment 20, the protective cover assembly further comprising: a plurality of tiles according to any one of embodiments 1 to 15.

Embodiment 23. the protective cover of any of embodiments 21 to 22, wherein the plurality of tiles are cooled by contact with the frame.

Embodiment 24 the protective cover of embodiment 22, wherein a tile of the plurality of tiles is coupled to a corresponding plate of the plate assembly.

Embodiment 25 the shield of embodiment 24, wherein the plurality of tiles are cooled by contact with the plate assembly.

Embodiment 26. the protective cover of any of embodiments 16 to 25, further comprising: a top shield portion disposed at least partially over the first side shield portion, the second side shield portion, and the central shield portion, wherein the top shield portion is oriented substantially horizontally.

Embodiment 27 a deposition apparatus for sequentially depositing substrates in a vacuum chamber, the deposition apparatus comprising: a first substrate processing location adjacent a first sidewall of the vacuum chamber; a second substrate processing position adjacent a second sidewall of the vacuum chamber, the second sidewall being opposite the first sidewall; a deposition source between the first substrate processing position and the second substrate processing position; a source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position; an actuator configured to rotate the deposition source between a first direction to deposit material on a substrate at the first substrate processing position and a second direction to deposit material on a substrate at the second substrate processing position; and a protective cover according to any one of embodiments 16 to 26.

Embodiment 28 the deposition apparatus of embodiment 27, wherein the shield is mounted on the source cart.

Embodiment 29 the deposition apparatus of any of embodiments 27 to 28, wherein the gate arrangement of the shield faces a third sidewall of the vacuum chamber, the third sidewall connecting the first and second sidewalls.

Embodiment 30. the deposition apparatus of embodiment 29, wherein the third sidewall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to provide maintenance access to the deposition source in the open position of the door arrangement.

Embodiment 31. a method of assembling a shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, the method comprising: a groove guiding the shoe over a pin coupled to the screw; and securing the tiles to a panel assembly or frame by applying torque to the screws.

Embodiment 32. the method of embodiment 31, wherein the tiles are screwed into 4 or more grooves for efficient heat conduction.

Embodiment 33. a method of accessing a deposition source of a deposition apparatus having a vacuum chamber, the method comprising: opening a door arrangement of a shield assembly arranged between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the door arrangement.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A tile for a shield configured to shield a material of a deposition source in a vacuum processing chamber, the tile comprising:

a tile body;

a first side of the tile body configured to face the deposition source; and

a second side of the tile body opposite the first side, the second side having at least one groove for mounting the tile to the protective enclosure,

wherein the first side has a structured surface.

2. The tile of claim 1, wherein the structured surface comprises a macrostructure and a microstructure.

3. The tile of claim 2, wherein the macrostructures comprise milled structures.

4. The tile of claim 3, wherein the milled structure is diamond shaped.

5. The tile of claim 2, wherein the microstructure is a grit blasted structure.

6. The tile of claim 3, wherein the microstructure is a grit blasted structure.

7. The tile according to any one of claims 1 to 6, wherein said first side portion is free of openings and wherein said groove is closed towards said first side portion.

8. The tile according to any one of claims 1 to 6, further comprising:

a side surface of a tile body, the side surface comprising a first side surface, a second side surface, a third side surface, and a fourth side surface, the side surface connecting the first side of the tile body and the second side of the tile body, wherein at least two side surfaces comprise at least one of a groove and a protrusion configured for overlapping the tile with an adjacent tile.

9. The tile of claim 7, further comprising:

10. The tile according to any one of claims 1 to 6, wherein said at least one groove of said second side portion is a keyhole groove.

11. The tile of claim 7, wherein the at least one groove of the second side portion is a keyhole groove.

12. The tile of claim 10, wherein the at least one groove is one or more patterns of keyhole slots.

13. The tile of claim 12, wherein the one or more patterns are rectangular.

14. The tile of claim 10, wherein at least 4 keyhole slots are provided corresponding to corners of the tile.

15. The tile of claim 10, wherein the distance between two adjacent keyhole slots is 18cm or less.

16. The tile of claim 14, wherein the distance between two adjacent keyhole slots is 18cm or less.

17. The tile of any one of claims 1 to 6, wherein the tile has an aspect ratio of width to height of 1:4 to 4: 1.

18. The tile of claim 7, wherein the aspect ratio of the width and height of the tile is 1:4 to 4: 1.

19. The tile of claim 8, wherein the aspect ratio of the width and height of the tile is 1:4 to 4: 1.

20. The tile of claim 10, wherein the tile has an aspect ratio of width to height of 1:4 to 4: 1.

21. The tile of any one of claims 1 to 6, wherein the tile has an aspect ratio of width to height of 1:5 or less.

22. The tile of any one of claims 1 to 6, wherein the first side has one or more edges having a radius of 0.5mm or greater.

23. The tile of claim 7, wherein the first side has one or more edges having a radius of 0.5mm or greater.

24. The tile of claim 8, wherein the first side has one or more edges having a radius of 0.5mm or greater.

25. The tile of claim 10, wherein the first side has one or more edges having a radius of 0.5mm or greater.

26. The tile of claim 17, wherein the first side has one or more edges having a radius of 0.5mm or greater.

27. A shield for shielding material of a deposition source of a deposition apparatus having a vacuum chamber, the shield comprising:

a frame configured to be mounted to the deposition apparatus;

a shroud assembly coupled to the frame, the shroud assembly comprising:

a first side shield portion;

a second side shield portion; and

a central shroud portion between the first side shroud portion and the second side shroud portion;

the shield assembly is configured to be disposed between a wall of the vacuum chamber and the deposition source to shield deposition material in a closed position of the shield assembly;

the protection casing still includes:

a door arrangement configured to move at least a portion of the shield assembly to allow access to the deposition source in an open position of the shield assembly; and

a plurality of tiles according to any one of claims 1 to 6.

28. The shield of claim 27, wherein the door arrangement comprises:

a hinge coupled to the central shield portion to move a first side of the central shield portion through an angle and to move a second side of the central shield portion through an angle.

29. The shield of claim 28 wherein the first side of the central shield portion and the second side of the central shield portion are configured to open as a hinged door.

30. The shield of any one of claims 27 to 29, wherein the door arrangement comprises:

a guide rail for sliding at least the central shield portion of the shield assembly to allow access to the deposition source.

31. The shield of any one of claims 27 to 29, further comprising:

a cooling unit for cooling at least a portion of the central shroud portion of the shroud assembly, the cooling unit comprising: at least one of the following conduits

A cooling conduit in the frame; and

cooling conduits in a plate assembly of the shield assembly.

32. The shield of claim 30, further comprising:

A cooling conduit in the frame; and

cooling conduits in a plate assembly of the shield assembly.

33. The shield of claim 31, wherein a tile of the plurality of tiles is coupled to a corresponding plate of the plate assembly.

34. The shield of claim 31 wherein the tiles of the plurality of tiles are cooled by contact with the plate assembly.

35. The shield of any one of claims 27 to 29 wherein the plurality of tiles are cooled by contact with the frame.

36. The shield of claim 30 wherein the plurality of tiles are cooled by contact with the frame.

37. The shield of claim 31 wherein the plurality of tiles are cooled by contact with the frame.

38. The shield of any one of claims 27 to 29 wherein the shield assembly further comprises:

a top shield portion disposed at least partially over the first side shield portion, the second side shield portion, and the central shield portion, wherein the top shield portion is oriented substantially horizontally.

39. The shield of claim 30, wherein the shield assembly further comprises:

40. The shield of claim 31 wherein the shield assembly further comprises:

41. A deposition apparatus for sequentially depositing substrates in a vacuum chamber, comprising:

a first substrate processing location adjacent a first sidewall of the vacuum chamber;

a second substrate processing position adjacent a second sidewall of the vacuum chamber, the second sidewall being opposite the first sidewall;

a deposition source between the first substrate processing position and the second substrate processing position;

a source cart configured to translate the deposition source between the first substrate processing position and the second substrate processing position;

an actuator configured to rotate the deposition source between a first direction to deposit material on a substrate at the first substrate processing position and a second direction to deposit material on a substrate at the second substrate processing position; and

the protective cover according to any one of claims 27 to 29.

42. The deposition apparatus of claim 41, wherein the shield is mounted on the source cart.

43. The deposition apparatus of claim 41, wherein the door arrangement of the shield faces a third sidewall of the vacuum chamber, the third sidewall connecting the first sidewall and the second sidewall.

44. The deposition apparatus of claim 42, wherein the door arrangement of the shield faces a third sidewall of the vacuum chamber, the third sidewall connecting the first sidewall and the second sidewall.

45. The deposition apparatus of claim 41, wherein the third side wall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to provide maintenance access to the deposition source in the open position of the door arrangement.

46. The deposition apparatus of claim 42, wherein the third sidewall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to the deposition source in the open position of the door arrangement.

47. The deposition apparatus of claim 43, wherein the third sidewall is arranged to provide maintenance access to the shield in the closed position of the door arrangement and to the deposition source in the open position of the door arrangement.