JP2008198500A - Manufacturing method and apparatus of organic el display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL display in which a position shift after positioning of a mask and a substrate is controlled and a pattern deposition of an organic compound layer of an organic light emitting element can be made in a high resolution. <P>SOLUTION: A positioning of a mask 14 and a substrate 20 is conducted inside a deposition chamber 1, and the substrate 20 and a vapor deposition source 11 are moved relatively to conduct a deposition of the organic compound layer. In the deposition chamber 1, there are provided a mask supporting table 12 for supporting the mask 14 and a mask supporting table shifting mechanism 13 which moves the mask supporting table 12 to a position not interfering with the vapor deposition source 11 after a positioning of the mask 14 and the substrate 20 is conducted and they are connected tight. After a deposition is over, the substrate 20 and the mask 14 are released from a state of a tight connection on the mask supporting table 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing an organic EL display including a step of forming an organic compound layer by moving an evaporation source relative to a substrate.

  In recent years, organic light-emitting elements have attracted attention as a promising technology for realizing full-color flat panel displays. An organic light-emitting element is a self-luminous element that emits light by electrically exciting a fluorescent or phosphorescent organic compound, and is capable of high brightness, high viewing angle, surface emission, thin and multicolor emission, etc. It has the characteristics.

  In order to manufacture a high-definition display by mounting this organic light emitting element, it is necessary to form a predetermined pattern using a mask in the step of forming an organic compound layer constituting the organic light emitting element. This is because it is very difficult to pattern a thin film made of an organic compound without damaging the thin film in a step after the film formation.

  Note that a large number of minute openings are formed in the mask, and an organic compound is deposited on the substrate through the openings (mask openings).

  The length of one side of the subpixel in the organic EL display is several μm to several tens of μm, and these subpixels are regularly arranged at intervals of several tens of μm to 100 μm. An opening is formed in the mask at a position corresponding to such a pixel. In addition, in order to form a film on a substrate with high pixel density through such a small opening, a thin mask is used for the purpose of suppressing formation of a shadow region of the mask in the pixel. Its thinness is several μm to several hundred μm.

  In an organic EL display manufacturing apparatus that closely attaches such a thin mask to glass, a mask containing a magnetic material is used, and a magnetic mask holder is provided on the back surface (non-film-forming surface) side of the substrate. A mechanism is used in which the mask is brought into close contact with the substrate by magnetic force. In particular, when manufacturing using a large substrate having a side exceeding 500 mm, the substrate is greatly bent, and it is very difficult to completely adhere the substrate and the mask without using a magnetic force.

  In order to accurately align such a thin mask and a large-sized substrate, it is desirable to keep at least one of the mask and the substrate flat. For this reason, the conventional organic EL display manufacturing apparatus is provided with an alignment chamber adjacent to the film formation chamber via a gate valve, and the alignment operation is performed on a mask support with a smooth surface. .

  FIG. 6 is a flowchart showing a flow from alignment to film formation according to such a conventional example. That is, a mask is carried into the alignment chamber (step 101), alignment is performed (step 102), and the mask and the substrate are brought into close contact (step 103). Then, the mask is detached from the mask support in the alignment chamber, transferred to the film formation chamber (deposition chamber) (step 104, step 105), and film formation is performed (step 106).

Furthermore, as disclosed in Patent Document 1, it is also known that the mask support provided in the alignment chamber is also provided with a magnetic material, and the mask is attracted onto the mask support to suppress the displacement.
JP-A-11-158605

  However, in the conventional method including the step of transferring from the alignment chamber to the film forming chamber in a state where the mask and the substrate are in close contact with each other after the alignment between the substrate and the mask, the mask and the substrate are subjected to an impact caused by a mechanical operation in the transfer process. there is a possibility. In addition, there is a problem that the initial alignment position is shifted due to changes in the mask, the substrate, or the instruments that hold them due to environmental changes such as temperature difference and pressure difference between the alignment chamber and the film forming chamber. In particular, in the case of a large-sized substrate, since the weight of the substrate and the mask, and the instruments for holding the mask and the substrate are increased, the reaction to the impact is increased, so that such a problem becomes serious.

  As a means for preventing such misalignment, there is a method of increasing the force (for example, magnetic force) for attracting the mask to the substrate side. In this case, the force on the mask that acts when the mask is removed after film formation Is too strong to cause deformation of a part of the mask. In addition, there is a method of performing alignment in both the alignment chamber and the film forming chamber, but this increases the number of alignments, which increases the tact time. For this reason, it is necessary to provide a plurality of alignment mechanisms, which reduces the manufacturing cost. There is a problem to be raised.

  The present invention relates to a method and an apparatus for manufacturing an organic EL display capable of suppressing a positional shift after aligning a mask and a substrate and patterning an organic compound layer of an organic light emitting element with high resolution. The purpose is to provide.

  The organic EL display manufacturing method of the present invention is a method for manufacturing an organic EL display in which an organic compound layer of an organic light-emitting element is formed by vapor deposition. A step of arranging a mask; a step of aligning the mask placed on the mask support with a substrate; a step of bringing the mask and the substrate into close contact; and Separating the mask support from the mask support, moving the mask support to a region that does not interfere with the deposition source disposed in the deposition chamber, and relatively positioning the deposition source relative to the mask and the substrate. A step of forming an organic compound layer while being moved, and a step of releasing the adhesion state of the substrate and the mask on the mask support after the film formation. And butterflies.

  The organic EL display manufacturing apparatus of the present invention includes a film forming chamber, a holding mechanism for holding a substrate and a mask in the film forming chamber, a vapor deposition source for evaporating an organic compound in the film forming chamber, and the vapor deposition source with the vapor deposition source. A deposition source moving mechanism for forming an organic compound layer while moving the substrate relative to the substrate and the mask, and supporting the mask for aligning with the substrate in the film forming chamber. A mask support, an alignment means for aligning the substrate and the mask, and a mask support moving mechanism for moving the mask support to a region that does not interfere with the vapor deposition source during film formation. It is characterized by having.

  A mask is placed on a mask support in the film formation chamber and aligned with the substrate, and the mask support for alignment used at that time is moved to a position that does not interfere with the film formation. For this reason, the process of conveying a board | substrate and a mask is not required in the period after the alignment process until film-forming is started. Therefore, even in the film formation using a large-sized substrate, it is possible to greatly reduce the positional deviation between the substrate and the mask after alignment. In addition, since the substrate and the mask are not moved greatly after alignment, alignment is not required a plurality of times, which contributes to shortening of the tact time.

  Since the organic EL display manufactured by the manufacturing apparatus of the present invention suppresses displacement in the substrate surface, it is possible to sufficiently reduce pixel defects and to produce a high-definition image with excellent display quality. Become.

  In particular, even when a large-sized substrate is used, it is possible to suppress misalignment after aligning the thin plate-like mask and the substrate, and to form the organic compound layer of the organic light-emitting element with a high-resolution pattern.

  The best mode for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a flowchart showing a process from mask alignment to film formation in a process of forming an organic compound layer of an organic light emitting element by vapor deposition in a method for manufacturing an organic EL display according to an embodiment. In this embodiment, a thin plate-shaped mask having a predetermined opening (mask opening) is aligned with the substrate to be formed in the film forming chamber. First, in step 1, the mask is placed on a mask support provided in the film forming chamber, and in step 2, the mask and the substrate are aligned on the mask support. In step 3, the mask and the substrate are brought into close contact with each other. In step 4, the mask and the substrate that are in close contact with each other are held by a holding mechanism, and the mask support is detached from the mask. In step 5, the mask support is moved to stand by at a place where it does not interfere with the film formation (an area that does not interfere with the vapor deposition source). In step 6, an organic compound layer is formed on the substrate while moving the evaporation source relative to the mask and the substrate. After the film formation, the contact state between the substrate and the mask is released on the mask support.

  In addition, the movement of a vapor deposition source may be started during the movement of a mask support stand, and the said flow does not restrict | limit the timing. In the case where the film formation is repeated, the mask support that has been waited in step 5 is returned to the position where the alignment work is performed. In step 4, when the mask support is detached from the mask, a step of moving the mask and the substrate up and down with respect to the mask support while maintaining the contact state between the mask and the substrate may be included. Moreover, you may put the step which performs the operation | work which is not described here between each step as needed.

  FIG. 2 is a partially sectional elevational view showing an organic EL display manufacturing apparatus for carrying out the above-described process flow. FIG. 3 is a plan view showing the apparatus of FIG.

  The layout of each member shown in FIG. 3 corresponds to Step 2 described in FIG.

  Based on FIG. 2 and FIG. 3, the structure of a manufacturing apparatus is demonstrated.

  In the film forming chamber 1, a point source type vapor deposition source 11 that is moved in the X direction by the vapor deposition source moving mechanism 10 and a mask support base moving mechanism 13 that moves the mask support base 12 in the X direction are arranged. The The mask 14 transferred to the film forming chamber 1 is disposed on the mask support 12 and aligned with the substrate 20 on the mask support 12.

  A substrate holding mechanism 21 that is a holding mechanism for holding the substrate 20 and the mask 14 at a predetermined spatial position is provided above the substrate 20 (on the non-film formation surface side). The substrate holding mechanism 21 is provided with a plurality of permanent magnets, and adjacent permanent magnets are arranged so as to have opposite polarities. Although these permanent magnet groups may be fixed to the substrate holding mechanism 21, the permanent magnets may be movable so that the distance between the substrate surface and the permanent magnet can be adjusted. This permanent magnet is used when the mask 14 is brought into close contact with the substrate 20. The substrate holding mechanism 21 can be moved up and down along a direction perpendicular to the substrate surface, and can move in a direction horizontal to the substrate surface.

  A substrate support mechanism 22 is provided around and above the substrate 20. The substrate support mechanism 22 supports the substrate 20 so as to minimize the amount of bending of the substrate 20, and the substrate position is adjusted in the process of positioning the substrate 20 in and out of the film forming chamber 1 and the mask 14. Used for proper control.

  The thin plate-like mask 14 is provided with openings (mask openings) 15 in the range of 1 μm to 200 μm, and a plurality of openings 15 having such dimensions are regularly arranged at intervals in the range of 5 μm to 50 μm. Yes.

  The substrate 20 is formed of a nonmagnetic material (for example, glass or plastic), and the mask 14 is formed of a magnetic material (for example, stainless steel, invar material). As the thickness of the mask 14, a plate material in the range of 10 μm to 500 μm can be preferably used.

  Below the mask 14 is a mask support 12. The mask support 12 includes an electromagnet (magnetic means), and has a function of applying a desired current when attracting the mask 14 and fixing the mask 14 on the mask support 12 by magnetic force. . The mask support 12 can move in a direction perpendicular to the mask support surface (Z direction) and can also move in a two-dimensional direction (XY direction) in a plane horizontal to the mask support surface. Further, it can be rotated around an axis perpendicular to the mask support surface. Further, the mask support surface of the mask support base 12 with which the mask 14 is in contact is subjected to a smoothing process so as not to damage the mask 14.

  The mask support 12 is provided on the mask support moving mechanism 13. In step 5, the mask support 12 is moved in the X direction by the mask support moving mechanism 13. That is, the direction in which the mask support 12 is moved is parallel to the direction in which the vapor deposition source 11 is moved. In the film forming chamber 1, a space is provided for allowing the mask support 12 to stand by during the film forming process (during film formation). In order to prevent evaporation from the vapor deposition source 11 from adhering to the mask support 12 during the alignment period or during the period when the mask support 12 is moving or waiting, the mask support A plurality of protective plates are provided in the vicinity of 12.

  In the alignment operation between the substrate 20 and the mask 14, an alignment mark provided on the substrate 20 is formed with a slight gap (about 0.5 mm to 1.5 mm) between the mask 14 and the substrate 20. On the other hand, alignment marks provided on the mask 14 are aligned. In this alignment, the positional deviation amount of both is detected by an alignment means having an imaging device (for example, a CCD camera) (not shown) that can confirm each alignment mark, and the mask 14 is set so as to minimize the positional deviation amount. The fixed mask support 12 is moved.

  The vapor deposition source 11 and the vapor deposition source moving mechanism 10 disposed below the substrate 20 and the mask 14 are formed without largely moving the aligned substrate 20 and the mask 14 during a period until film formation by vapor deposition is started. It is installed so that it can be membrane.

  For example, the point source type vapor deposition source 11 according to the present embodiment has an evaporation rate distribution according to the cosine law with the opening of the crucible as the center. That is, the film thickness distribution formed by depositing the material evaporated from the evaporation source 11 on the substrate 20 is a concentric distribution from the center of the opening. Further, since the evaporation source 11 is one for the substrate 20, in order to make the film thickness uniform in the substrate surface, a period in which the center position of the substrate surface overlaps the opening center of the evaporation source 11 in the film forming process. Need to make. For this purpose, in the present embodiment, as shown in FIG. 3, a deposition source moving mechanism 10 for moving the deposition source 11 relative to the substrate 20 is provided along the center line of the substrate 20. ing.

  The vapor deposition source 11 according to the present embodiment is a point source type, but the type of the vapor deposition source is not limited. For example, a linear source type evaporation source 31 as shown in FIG. 4 or a boat type evaporation source can be used. Moreover, as shown in FIG. 5, the structure which arrange | positions the some vapor deposition source 41 and the some vapor deposition source moving mechanism 40, and may form may be sufficient.

  The relative positional relationship between the vapor deposition sources 31 and 41 and the vapor deposition source moving mechanisms 30 and 40 shown in FIGS. 4 and 5 and the substrate 20 is also an optimum film thickness distribution in consideration of the evaporation rate distribution from the vapor deposition sources 31 and 41. As long as it is set to form.

  By performing film formation according to the process flow shown in FIG. 1 using the above-described apparatus, it is possible to suppress the positional deviation after aligning the mask and the substrate, and as a result, the organic compound constituting the organic light-emitting element The thin film (organic compound layer) can be patterned with high resolution. Since such highly accurate film formation can be realized even on a large-sized substrate having a side exceeding 500 mm, a process of taking a multi-sided organic EL display for high-definition display can be stably performed.

  Further, as described above, by aligning the movement direction of the mask support and the movement direction of the vapor deposition source in parallel, the mask support and the vapor deposition source can be moved simultaneously. Since work can proceed simultaneously in this way, tact can be further shortened.

  If the mask and the mask support are brought into close contact with each other by a magnetic force, the mask can be stably fixed on the mask support during the alignment operation, and the bending of the mask can be preferably eliminated. In this method, a mask made of a magnetic material is used, and a mask support with a built-in electromagnet or permanent magnet is used. In order to eliminate the bending existing in the mask surface uniformly, it is preferable to change the magnetic force stepwise. Alternatively, it is preferable to use a method of giving a distribution of magnetic force in the mask plane. Further, it is preferable that the action of the magnetic force between the mask and the mask support base can be adjusted while the mask is placed on the mask support base. For this purpose, for example, a method of raising and lowering a permanent magnet or controlling an electric current using an electromagnet can be applied.

  In the stage where the mask is removed from the substrate after the film formation is completed, the force (magnetic force) acting between the substrate holding mechanism and the mask is applied stepwise while the force (magnetic force) that attracts the mask to the mask support is applied. By loosening the mask, the mask can be smoothly drawn toward the mask support base. Therefore, deformation of the mask can be suppressed at the stage of releasing the contact state between the mask and the substrate.

  According to the manufacturing apparatus of this embodiment, a mask support for alignment is provided in the film formation chamber, and the mask support is movable. No need to transport the substrate and mask. Therefore, it is possible to greatly reduce the positional deviation between the substrate and the mask after alignment. In addition, since a plurality of alignments are not required in one film formation, the tact time can be reduced. Furthermore, since the alignment chamber is not provided, the apparatus size can be reduced, and the equipment cost can be reduced. In addition, the structure and layout of the moving mechanism in the film forming chamber can be simplified by aligning the moving direction of the mask support and the moving direction of the vapor deposition source in parallel.

  In addition, a plurality of deposition source moving mechanisms are provided, and at least one mask support moving mechanism is arranged in a space formed between the plurality of deposition source moving mechanisms. A layout that effectively uses the space in the membrane chamber becomes possible. As a result, the entire apparatus can be made compact, and the equipment cost can be reduced.

  As a mask used for manufacturing an organic EL display, a material having a low coefficient of thermal expansion and easy to process a high-definition opening pattern is used. Generally, a magnetic material such as Ni or Fe is used. In addition, by incorporating a magnetic material in the mask support, the mask can be fixed on the mask support in the alignment process. Therefore, alignment can be performed in a short alignment time, and tact can be further shortened.

  1 to 3 show a first embodiment. This example describes the steps from mask alignment to film formation of an organic compound layer in the manufacture of an organic EL display. In other steps, a general method for manufacturing an organic EL display can be used. In this embodiment, a glass substrate having a size of 400 mm × 500 mm is used as the substrate 20.

  First, the substrate 20 is attached to the substrate support mechanism 22. In this state, the substrate 20 and the substrate support mechanism 22 are transferred to the film forming chamber 1. Thereafter, the substrate 20 is disposed above the mask support 12. At this point, the substrate 20 is supported on two sides by the supporting jig provided in the substrate support mechanism 22 and is in a state in which the amount of bending due to the weight of the substrate 20 is minimized.

  Next, the thin plate-like mask 14 is carried into the space between the substrate 20 and the mask support 12. At this time, the electromagnet built in the mask support 12 is still in a non-excited state.

  Next, when the electromagnet of the mask support 12 is excited, the mask 14 containing the magnetic material is attracted onto the mask support surface of the mask support 12. The size of the mask 14 is 390 mm × 490 mm, and a thin plate mask having a thickness of 15 μm is produced by electroforming. The material of the mask 14 is a Ni alloy. The opening size of the openings 15 provided in the mask 14 is 30 μm × 100 μm, and a plurality of such openings 15 are arranged in the plane at intervals of 20 μm.

  Next, the mask support 12 is raised to bring the mask 14 closer to the substrate 20. However, a state is maintained in which a gap of about 1 mm is maintained between the mask surface and the substrate surface.

  In this state, the mask 14 and the substrate 20 are aligned. A CCD camera is used for alignment, and the mask support 12 is set so as to minimize the positional deviation between the two alignment marks provided on the substrate 20 and the two alignment marks provided on the mask 14. It is used to adjust the position of the mask 14.

  When the alignment between the mask 14 and the substrate 20 is completed, the substrate 20 is gently lowered to bring the substrate 20 and the mask 14 into close contact. Further, the substrate holding mechanism 21 having a built-in permanent magnet, which is disposed on the back side of the substrate 20, is brought into close contact with the back surface of the substrate 20.

  Next, the electromagnet of the mask support 12 is brought into a non-excited state. Then, the mask 14 receives an attractive force from the permanent magnet of the substrate holding mechanism 21 and is attracted to the substrate surface which is the surface of the substrate 20 on the film forming surface side, and the substrate 20 and the mask 14 are integrated. Thereafter, the mask support 12 is lowered, and a distance between the mask support surface and the mask 14 is taken and separated. The substrate 20 and the mask 14 are maintained in an integrated state by the substrate support mechanism 22 and the substrate holding mechanism 21.

  Next, the mask support 12 is moved to a region that does not interfere with the evaporated material from the vapor deposition source 11 during film formation. The mask support base 12 remains in a standby state during the film formation period.

  Next, the deposition source 11 is smoothly moved in the X direction along the deposition source moving mechanism 10 to form a film on the substrate 20. The vapor deposition source 11 shown here is a point source type. The evaporation source 11 is heated by a heater and reciprocates while maintaining a stable evaporation rate.

  Since the deposition preventing plate is provided in the vicinity of the mask support 12, the mask support 12 is not contaminated by the evaporated material from the vapor deposition source 11 in the film forming process.

  When film formation is completed, the mask support 12 is moved below the mask 14 in order to remove the mask 14 from the substrate 20. At this time, the vapor deposition source 11 is kept waiting at the initial position. When it is confirmed that the mask support 12 is at a predetermined position below the mask 14, the mask support 12 is raised toward the mask 14. When the mask support surface of the mask support 12 comes into contact with the mask 14, the electromagnet is excited.

  The permanent magnet provided in the substrate holding mechanism 21 is moved in a direction away from the mask 14 to reduce the attractive force to the substrate side that has been exerted on the mask 14. As a result, the mask 14 is reliably attracted to the mask support 12 side.

  Next, the substrate holding mechanism 21 in a state where the substrate 20 is held is raised, and the substrate 20 and the mask 14 are separated using the substrate support mechanism 22. In this way, the contact state between the mask 14 and the substrate 20 is released. Then, the substrate 20 on which film formation has been completed is transferred to the next step. On the other hand, when the next batch of substrates is continuously formed, the substrate is continuously put into the film forming chamber 1 and the above-described alignment process is started.

  By performing these steps, it is possible to suppress the positional deviation after aligning the mask and the substrate, and as a result, it is possible to pattern the thin film constituting the organic light emitting element with high resolution. .

  FIG. 4 is a plan view showing an organic EL display manufacturing apparatus according to the second embodiment. The components other than the vapor deposition source 31 and the vapor deposition source moving mechanism 30 are the same as those in the first embodiment, and are therefore denoted by the same reference numerals and the description thereof is omitted.

  In this embodiment, a glass substrate having a size of 400 mm × 500 mm is used as the substrate 20. The size of the mask 14 is 390 mm × 490 mm, and a thin plate mask having a thickness of 50 μm is produced by an etching method. The material of the mask 14 is an Fe—Ni alloy. The opening size of the openings 15 provided in the mask 14 is 50 μm × 150 μm, and a plurality of such openings 15 are arranged in the plane at intervals of 20 μm.

  The process from the step of attaching the substrate 20 to the substrate support mechanism 22 to the step of closely attaching the mask 14 to the mask support base 12 is the same as that of the first embodiment.

  The mask support 12 is raised and the mask 14 is brought close to the substrate 20. However, a gap of about 1.5 mm is maintained between the mask surface and the substrate surface.

  In this state, the mask 14 and the substrate 20 are aligned. A CCD camera is used for alignment, and the substrate support mechanism 22 is set so as to minimize the displacement between the two alignment marks provided on the substrate 20 and the two alignment marks provided on the mask 14. Use to adjust the position of the substrate 20.

  The substrate support mechanism 22 is movable in the mask support surface direction (XY direction), and is also movable in a direction perpendicular to the mask support surface (Z direction). Further, it can be rotated around an axis perpendicular to the mask support surface.

  Thereafter, the steps up to the start of film formation are performed in the same manner as in Example 1.

  Next, the deposition source 31 is smoothly moved along the deposition source moving mechanism 30 to form a film on the substrate 20. The vapor deposition source 31 shown here is a linear source type. The vapor deposition source 31 is heated by a heater and is in a state of maintaining a stable evaporation rate.

  In addition, since the adhesion prevention board is provided in the vicinity of the mask support stand 12, the mask support stand 12 is not contaminated in the film forming process.

  The process after film formation is performed in the same manner as in Example 1.

  By performing these steps, it is possible to suppress the positional deviation after aligning the mask and the substrate, and as a result, it is possible to pattern the thin film constituting the organic light emitting element with high resolution. . Further, such highly accurate film formation can be realized even on a large substrate having a side exceeding 500 mm. For this reason, it becomes possible to stably carry out a process of taking a large number of organic EL displays that perform high-definition display.

  FIG. 5 shows a third embodiment, which is the same as the first embodiment except that a plurality of vapor deposition sources 41 and a plurality of vapor deposition source moving mechanisms 40 are used.

  In the film formation chamber, film formation is performed on the entire surface of the substrate 20 using two vapor deposition sources 41 for one substrate 20. By using a plurality of vapor deposition sources, the vapor deposition rate can be increased as compared with the first embodiment. In addition, a certain distance is provided between the two evaporation source moving mechanisms 40 that move the two evaporation sources 41, respectively. And the mask support stand moving mechanism 13 is provided between the two vapor deposition source moving mechanisms 40 and at a total of three positions on both ends of the mask support stand 12.

  By using the organic EL display manufacturing apparatus and performing the same process as in the first embodiment, it is possible to suppress misalignment after the mask 14 and the substrate 20 are aligned. As a result, the thin film constituting the organic light-emitting element can be patterned with high resolution.

  Furthermore, since the space between the plurality of vapor deposition source moving mechanisms 40 is used as a space for installing the mask support moving mechanism 13, a layout that effectively uses the space in the film forming chamber is possible. Can be made compact. As a result, the equipment cost can be reduced.

4 is a flowchart showing steps from mask alignment to film formation start in the method of manufacturing an organic EL display according to Example 1. 1 is a partially sectional elevational view showing an organic EL display manufacturing apparatus according to Example 1. FIG. It is a top view which shows the apparatus of FIG. 6 is a plan view showing an organic EL display manufacturing apparatus according to Example 2. FIG. 6 is a plan view showing an organic EL display manufacturing apparatus according to Example 3. FIG. It is a flowchart which shows the process from the mask alignment by the prior art example to the film-forming start.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Deposition chamber 10, 30, 40 Evaporation source moving mechanism 11, 31, 41 Deposition source 12 Mask support stand 13 Mask support stand moving mechanism 14 Mask 20 Substrate 21 Substrate holding mechanism 22 Substrate support mechanism

Claims (8)

In a method for manufacturing an organic EL display in which an organic compound layer of an organic light emitting element is formed by vapor deposition,
Placing a mask on a mask support in a film forming chamber for forming an organic compound layer;
A step of aligning the mask placed on the mask support and the substrate;
Adhering the mask and the substrate;
Detaching the mask adhered to the substrate from the mask support;
Moving the mask support to a region that does not interfere with the vapor deposition source disposed in the film formation chamber;
Forming an organic compound layer while moving the evaporation source relative to the mask and the substrate;
And a step of releasing the contact state between the substrate and the mask on the mask support after the film formation.   2. The method of manufacturing an organic EL display according to claim 1, wherein a direction in which the mask support is moved is parallel to a direction in which the vapor deposition source is moved.   3. The method of manufacturing an organic EL display according to claim 1, further comprising a step of bringing the mask and the mask support base into close contact with each other by magnetic force in order to align the mask and the substrate.   A film forming chamber; a holding mechanism for holding the substrate and the mask in the film forming chamber; a vapor deposition source for evaporating an organic compound in the film forming chamber; and moving the vapor deposition source relative to the substrate and the mask. A deposition source moving mechanism for depositing the organic compound layer while performing the deposition, a mask support for supporting the mask for positioning with the substrate in the deposition chamber, and the substrate and the mask. And a mask support moving mechanism for moving the mask support to a region that does not interfere with the vapor deposition source during film formation. apparatus.   The organic EL display manufacturing apparatus according to claim 4, wherein a direction in which the mask support is moved is parallel to a direction in which the vapor deposition source is moved.   6. The organic EL display according to claim 4, further comprising a plurality of evaporation sources and a plurality of evaporation source moving mechanisms, wherein the mask support moving mechanism is arranged between the plurality of evaporation source moving mechanisms. Manufacturing equipment.   7. The apparatus for manufacturing an organic EL display according to claim 4, wherein the mask support is provided with magnetic means for bringing the mask and the mask support into close contact with each other by magnetic force. .   An organic EL display manufactured by the apparatus for manufacturing an organic EL display according to claim 4.

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