CN102190156B - Tray-type substrate conveying system, film formation method and manufacturing method of electronic device - Google Patents
Tray-type substrate conveying system, film formation method and manufacturing method of electronic device Download PDFInfo
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- CN102190156B CN102190156B CN201110035701.5A CN201110035701A CN102190156B CN 102190156 B CN102190156 B CN 102190156B CN 201110035701 A CN201110035701 A CN 201110035701A CN 102190156 B CN102190156 B CN 102190156B
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Abstract
The invention provides a tray-type substrate conveying system, a film formation method and a method for manufacturing electronic device, which can retain the substrate steadily on the tray all the time and avoid deviation of the substrate from the tray and breakage and dropping of the substrate when conveying the substrate though the accuracy of moving the substrate to the substrate movable carrying mechanism of the tray moving device when moving the carried substrate is low. In an embodiment of the invention, when the substrate (102) is loaded onto the tray (106), a pressurization mechanism (102) applies a pressure to the substrate (102) to achieve a state where the first tray (106) retains the substrate (102); the first tray (106) is mounted on a second tray (107), a conveying mechanism conveys the second tray (107) into a treating chamber (109) in a way that the second tray (107) is inclined. In the treating chamber (109), a gas is introduced in a decompressed state so that thin films are stacked on the substrate (102).
Description
Technical field
The present invention relates to use the pellet type substrate conveyance system of pallet conveying substrate, particularly relate to the system that in the substrate board treatment of the processing such as the film forming under reducing pressure, conveying substrate uses.In addition, the present invention relates to use the film build method of such substrate board treatment, the manufacture method of electronic installation.
In addition, so-called " electronic installation ", refers to all devices that utilize electronic technology, such as liquid crystal display and plasma display etc. various element, solar cells etc. for demonstration.
Background technology
In the manufacture process of various electronic installations, need to implement to object being treated (hereinafter referred to as substrate) surface treatments such as heat treated, film forming processing.
For example, in liquid crystal display, need to form the plate face of the substrate of glass system (not being the face of end face) processing of transparency electrode etc.Because for the substrate board treatment of such processing treatment substrate under the atmosphere of regulation, be configured to and can reduce pressure or import the chamber of the gas of regulation to inside by vacuum exhaust so have.And, because need to carry out continuously different processing, or little by little reduce pressure etc. from atmospheric pressure, so form the structure with multiple chambers.
Fig. 4 is the example representing as representational processing substrate technology in the past, for erecting the vertical conveying figure of the summary mechanism of (in-line) formula substrate board treatment online of ground conveying substrate.
The online substrate board treatment of vertical conveying is the structure that is longitudinally provided with load lock 408 and multiple process chamber 409 point-blank, is provided with the conveying mechanism for delivery of substrate 402 in the mode that runs through load lock 408 and multiple process chamber 409.Between each chamber, be provided with gate valve 404.
Substrate 402 is transported to each chamber with the state being positioned on pallet (or also referred to as first pallet) 406 successively by conveying mechanism, for example, carry out the processing such as film forming.A chamber in each chamber is the load lock to atmosphere opening moving into, while taking out of substrate 402.
In the online substrate board treatment that carries out vertical conveying, the vibration while having the substrate being maintained on pallet due to conveying causes large distortion, causes the problem that substrate is damaged and come off.Particularly processing G6 generation when (1500[mml × 1800[mm]) more than size glass substrate, it is heavy that the weight of substrate itself becomes, and along with the slimming of display floater in recent years requires the also attenuation of thickness of substrate, so carry the degree of time distortion also larger, occur significantly substrate breakage, such problem comes off.
In the time solving the above problems, as the pallet for conveying carrying out in the online substrate board treatment of vertical conveying, in patent documentation 1, disclose the structure of following pallet for conveying, this pallet for conveying has the mechanism that utilizes the fulcrum post supporting substrates that has used soft fiber material on the treated side of substrate.
In addition, in patent documentation 2, disclose following structure, that is, be provided with the mechanism of the impact when absorbing conveying substrate in pallet for conveying bottom, for large substrate, suppress the breakage of substrate.
Patent documentation 1: TOHKEMY 2007-204824 communique
Patent documentation 2: TOHKEMY 2007-262539 communique
As mentioned above, the pallet of online substrate board treatment is in the past following mechanism, that is, install and embed the square pallet that has glass substrate, the mechanism that only keeps this substrate by embedding substrate.Thereby the substrate embedded space of pallet has only considered just can not control the overall dimension pressurization of substrate the surplus of substrate degree.Therefore, substrate is moved to the action that the very high substrate of mechanism (robot etc.) precision prescribed that is placed on pallet moves mounting.
In addition, along with the large scale development of substrate, for the substrate of G6 generation (1800[mml × 1500[mm] × 0.07[mm]) size, the weight of substrate is close to 5kg, mechanism while substrate being moved on the pallet that is placed on substrate board treatment requires very high precision, and maximize and require high Weight Loaded, therefore price is very high.
In addition, in online substrate board treatment, substrate is embedded in pallet and carry, still, in order to shorten the processing substrate time, transporting velocity also will be accelerated.In addition, because substrate weight is large, so inertia is also large, be likely created in conveying substrate from pallet displacement, and substrate breakage, come off, therefore seek its countermeasure.
Summary of the invention
The present invention proposes in view of the above-mentioned problems, its object is, even the substrate that in the time of mobile mounting substrate, substrate is moved to mounting to pallet move the precision of carrying mechanism low, also can all the time substrate stably be kept with respect to pallet, while being suppressed at conveying substrate, substrate is from pallet skew, damaged, the generation that comes off.
The first technical scheme of the present invention is the pellet type substrate conveyance system that uses pallet conveying substrate, it is characterized in that, comprising: the first pallet, can load aforesaid substrate; Pressing mechanism, in the time that aforesaid substrate is loaded on above-mentioned the first pallet by the end face of this substrate is exerted pressure and this substrate is remained on above-mentioned the first pallet; The second pallet, above-mentioned the first pallet can load and unload with respect to this second pallet; Conveying mechanism, erects under the state of this substrate at the state that is loaded in the substrate above-mentioned the first pallet from flatly configuration, carries above-mentioned the second pallet that above-mentioned the first pallet is installed.
The second technical scheme of the present invention is a kind of film build method, it is characterized in that, comprises the following steps: substrate is loaded on the first pallet; By the end face that is loaded in the aforesaid substrate on above-mentioned the first pallet is exerted pressure and aforesaid substrate is remained on above-mentioned the first pallet; The first pallet that maintains aforesaid substrate is installed on the second pallet; Erect under the state of this substrate at the state that is maintained at the substrate above-mentioned the first pallet from flatly configuration, above-mentioned the second pallet that above-mentioned the first pallet is installed is transported in chamber; In above-mentioned chamber, carry and implement with the substrate on integrated above-mentioned the first pallet of this second pallet the processing specifying being maintained at by above-mentioned the second pallet.
The 3rd technical scheme of the present invention is for keeping and the pallet of conveying substrate, it is characterized in that, comprising: the first pallet, and can mounting substrate; Pressing mechanism, be located on above-mentioned the first pallet, have in the time that aforesaid substrate is loaded on this first pallet and the face of the end contact of this substrate, this pressing mechanism is configured to the end face in the face of aforesaid substrate of the end contact that utilizes this and this substrate and exerts pressure, and the face of the end contact of above-mentioned and this substrate can be to the inner side of above-mentioned the first pallet and outside displacement; The second pallet, above-mentioned the first pallet can load and unload with respect to this second pallet.
According to the present invention, even the substrate that in the time of mobile mounting substrate, substrate is moved to mounting to pallet move the precision of carrying mechanism low, also can make pallet all-the-time stable and keep substrate, can be suppressed at conveying substrate time, substrate is from pallet skew, damaged, the generation that comes off.
Brief description of the drawings
Fig. 1 is the substrate conveyance system of one embodiment of the present invention and the skeleton diagram of substrate board treatment.
Fig. 2 is the skeleton diagram of the pallet of one embodiment of the present invention.
Fig. 3 is the skeleton diagram of the pallet of one embodiment of the present invention, is (a) figure of the state that represents that the first pallet separates with the second pallet, is (b) to represent to make the first pallet and the figure of the state that is integrated.
Fig. 4 is the example representing as representational processing substrate technology in the past, for erecting the figure of summary mechanism of the online substrate board treatment of vertical conveying of ground conveying substrate.
Fig. 5 is the schematic diagram of the pressing mechanism of one embodiment of the present invention.
The figure of Fig. 6 for illustrating that one embodiment of the present invention, substrate arrange to the first pallet.
Embodiment
Below, based on brief description of the drawings embodiments of the present invention.
In addition, to identical with the key element essence of Fig. 4 explanation in the drawings key element, mark identical Reference numeral.
Fig. 1 is the substrate conveyance system of present embodiment and the skeleton diagram of substrate board treatment.Device shown in Fig. 1 is the online device of vertical conveying.Substrate board treatment shown in Fig. 1 comprises substrate conveyer robot portion 103 and loads the multiple box portion 101 of multiple substrates 102.The following effect of substrate conveyer robot portion 103 performance, that is, move substrate 102 effect being placed on substrate board treatment and the substrate of finishing dealing with 102 be recovered to the effect in box portion 101 from box portion 101.
In the present embodiment, pallet (Reference numeral 110 in Fig. 3 (a)) that can mounting substrate comprising: the first pallet 106, has the maintaining body for keeping substrate; The second pallet 107, is configured to and can separates with this first pallet 106, for keeping this first pallet 106.
The substrate board treatment of present embodiment has and by coordinating with substrate conveyer robot portion 103, substrate 102 is moved to the mounting table 105 being placed on the first pallet 106.Mounting table 105 is configured to, the mounting surface of mounting first pallet 106 of this mounting table 105 becomes level (direction vertical with gravity direction), in the time substrate 102 being placed on the first pallet 106, the first pallet 106 is positioned in mounting table 105 by level.Therefore the substrate 102 of, being carried from box portion 101 by substrate conveyer robot portion 103 utilizes this substrate conveyer robot portion 103 to be moved horizontally and is placed on the first pallet 106 in mounting table 105.Be moved while being placed on the first pallet 106 at substrate 102, utilize pressing mechanism described later substrate 102 is exerted pressure and this substrate 102 is remained on the first pallet 106.Now, for example utilize the pin-shaped mechanism of extending from mounting table 105 can temporarily the substrate of transfer robot portion 103 102 be placed on to mobile being placed on the first pallet 106 after this pin-shaped mechanism.
Like this, in the time that substrate 102 is loaded on pallet 110, by adopting the structure that can separate from the second pallet 107 the first pallet 106, the mode that can become with substrate configuring area on the first pallet 106, placement substrate 102 (Reference numeral 111 in Fig. 3) level, is configured to the first pallet 106 in mounting table 105.Therefore, because substrate 102 can be transported on the substrate configuring area 111 of the level of remaining, so even in the situation that substrate 102 produces deflection on its thickness direction, also can easily substrate 102 be configured on substrate configuring area 111.
Afterwards, utilizing pallet that robot (not shown) is set makes this first pallet 106 integrated with this second pallet 107 so that the vertical state leaning on of the first pallet 106 is arranged on second pallet 107 with gradient a little of vertical loading on the first pallet 106 of being located in mounting table 105 and be mounted with substrate 102.Then, the first pallet 106 being arranged on the second pallet 107 utilizes the conveyor track 302 ((a) diagram of Fig. 3) of the bottom of being located at the second pallet 107 and is arranged at the conveying roller 303 ((b) diagram of Fig. 3) in substrate board treatment, is carried to load lock 108 and process chamber 109.In addition, between load lock 108 and process chamber 109 and between process chamber 109 and process chamber 109, be provided with gate valve 104.
Be configured in above-mentioned process chamber 109 when interior at the pallet 110 that is provided with substrate 102, in the interior processing of aforesaid substrate 102 being implemented to regulation of this process chamber 109.For example, to reducing pressure in process chamber 109, import the gas of regulation, on the position of the regulation on substrate 102, form film.
In this case, in the time that film forming is processed, in order to prevent because accompanying film separation produces particulate, can be or not second pallet 107 not be taken out of to the outside in atmospheric pressure state from being retained as in the substrate board treatment of vacuum yet.
As shown in Fig. 3 (a), above-mentioned the second pallet 107 is configured to, be formed with the maintaining part 304 for keeping the first pallet 106, the first pallet 106 can be arranged on the pallet installation surface 305 for the first pallet 106 is set, or can in the pallet installation surface 305 for the first pallet 106 is set, unload the first pallet 106.In addition, as mentioned above, on the second pallet 107, be provided with conveyor track 302, this conveyor track 302 engages with conveying roller 303, for making the second pallet 107 (being pallet 110) mobile.In the present embodiment, conveyor track 302 and conveying roller 303 are as playing a role for delivery of the conveying mechanism of pallet 110.In addition, in the present embodiment, as shown in Fig. 3 (b), in the time that conveyor track 302 engages with conveying roller 303, pallet installation surface 305 is towards gravity direction upside, and pallet installation surface 305 becomes the state of the angle specifying to the lopsidedness contrary with pallet installation surface 305 of the second pallet 107 from being positioned at the state parallel with gravity direction, form conveyor track 302 and conveying roller 303.Thus, when by pallet 110 conveying substrate 102, conveying mechanism with the first pallet 106, be configured in the posture that substrate 102 on this first pallet 106 and the second pallet 107 tilt respectively and carry.
In the present embodiment, because pallet installation surface 305 is tilted and configures, so while the first pallet 106 being set on the second pallet 107, only lean against on the second pallet 107 by make the first pallet 106 stand by maintaining part 304, the first pallet 106 can be set on the second pallet 107., can be easier and the posture conveying substrate 102 to tilt more stably.
In addition, in the present embodiment, to being illustrated in the mode of posture delivery tray 110 (being substrate 102) tilting, but also can vertically erect pallet 110 and carry.; as long as can guarantee that the state from flatly configuring pallet installation surface 305 (being arranged at the substrate 102 the first pallet 106) erects the state of this pallet installation surface 305 (situation (vertical pallet) that in the situation that the interior direction of face that comprises pallet installation surface 305 is vertical direction with respect to horizontal direction and the face of pallet installation surface 305, direction tilts with respect to this vertical direction), applies any structure as the second pallet 107 and all can.
In addition, in the present embodiment, the mode tilting with pallet installation surface 305 arranges the second pallet 107, the first pallet 106 is stood and lean against on this second pallet 107, thereby the first pallet 106 is arranged on the second pallet 107, but be not limited to the method.For example, multiple protuberances (recess) also can be set on the first pallet 106, on the second pallet 107, be provided with and the chimeric such recess of this protuberance (recess) (protuberance), by making raised part and recess chimeric, the first pallet 106 is arranged on the second pallet 107.Or, can also the first pallet 106 be fixed on the second pallet 107 with screw bolt and nut.Like this, as long as can the first pallet 106 be set in this pallet installation surface 305 under the state that erects this pallet installation surface 305 from the state that flatly configures pallet installation surface 305, setting up an organization that the first pallet 106 is arranged to the second pallet 107 all can with any structure.
Then, (a) based on Fig. 2, Fig. 3, (b) illustrate the pellet type substrate conveyance system of present embodiment in further detail.Fig. 2 is the skeleton diagram of the first pallet 106 of present embodiment.In addition, (a) of Fig. 3 is the summary side elevation of the execution mode before the first pallet 106 of present embodiment and the second pallet 107 are installed, the skeleton diagram of (when installation base plate) first pallet 106 and the second pallet 107 when (b) of Fig. 3 is conveying substrate.
The first pallet 106 of present embodiment is for example to keep G6 for 1800[mm] × 1500[mm] the more than size such substrate 102 of large substrate and integrated with the second pallet 107, and carry and process the pallet of this substrate 102 for substrate 102 being remained to vertical one side on one side.In the present embodiment, taking substrate 102 as giant display glass substrate, carry out film forming processing by (cathode) sputtering (sputtering).
First, utilize substrate conveyer robot portion 103, substrate 102 is moved the level of being placed on and is positioned on the first pallet 106 in mounting table 105.As shown in Fig. 3 (b), substrate 102 be to non-treated side 306 (following, be called a side that not implementing in the surface of substrate 102 process, be called by (cathode) sputtering carry out film forming while processing not by the rear side of the substrate 102 of film forming) posture that tilts a little of side.Now, for substrate 102 is stably maintained on the first pallet 106, be provided with the pressing mechanism that substrate 102 is exerted pressure.In the present embodiment, as pressing mechanism, be provided with locating retainer 202.Specifically describe, on the first pallet 106, be provided as the substrate retaining pin 201 of multiple convex members, with the mode supporting substrates 102 at the non-treated side 306 of substrate retaining pin 201 upper support.Substrate retaining pin 201 is for example resin.And, utilize and be arranged at locating retainer 202 on the bottom of the first pallet 106 and at least either party of sidepiece, press substrate 102 end face substrate 102 is positioned.
Fig. 5 is the schematic diagram as the locating retainer 202 of an example of the pressing mechanism of present embodiment.
In Fig. 5, locating retainer 202 is located at the outside of the substrate configuring area 111 on the first pallet 106, has the elastomer 202b of support plate 202a, such as spring etc., resin 202c and handle 202d as press section.Support plate 202a is fixed on the first pallet 106, and one end of elastomer 202b is connected with this support plate 202a.The other end of elastomer 202b is connected with resin 202c, and this resin 202c is unfixing with respect to the first pallet 106, can on this first pallet 106, slide.Therefore, in the situation that elastomer 202b is out of shape, utilize the restoring force of this elastomer 202b, the end face 202e of resin 202c and this resin 202c can move to arrow label orientation P.In addition, be provided with handle 202d on resin 202c, user utilizes this handle 202d, can make resin 202c and end face 202e to arrow label orientation P displacement.Like this, as the locating retainer 202 of pressing mechanism, resin 202c and end face 202e can be mobile with respect to the outside of the first pallet 106 (the arrow label orientation Q of Fig. 5) and inner side (the arrow label orientation R of Fig. 5), and utilize resin 202c (being end face 202e) to press the end face 102a of substrate 102.
In the present embodiment, on substrate configuring area 111, when placement substrate 102, the state that becomes shortening with elastomer 202b arranges support plate 202a.Thus, on substrate configuring area 111 when placement substrate 102, the restoring force that the elastomer 202b shortening wants to revert to original state plays a role, resin 202c (end face 202e) can towards the arrow label orientation R of Fig. 5 press the end face 102a of substrate 102.As shown in Figure 2, to be provided with a pair of locating retainer 202 across the mode of substrate configuring area, utilize this pair of locating retainer 202, make substrate 102 bear pressure from the both sides of relative end face 102c.Therefore, locating retainer 202 utilizations are applied to the pressure on end face 102a and keep substrate 102.
In such formation, the in the situation that substrate 102 being set on the first pallet 106, user to the handle 202d effect of each locating retainer 202 when the power of arrow label orientation Q, resin 202c moves along arrow label orientation Q, between substrate configuring area 111 and resin 202c, forms space K.Want under the effect of the restoring force playing a role while reverting to original state at the elastomer 202b shortening, resin 202c moves to arrow label orientation R, and this space K disappears.That is, in the time that the end face 202e of resin 202c and the end 111a of substrate configuring area 111 align (, as shown in Figure 5, while keeping substrate 102 by resin 202c), above-mentioned space K disappears.Thus, as shown in Figure 6, for example, in the time substrate 102 being set to the first pallet 106 etc., by resin 202c is moved to arrow label orientation Q, the surplus (margin) corresponding with above-mentioned space K can be set on substrate configuring area 111.
In the present embodiment, because the end 111a that is positioned at substrate configuring area 111 at the end face 202e of resin 202c, the end face 102a of substrate 102 is also positioned at above-mentioned end 111a, substrate 102 is positioned on substrate configuring area 111 exactly.Thus, for example, substrate 102 being arranged on the first pallet 106 under the state shown in Fig. 6, even if be positioned at the mode of space K is loaded into substrate 102 in substrate retaining pin 201 with end face 102a, under the effect of restoring force of the elastomer 202b shortening, resin 202 is moved towards arrow label orientation R, the end face 202e of resin 202c contacts with the end face 102a being present in the K of space, and this end face 102a (being substrate 102) is further to arrow label orientation R side shifting.And as shown in Figure 5, in the time that end face 202e, end face 102a align with the end 111a of substrate configuring area 111, resin 202c is static, substrate 102 is configured on substrate configuring area 111 exactly.
Like this, in the present embodiment, even if substrate 102 is not loaded on substrate configuring area 111 exactly, return in the process of original position at resin 202c, under the effect of restoring force of the elastomer 202b shortening, resin 202c moves, thereby also substrate 102 automatically can be positioned at accurately on position.,, can realize accurately location and substrate 102 is remained on to this accurately on position of substrate 102 this end face 102a a series of action producing of exerting pressure by the resin 202c (end face 202e) that contacts with the end face 102a of substrate 102.
Thus, even substrate 102 is loaded on the first pallet 106 with lower precision, the region (being substrate configuring area 111) that locating retainer 202 also can make substrate 102 move to this substrate 102 should to be positioned at, and on this position, exert pressure with respect to substrate 102 and keep this substrate 102.Thus, even in the case of substrate conveyer robot portion 103, not high to the configuration precision of the first pallet 106 placement substrates, also accurate placement substrate 102, remains on this accurately on position of configuration by substrate 102.
In addition, in the present embodiment, because be not by being embedded in the structure that substrate is set on pallet as in the past, the end face 102a of substrate 102 is exerted pressure and keeps substrate 102 as the locating retainer 202 of above-mentioned pressing mechanism but utilize, so the first pallet 106 can keep substrate 102 in all-the-time stable ground.Thus, even thereby accelerate pallet 110 transporting velocity or increase substrate 102 weight substrate 102 inertia increase, also can reduce substrate 102 skew, come off.In addition,, due to the existence of elastomer 202b, can make interface between the end face 202e of resin 202c and the end face of the end face 102a of substrate 102 along flexibly displacement of arrow label orientation P.Thus, large even if the vibration of the pallet 110 in carrying becomes, also can utilize the distortion of elastomer 202b to relax this vibration, can reduce the breakage of substrate.
In addition, in the present embodiment, important is, utilizes pressing mechanism, the substrate 102 being temporarily configured on the first pallet 106 is positioned on substrate configuring area 111 exactly, and applies the pressure of regulation to being positioned in the end face 102a of the substrate 102 on this substrate configuring area 111.As long as can bring into play such effect, pressing mechanism is just not limited to above-mentioned locating retainer 202.For example, also can in locating retainer 202, adopt the structure (for example, the driving mechanisms such as driver are set, utilize the structure of this driving mechanism of control device control etc.) of utilizing electromagnetic drive mechanism can make resin 202c to move.
Substrate retaining pin 201 has the function that can keep with the little state of contact area substrate 102, and for example, the in the situation that of heated substrates 102, preferably in vacuum, gas discharge rate is few.In this case, substrate retaining pin 201 is little with the contact area of substrate 102, so it is few to be transmitted to the loss of the heat on the first pallet 106, therefore can improve the uniformity of base plate heating.
Both can heat substrate 102 from the treated side side of substrate 102, also can heat substrate 102 from non-treated side 306 sides of substrate 102, in the case of from non-treated side 306 sides with not shown heater block heated substrates 106, as diagram in Fig. 2, preferably on the first pallet 106, be formed with peristome 210.
In addition, as the resin that forms the substrate retaining pin 201 that contacts with substrate 102, for example, can use the thermal endurances such as PEEK (polyether-ether-ketone, polyether ether ketone) resin, PI (polyimides, Polyimide) resin, resin that drug resistance is high.
In addition, as an example of the shape of substrate retaining pin 201, cylindric for height 1cm, diameter 2cm, but be not limited thereto.As the number that is configured in the substrate retaining pin 201 on the first pallet 106, normally for the more than 4 of four angles of supporting substrates 102, decide number but do not hinder to carry to wait according to the size of handled substrate 102 etc.
In the present embodiment, as mentioned above, in Fig. 2, above-mentioned locating retainer 202 applies to the end face 102a of substrate 102 pressure that does not produce deformation extent in location, can reduce substrate 102 is moved to the desired precision of when mounting substrate conveyer robot portion 103 to the first pallet 106, and can make the displacement of the substrate 102 that substrate 102 causes with respect to the vibration when carrying return to the initial position of regulation.
In addition, contact portion locating retainer 202 and end face 102a substrate 102 is used resin 202c, and combined elastic body 202b exerts pressure to substrate 102, not fully be fixed the damage of the substrate 102 that the vibration therefore can suppress because of conveying time etc. causes.
In addition the substrate 102 that causes of vibration that, the first pallet 106 also can have for suppressing when carrying prevents plate 203 to the displacement substrate of treated side direction displacement.Utilize this displacement substrate to prevent plate 203, be suppressed at substrate 102 in conveying and, to the displacement of treated side direction, suppress substrate 102 breakages, come off.
And displacement substrate prevents that plate 203 from also can alleviate this substrate 102 of producing because of substrate 102 displacements and the friction of the first pallet 106 simultaneously, can suppress the generation of the particulate that the quality after film forming is impacted.
Displacement substrate prevents that plate 203 from being formed by resin, is provided with multiplely on the first pallet 106, and substrate 102 and displacement substrate prevent plate 203 by preventing from this substrate 102 and this displacement substrate being provided with small gap between plate 203 and with contactless state setting.Thus, cause displacement in the vibration when carrying, can suppress displacement substrate and prevent plate 203 and the displacement contiguously of substrate 102 faces.
In addition, displacement substrate prevents that plate 203 is in order to install and dismantle substrate 102, has the structure (not shown) opening and closing to the treated side direction of substrate 102.
In addition, the first pallet 106 also can have for suppressing the substrate 102 that causes of vibration when the carrying anti-stopping bar 204 of displacement substrate to non-treated side direction vibration.
The anti-stopping bar 204 of displacement substrate is the structures to the first pallet 106 bendings, has multiplely, and in the part contacting with substrate 102 of the anti-stopping bar 204 of this displacement substrate, has multiple resinous substrate supporting portion 205.Utilize the anti-stopping bar 204 of such displacement substrate and substrate maintaining part 205, can be suppressed at the substrate center portion producing in large-scale treatment substrate to the bending of non-treated side direction, can suppress coming off and breakage of substrate 102.
As mentioned above, in the present embodiment, press section can be towards the inner side of the first pallet 106 and outer side shifting, and the locating retainer 202 that is configured to the end face 102a that can press substrate 102 has the function of positioning baseplate 102 exactly and keeps the function of substrate.Therefore, even if substrate 102 is not configured in exactly to the region that should arrange (substrate configuring area 111) of the first pallet 106 in substrate conveyer robot portion 103, also can utilize locating retainer 202 that this substrate 102 is positioned on substrate configuring area 111.
In addition, wish is configured on pallet by substrate in the case of the state erecting from the state that flatly configures pallet, have to utilize substrate conveyer robot portion 103 will be set on pallet at this substrate with the state that vertically keeps substrate.Thus, even if use the locating retainer 202 with feature of the present invention, be sometimes also difficult to substrate to be configured in exactly on pallet.
To this, in the present embodiment, use the second pallet 107 being connected with conveying mechanism and first pallet 106 that can load and unload with respect to this second pallet 107, to keep the mode of this substrate to make this second pallet 107 become in advance association status with conveying mechanism under the state that erects substrate.Thus, in the time of placement substrate, can make the first pallet 106 from separating with the second pallet 107 of conveying mechanism engaging.Therefore, in the time of placement substrate 102, can flatly configure the first pallet 106, can utilize substrate conveyer robot portion 103 with respect to the first pallet 106 placement substrate 102 simply.And, second pallet 107 that can load and unload with respect to the first pallet 106 is to keep the mode of this first pallet 106 to be associated with conveyor mechanism in advance the state erect the first pallet 106 from level, so only by the first pallet 106 is installed on the second pallet 107, just can be with posture or vertical posture and the conveying substrate 102 tilting.That is, in the time that substrate is configured to the first pallet 106, also can by with respect to the first pallet 106 independently the second pallet 107 link with conveying mechanism, to keep state from flatly configuring tray arrangement face 305 to erect the state of this tray arrangement face 305.Thus, when at every turn to tray arrangement substrate, without the mode that substrate is erected with the angle of hope, pallet and conveying mechanism are linked.
Like this, in the present embodiment, about pallet, be divided into and also can be horizontally disposed with the 1st function of substrate and for keeping the 2nd function of substrate with erecting, relevant the 1st functional utilization the first pallet 106 is realized, and relevant the 2nd functional utilization the second pallet 107 is realized.
(embodiment)
To the big or small substrate of 730mm × 920mm, use the substrate board treatment in the one embodiment of the present invention of Fig. 1, Fig. 2, Fig. 3, Fig. 5 and Fig. 6 explanation, as an example of film build method, in the scope of following condition, make and shown the ITO nesa coating with element.
In addition, the (cathode) sputtering of the use negative electrode by Magnetron Mode carries out film forming processing respectively, as long as all obtain good characteristic as electronic installation in following condition and range.
Pressure: 0.3～0.7[Pa]
Electric power: 36[kW]
Substrate temperature: room temperature～120[DEG C]
In addition, as an example of the manufacture method of electronic installation, there are the manufacture method of above-mentioned demonstration element, but beyond the part for above-mentioned film build method, can utilize usual way manufacture.
Above, with reference to the accompanying drawings of preferred embodiment, embodiment, but the present invention is not limited to execution mode, embodiment, in the technical scope that can grasp, can carry out the change of variety of way in the record of accessory rights claim.
Claims (5)
1. a pellet type substrate conveyance system, is the pellet type substrate conveyance system that uses pallet conveying substrate, it is characterized in that, comprising:
The first pallet, can load aforesaid substrate, and can in flatly configuration state and the state that erects that this state flatly configuring erects certainly;
Pressing mechanism, in the time that aforesaid substrate is loaded on above-mentioned the first pallet by the end face of this substrate is exerted pressure and this substrate is remained on above-mentioned the first pallet;
The second pallet, at above-mentioned the first pallet in above-mentionedly erecting under state, this first pallet can load and unload with respect to this second pallet;
Conveying mechanism, carries above-mentioned the second pallet;
Pallet arranges parts, in erecting under state, above-mentioned the first pallet is installed on to above-mentioned the second pallet at above-mentioned the second pallet,
In the time carrying aforesaid substrate, above-mentioned the first pallet and above-mentioned the second pallet are integrated.
2. a substrate board treatment, is characterized in that,
There is pellet type substrate conveyance system claimed in claim 1.
3. a film build method, is characterized in that, comprises the following steps:
Substrate is loaded on the first pallet of flatly configuration;
By the end face that is loaded in the aforesaid substrate on above-mentioned the first pallet is exerted pressure and aforesaid substrate is remained on above-mentioned the first pallet;
Become from the state of flatly configuration at the first pallet that maintains aforesaid substrate erect from this state flatly configuring erect state after, this first pallet be installed on the second pallet and make above-mentioned the first pallet and above-mentioned the second pallet be integrated;
Above-mentioned the second pallet that above-mentioned the first pallet is installed is transported in chamber;
In above-mentioned chamber, carry and implement with the substrate on integrated above-mentioned the first pallet of this second pallet the processing specifying being maintained at by above-mentioned the second pallet.
4. a manufacture method for electronic installation, is characterized in that,
Comprise film build method claimed in claim 3.
5. a pallet, is for keeping the also pallet of conveying substrate, it is characterized in that, comprising:
The first pallet, can mounting substrate, and can be in the state of flatly configuration and the state that erects that this state flatly configuring erects certainly;
Pressing mechanism, be located on above-mentioned the first pallet, have in the time that aforesaid substrate is loaded on this first pallet and the face of the end contact of this substrate, this pressing mechanism is configured to the end face in the face of aforesaid substrate of the end contact that utilizes this and this substrate and exerts pressure, and the face of the end contact of above-mentioned and this substrate can be to the inner side of above-mentioned the first pallet and outside displacement;
The second pallet, can load and unload with respect to this second pallet in above-mentioned upper and lower first pallet of stating of state that erects at above-mentioned the first pallet,
In the time carrying aforesaid substrate, above-mentioned the first pallet and above-mentioned the second pallet are integrated.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010028136 | 2010-02-10 | ||
| JP2010-028136 | 2010-02-10 | ||
| JP2011016202A JP5731838B2 (en) | 2010-02-10 | 2011-01-28 | Tray-type substrate transfer system, film forming method, and electronic device manufacturing method |
| JP2011-016202 | 2011-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102190156A CN102190156A (en) | 2011-09-21 |
| CN102190156B true CN102190156B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110035701.5A Active CN102190156B (en) | 2010-02-10 | 2011-02-10 | Tray-type substrate conveying system, film formation method and manufacturing method of electronic device |
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| CN (1) | CN102190156B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103422061B (en) * | 2012-05-16 | 2016-01-27 | 深圳市正星光电技术有限公司 | A kind of coating process and equipment being applicable to large size and ultra-thin glass |
| CN108445653B (en) * | 2018-03-27 | 2021-01-15 | 武汉华星光电技术有限公司 | Transfer apparatus for transferring substrate and control method thereof |
| JP7063709B2 (en) * | 2018-04-27 | 2022-05-09 | 株式会社アルバック | Equipment for manufacturing substrates with transparent conductive film, manufacturing method for substrates with transparent conductive film |
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| CN1409156A (en) * | 2001-09-28 | 2003-04-09 | 安内华股份有限公司 | Base board transport room and base board treating device |
| CN1676445A (en) * | 2004-03-31 | 2005-10-05 | 安内华株式会社 | Substrate moving device |
| CN1800437A (en) * | 2005-01-05 | 2006-07-12 | 三星Sdi株式会社 | Apparatus for transferring a tray |
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| JP5145640B2 (en) * | 2006-02-03 | 2013-02-20 | 大日本印刷株式会社 | Substrate holder and film forming apparatus |
| JP5028837B2 (en) * | 2006-03-29 | 2012-09-19 | 大日本印刷株式会社 | Substrate holder and film forming apparatus |
| KR100935616B1 (en) * | 2009-04-30 | 2010-01-07 | 유진디스컴 주식회사 | Automated lcm assembly apparatus |
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| CN1409156A (en) * | 2001-09-28 | 2003-04-09 | 安内华股份有限公司 | Base board transport room and base board treating device |
| CN1841697A (en) * | 2001-09-28 | 2006-10-04 | 佳能安内华股份有限公司 | Substrate feed chamber and substrate processing apparatus |
| CN1676445A (en) * | 2004-03-31 | 2005-10-05 | 安内华株式会社 | Substrate moving device |
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