CN104752626A - 防水封装方法 - Google Patents

防水封装方法 Download PDF

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Publication number
CN104752626A
CN104752626A CN201510108961.9A CN201510108961A CN104752626A CN 104752626 A CN104752626 A CN 104752626A CN 201510108961 A CN201510108961 A CN 201510108961A CN 104752626 A CN104752626 A CN 104752626A
Authority
CN
China
Prior art keywords
layer
containing layers
silicon
light emitting
oled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510108961.9A
Other languages
English (en)
Chinese (zh)
Inventor
元泰景
乔斯·曼纽尔·迭格斯-坎波
桑杰伊·D·雅达夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN104752626A publication Critical patent/CN104752626A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
CN201510108961.9A 2008-03-13 2009-02-17 防水封装方法 Pending CN104752626A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
US61/036,230 2008-03-13
CN2009801086295A CN101971699A (zh) 2008-03-13 2009-02-17 防水封装方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2009801086295A Division CN101971699A (zh) 2008-03-13 2009-02-17 防水封装方法

Publications (1)

Publication Number Publication Date
CN104752626A true CN104752626A (zh) 2015-07-01

Family

ID=41062054

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510108961.9A Pending CN104752626A (zh) 2008-03-13 2009-02-17 防水封装方法
CN2009801086295A Pending CN101971699A (zh) 2008-03-13 2009-02-17 防水封装方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009801086295A Pending CN101971699A (zh) 2008-03-13 2009-02-17 防水封装方法

Country Status (6)

Country Link
US (2) US7951620B2 (https=)
JP (1) JP2011513944A (https=)
KR (1) KR101455047B1 (https=)
CN (2) CN104752626A (https=)
TW (1) TWI499106B (https=)
WO (1) WO2009114242A1 (https=)

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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
EP3020850B1 (en) 2009-07-08 2018-08-29 Aixtron SE Apparatus for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101698462B1 (ko) * 2011-02-07 2017-01-20 어플라이드 머티어리얼스, 인코포레이티드 유기 발광 다이오드를 캡슐화하기 위한 방법
TWI577066B (zh) 2011-02-08 2017-04-01 應用材料股份有限公司 有機發光二極體的混合式封裝方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN107113926B (zh) 2015-01-16 2019-02-05 夏普株式会社 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置
FR3098091B1 (fr) 2019-07-05 2021-06-04 Genialis Procede de deshydratation de produits liquides, semi-liquides ou pateux comprenant une etape de cryogenie sous pression et une etape de lyophilisation
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

Citations (8)

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US20010015620A1 (en) * 1998-12-16 2001-08-23 Affinito John D. Environmental barrier material for organic light emitting device and method of making
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
CN1675058A (zh) * 2002-08-07 2005-09-28 株式会社丰田中央研究所 具有粘合层的层压产品和具有保护膜的层压产品
CN1707787A (zh) * 2004-05-26 2005-12-14 台湾积体电路制造股份有限公司 半导体装置
CN1748006A (zh) * 2003-02-13 2006-03-15 Jds尤尼弗思公司 坚固的多层磁性颜料和箔
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
CN1992371A (zh) * 2005-12-30 2007-07-04 三星Sdi株式会社 有机发光装置及其制造方法
CN101128402A (zh) * 2004-12-17 2008-02-20 肖特股份公司 薄片的阻挡保护层

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JP4303011B2 (ja) * 2003-03-14 2009-07-29 オプトレックス株式会社 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
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JP5848862B2 (ja) 2004-06-25 2016-01-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ カプセル化膜の遮水性能の改善
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法
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US7560747B2 (en) * 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method

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Publication number Priority date Publication date Assignee Title
US20010015620A1 (en) * 1998-12-16 2001-08-23 Affinito John D. Environmental barrier material for organic light emitting device and method of making
CN1675058A (zh) * 2002-08-07 2005-09-28 株式会社丰田中央研究所 具有粘合层的层压产品和具有保护膜的层压产品
CN1748006A (zh) * 2003-02-13 2006-03-15 Jds尤尼弗思公司 坚固的多层磁性颜料和箔
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
CN1707787A (zh) * 2004-05-26 2005-12-14 台湾积体电路制造股份有限公司 半导体装置
CN101128402A (zh) * 2004-12-17 2008-02-20 肖特股份公司 薄片的阻挡保护层
CN1992371A (zh) * 2005-12-30 2007-07-04 三星Sdi株式会社 有机发光装置及其制造方法

Also Published As

Publication number Publication date
US20110297921A1 (en) 2011-12-08
KR101455047B1 (ko) 2014-10-27
KR20110007128A (ko) 2011-01-21
JP2011513944A (ja) 2011-04-28
US20090230425A1 (en) 2009-09-17
TWI499106B (zh) 2015-09-01
WO2009114242A1 (en) 2009-09-17
US7951620B2 (en) 2011-05-31
TW200950173A (en) 2009-12-01
US8404502B2 (en) 2013-03-26
CN101971699A (zh) 2011-02-09

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SE01 Entry into force of request for substantive examination
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Application publication date: 20150701