TWI499106B - 防水封裝方法 - Google Patents

防水封裝方法 Download PDF

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Publication number
TWI499106B
TWI499106B TW098107931A TW98107931A TWI499106B TW I499106 B TWI499106 B TW I499106B TW 098107931 A TW098107931 A TW 098107931A TW 98107931 A TW98107931 A TW 98107931A TW I499106 B TWI499106 B TW I499106B
Authority
TW
Taiwan
Prior art keywords
layer
emitting diode
light emitting
organic light
organic
Prior art date
Application number
TW098107931A
Other languages
English (en)
Chinese (zh)
Other versions
TW200950173A (en
Inventor
元泰景
坎波 荷西曼紐 迪耶古茲
懷特約翰Ｍ
葉達夫山傑
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200950173A publication Critical patent/TW200950173A/zh
Application granted granted Critical
Publication of TWI499106B publication Critical patent/TWI499106B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW098107931A 2008-03-13 2009-03-11 防水封裝方法 TWI499106B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13

Publications (2)

Publication Number Publication Date
TW200950173A TW200950173A (en) 2009-12-01
TWI499106B true TWI499106B (zh) 2015-09-01

Family

ID=41062054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098107931A TWI499106B (zh) 2008-03-13 2009-03-11 防水封裝方法

Country Status (6)

Country Link
US (2) US7951620B2 (https=)
JP (1) JP2011513944A (https=)
KR (1) KR101455047B1 (https=)
CN (2) CN104752626A (https=)
TW (1) TWI499106B (https=)
WO (1) WO2009114242A1 (https=)

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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
EP3020850B1 (en) 2009-07-08 2018-08-29 Aixtron SE Apparatus for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101698462B1 (ko) * 2011-02-07 2017-01-20 어플라이드 머티어리얼스, 인코포레이티드 유기 발광 다이오드를 캡슐화하기 위한 방법
TWI577066B (zh) 2011-02-08 2017-04-01 應用材料股份有限公司 有機發光二極體的混合式封裝方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN107113926B (zh) 2015-01-16 2019-02-05 夏普株式会社 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置
FR3098091B1 (fr) 2019-07-05 2021-06-04 Genialis Procede de deshydratation de produits liquides, semi-liquides ou pateux comprenant une etape de cryogenie sous pression et une etape de lyophilisation
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

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TW200635426A (en) * 2005-03-29 2006-10-01 Pioneer Tohoku Corp Self-light emitting panel and method for fabricating the same
CN1317421C (zh) * 2001-08-20 2007-05-23 诺华等离子公司 气体和蒸气低渗透性的涂层

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TW439308B (en) * 1998-12-16 2001-06-07 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
CN1317421C (zh) * 2001-08-20 2007-05-23 诺华等离子公司 气体和蒸气低渗透性的涂层
TW200635426A (en) * 2005-03-29 2006-10-01 Pioneer Tohoku Corp Self-light emitting panel and method for fabricating the same

Also Published As

Publication number Publication date
US20110297921A1 (en) 2011-12-08
CN104752626A (zh) 2015-07-01
KR101455047B1 (ko) 2014-10-27
KR20110007128A (ko) 2011-01-21
JP2011513944A (ja) 2011-04-28
US20090230425A1 (en) 2009-09-17
WO2009114242A1 (en) 2009-09-17
US7951620B2 (en) 2011-05-31
TW200950173A (en) 2009-12-01
US8404502B2 (en) 2013-03-26
CN101971699A (zh) 2011-02-09

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