KR101455047B1 - 물 배리어 캡슐화 방법 - Google Patents

물 배리어 캡슐화 방법 Download PDF

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Publication number
KR101455047B1
KR101455047B1 KR1020107022767A KR20107022767A KR101455047B1 KR 101455047 B1 KR101455047 B1 KR 101455047B1 KR 1020107022767 A KR1020107022767 A KR 1020107022767A KR 20107022767 A KR20107022767 A KR 20107022767A KR 101455047 B1 KR101455047 B1 KR 101455047B1
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South Korea
Prior art keywords
light emitting
emitting diode
organic light
layer
layers
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KR1020107022767A
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Korean (ko)
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KR20110007128A (ko
Inventor
태경 원
호세 마누엘 디귀즈 캄포
산자이 디. 야다브
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어플라이드 머티어리얼스, 인코포레이티드
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0448Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/15Hole transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020107022767A 2008-03-13 2009-02-17 물 배리어 캡슐화 방법 Active KR101455047B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
US61/036,230 2008-03-13
PCT/US2009/034266 WO2009114242A1 (en) 2008-03-13 2009-02-17 Water-barrier encapsulation method

Publications (2)

Publication Number Publication Date
KR20110007128A KR20110007128A (ko) 2011-01-21
KR101455047B1 true KR101455047B1 (ko) 2014-10-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107022767A Active KR101455047B1 (ko) 2008-03-13 2009-02-17 물 배리어 캡슐화 방법

Country Status (6)

Country Link
US (2) US7951620B2 (https=)
JP (1) JP2011513944A (https=)
KR (1) KR101455047B1 (https=)
CN (2) CN104752626A (https=)
TW (1) TWI499106B (https=)
WO (1) WO2009114242A1 (https=)

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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
EP3020850B1 (en) 2009-07-08 2018-08-29 Aixtron SE Apparatus for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101698462B1 (ko) * 2011-02-07 2017-01-20 어플라이드 머티어리얼스, 인코포레이티드 유기 발광 다이오드를 캡슐화하기 위한 방법
TWI577066B (zh) 2011-02-08 2017-04-01 應用材料股份有限公司 有機發光二極體的混合式封裝方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN107113926B (zh) 2015-01-16 2019-02-05 夏普株式会社 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Joled 有機el表示パネルの製造方法及び封止層形成装置
FR3098091B1 (fr) 2019-07-05 2021-06-04 Genialis Procede de deshydratation de produits liquides, semi-liquides ou pateux comprenant une etape de cryogenie sous pression et une etape de lyophilisation
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

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JP2002532850A (ja) 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004281189A (ja) 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
US20040238846A1 (en) 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
JP2004537448A (ja) 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング

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US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
WO2000036665A1 (en) * 1998-12-16 2000-06-22 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
AU2003254851A1 (en) 2002-08-07 2004-02-25 Kabushiki Kaisha Toyota Chuo Kenkyusho Laminate having adherent layer and laminate having protective film
US7169472B2 (en) * 2003-02-13 2007-01-30 Jds Uniphase Corporation Robust multilayer magnetic pigments and foils
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
US20050266679A1 (en) * 2004-05-26 2005-12-01 Jing-Cheng Lin Barrier structure for semiconductor devices
US7214600B2 (en) 2004-06-25 2007-05-08 Applied Materials, Inc. Method to improve transmittance of an encapsulating film
US7220687B2 (en) 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
JP5848862B2 (ja) 2004-06-25 2016-01-27 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated カプセル化膜の遮水性能の改善
DE102004061464B4 (de) * 2004-12-17 2008-12-11 Schott Ag Substrat mit feinlaminarer Barriereschutzschicht und Verfahren zu dessen Herstellung
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法
JP4600254B2 (ja) 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
US8003999B2 (en) * 2005-12-30 2011-08-23 Samsung Mobile Display Co., Ltd. Organic light emitting device
CN101045395A (zh) 2006-03-24 2007-10-03 应用材料股份有限公司 用于采用多组打印头的喷墨打印的方法和装置
US7560747B2 (en) * 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2002532850A (ja) 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004537448A (ja) 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング
JP2004281189A (ja) 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
US20040238846A1 (en) 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device

Also Published As

Publication number Publication date
US20110297921A1 (en) 2011-12-08
CN104752626A (zh) 2015-07-01
KR20110007128A (ko) 2011-01-21
JP2011513944A (ja) 2011-04-28
US20090230425A1 (en) 2009-09-17
TWI499106B (zh) 2015-09-01
WO2009114242A1 (en) 2009-09-17
US7951620B2 (en) 2011-05-31
TW200950173A (en) 2009-12-01
US8404502B2 (en) 2013-03-26
CN101971699A (zh) 2011-02-09

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