CN104655117B - 封装件、物理量传感器、电子设备及移动体 - Google Patents

封装件、物理量传感器、电子设备及移动体 Download PDF

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Publication number
CN104655117B
CN104655117B CN201410676341.0A CN201410676341A CN104655117B CN 104655117 B CN104655117 B CN 104655117B CN 201410676341 A CN201410676341 A CN 201410676341A CN 104655117 B CN104655117 B CN 104655117B
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wiring
base
terminal
substrate
physical quantity
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Chinese (zh)
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CN104655117A (zh
Inventor
青木信也
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Seiko Epson Corp
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Seiko Epson Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5628—Manufacturing; Trimming; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Manufacturing & Machinery (AREA)
  • Gyroscopes (AREA)
CN201410676341.0A 2013-11-25 2014-11-21 封装件、物理量传感器、电子设备及移动体 Active CN104655117B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-242556 2013-11-25
JP2013242556A JP6357758B2 (ja) 2013-11-25 2013-11-25 物理量センサー、電子機器および移動体

Publications (2)

Publication Number Publication Date
CN104655117A CN104655117A (zh) 2015-05-27
CN104655117B true CN104655117B (zh) 2019-09-06

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US (1) US9823071B2 (https=)
JP (1) JP6357758B2 (https=)
CN (1) CN104655117B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6641874B2 (ja) * 2015-10-20 2020-02-05 セイコーエプソン株式会社 物理量検出装置、電子機器および移動体
JP6805697B2 (ja) * 2016-10-03 2020-12-23 セイコーエプソン株式会社 電子部品用パッケージ、発振器、電子機器、および移動体
JP6819216B2 (ja) * 2016-10-26 2021-01-27 セイコーエプソン株式会社 ジャイロセンサー、ジャイロセンサーの製造方法、電子機器および移動体
JP6926568B2 (ja) * 2017-03-24 2021-08-25 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP7119478B2 (ja) 2018-03-23 2022-08-17 セイコーエプソン株式会社 回路装置、物理量測定装置、電子機器及び移動体
JP2019174234A (ja) * 2018-03-28 2019-10-10 セイコーエプソン株式会社 センサー素子、センサーデバイス、力検出装置、およびロボット
JP2020139879A (ja) 2019-02-28 2020-09-03 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
JP7251383B2 (ja) * 2019-07-29 2023-04-04 セイコーエプソン株式会社 振動デバイス、電子機器および移動体
US11522120B1 (en) * 2021-07-02 2022-12-06 Yoketan Corp. Micro crystal oscillator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102132128A (zh) * 2008-09-02 2011-07-20 株式会社村田制作所 音叉振荡器和其制造方法以及角速度传感器
CN102401653A (zh) * 2010-09-07 2012-04-04 精工爱普生株式会社 角速度检测装置以及电子设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284605A (ja) * 1997-04-08 1998-10-23 Mitsubishi Electric Corp 半導体集積回路およびセルベース方式によりレイアウト設計された半導体集積回路
WO2005019790A1 (ja) * 2003-08-26 2005-03-03 Matsushita Electric Works, Ltd. センサ装置
JP4237611B2 (ja) * 2003-12-22 2009-03-11 東芝マイクロエレクトロニクス株式会社 半導体集積回路のレイアウト設計方法及びレイアウト設計装置
JP2005241380A (ja) 2004-02-25 2005-09-08 Seiko Epson Corp 圧電デバイスならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
US20070164378A1 (en) * 2006-01-13 2007-07-19 Honeywell International Inc. Integrated mems package
JP5092462B2 (ja) * 2006-06-13 2012-12-05 株式会社デンソー 力学量センサ
JP5186774B2 (ja) 2007-02-15 2013-04-24 セイコーエプソン株式会社 電荷検出型センサおよびそれに用いるパッケージ容器
EP2011762B1 (en) * 2007-07-02 2015-09-30 Denso Corporation Semiconductor device with a sensor connected to an external element
JP5487672B2 (ja) * 2009-03-27 2014-05-07 パナソニック株式会社 物理量センサ
JP5368181B2 (ja) * 2009-06-12 2013-12-18 セイコーエプソン株式会社 物理量検出装置並びに物理量検出装置の制御方法、異常診断システム及び異常診断方法
TW201103107A (en) * 2009-07-07 2011-01-16 Jung-Tang Huang Method for packaging micromachined devices
US20120109574A1 (en) * 2010-10-27 2012-05-03 Mihai-Costin Manolescu Multi-dimensional vector determining circuit in a sensor integrated circuit package
JP2012098033A (ja) * 2010-10-29 2012-05-24 Panasonic Corp 角速度センサ
JP5678727B2 (ja) * 2011-03-03 2015-03-04 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、電子機器
JP2013156127A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 振動片、振動デバイス、物理量検出装置、および電子機器
JP2013178179A (ja) * 2012-02-28 2013-09-09 Seiko Epson Corp センサー素子、センサーデバイスおよび電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102132128A (zh) * 2008-09-02 2011-07-20 株式会社村田制作所 音叉振荡器和其制造方法以及角速度传感器
CN102401653A (zh) * 2010-09-07 2012-04-04 精工爱普生株式会社 角速度检测装置以及电子设备

Also Published As

Publication number Publication date
US9823071B2 (en) 2017-11-21
JP2015102403A (ja) 2015-06-04
CN104655117A (zh) 2015-05-27
JP6357758B2 (ja) 2018-07-18
US20150143903A1 (en) 2015-05-28

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