CN104655117B - 封装件、物理量传感器、电子设备及移动体 - Google Patents
封装件、物理量传感器、电子设备及移动体 Download PDFInfo
- Publication number
- CN104655117B CN104655117B CN201410676341.0A CN201410676341A CN104655117B CN 104655117 B CN104655117 B CN 104655117B CN 201410676341 A CN201410676341 A CN 201410676341A CN 104655117 B CN104655117 B CN 104655117B
- Authority
- CN
- China
- Prior art keywords
- wiring
- terminal
- substrate
- physical quantity
- internal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 claims abstract description 173
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- 238000004806 packaging method and process Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 204
- 239000008186 active pharmaceutical agent Substances 0.000 description 29
- 239000000853 adhesive Substances 0.000 description 29
- 230000001070 adhesive effect Effects 0.000 description 29
- 102100036285 25-hydroxyvitamin D-1 alpha hydroxylase, mitochondrial Human genes 0.000 description 26
- 101000875403 Homo sapiens 25-hydroxyvitamin D-1 alpha hydroxylase, mitochondrial Proteins 0.000 description 26
- 230000000694 effects Effects 0.000 description 14
- 241000251131 Sphyrna Species 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000006870 function Effects 0.000 description 11
- 239000000470 constituent Substances 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5628—Manufacturing; Trimming; Mounting; Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-242556 | 2013-11-25 | ||
| JP2013242556A JP6357758B2 (ja) | 2013-11-25 | 2013-11-25 | 物理量センサー、電子機器および移動体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104655117A CN104655117A (zh) | 2015-05-27 |
| CN104655117B true CN104655117B (zh) | 2019-09-06 |
Family
ID=53181520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410676341.0A Active CN104655117B (zh) | 2013-11-25 | 2014-11-21 | 封装件、物理量传感器、电子设备及移动体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9823071B2 (enExample) |
| JP (1) | JP6357758B2 (enExample) |
| CN (1) | CN104655117B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6641874B2 (ja) * | 2015-10-20 | 2020-02-05 | セイコーエプソン株式会社 | 物理量検出装置、電子機器および移動体 |
| JP6805697B2 (ja) * | 2016-10-03 | 2020-12-23 | セイコーエプソン株式会社 | 電子部品用パッケージ、発振器、電子機器、および移動体 |
| JP6819216B2 (ja) * | 2016-10-26 | 2021-01-27 | セイコーエプソン株式会社 | ジャイロセンサー、ジャイロセンサーの製造方法、電子機器および移動体 |
| JP6926568B2 (ja) * | 2017-03-24 | 2021-08-25 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
| JP7119478B2 (ja) | 2018-03-23 | 2022-08-17 | セイコーエプソン株式会社 | 回路装置、物理量測定装置、電子機器及び移動体 |
| JP2019174234A (ja) * | 2018-03-28 | 2019-10-10 | セイコーエプソン株式会社 | センサー素子、センサーデバイス、力検出装置、およびロボット |
| JP2020139879A (ja) | 2019-02-28 | 2020-09-03 | セイコーエプソン株式会社 | 慣性センサー、電子機器および移動体 |
| JP7251383B2 (ja) * | 2019-07-29 | 2023-04-04 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
| US11522120B1 (en) * | 2021-07-02 | 2022-12-06 | Yoketan Corp. | Micro crystal oscillator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102132128A (zh) * | 2008-09-02 | 2011-07-20 | 株式会社村田制作所 | 音叉振荡器和其制造方法以及角速度传感器 |
| CN102401653A (zh) * | 2010-09-07 | 2012-04-04 | 精工爱普生株式会社 | 角速度检测装置以及电子设备 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284605A (ja) | 1997-04-08 | 1998-10-23 | Mitsubishi Electric Corp | 半導体集積回路およびセルベース方式によりレイアウト設計された半導体集積回路 |
| CN100381804C (zh) * | 2003-08-26 | 2008-04-16 | 松下电工株式会社 | 传感器装置 |
| JP4237611B2 (ja) * | 2003-12-22 | 2009-03-11 | 東芝マイクロエレクトロニクス株式会社 | 半導体集積回路のレイアウト設計方法及びレイアウト設計装置 |
| JP2005241380A (ja) | 2004-02-25 | 2005-09-08 | Seiko Epson Corp | 圧電デバイスならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
| US20070164378A1 (en) * | 2006-01-13 | 2007-07-19 | Honeywell International Inc. | Integrated mems package |
| JP5092462B2 (ja) * | 2006-06-13 | 2012-12-05 | 株式会社デンソー | 力学量センサ |
| JP5186774B2 (ja) | 2007-02-15 | 2013-04-24 | セイコーエプソン株式会社 | 電荷検出型センサおよびそれに用いるパッケージ容器 |
| EP2011762B1 (en) * | 2007-07-02 | 2015-09-30 | Denso Corporation | Semiconductor device with a sensor connected to an external element |
| JP5487672B2 (ja) * | 2009-03-27 | 2014-05-07 | パナソニック株式会社 | 物理量センサ |
| JP5368181B2 (ja) * | 2009-06-12 | 2013-12-18 | セイコーエプソン株式会社 | 物理量検出装置並びに物理量検出装置の制御方法、異常診断システム及び異常診断方法 |
| TW201103107A (en) * | 2009-07-07 | 2011-01-16 | Jung-Tang Huang | Method for packaging micromachined devices |
| US20120109574A1 (en) * | 2010-10-27 | 2012-05-03 | Mihai-Costin Manolescu | Multi-dimensional vector determining circuit in a sensor integrated circuit package |
| JP2012098033A (ja) * | 2010-10-29 | 2012-05-24 | Panasonic Corp | 角速度センサ |
| JP5678727B2 (ja) * | 2011-03-03 | 2015-03-04 | セイコーエプソン株式会社 | 振動デバイス、振動デバイスの製造方法、電子機器 |
| JP2013156127A (ja) * | 2012-01-30 | 2013-08-15 | Seiko Epson Corp | 振動片、振動デバイス、物理量検出装置、および電子機器 |
| JP2013178179A (ja) * | 2012-02-28 | 2013-09-09 | Seiko Epson Corp | センサー素子、センサーデバイスおよび電子機器 |
-
2013
- 2013-11-25 JP JP2013242556A patent/JP6357758B2/ja active Active
-
2014
- 2014-11-21 CN CN201410676341.0A patent/CN104655117B/zh active Active
- 2014-11-24 US US14/551,610 patent/US9823071B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102132128A (zh) * | 2008-09-02 | 2011-07-20 | 株式会社村田制作所 | 音叉振荡器和其制造方法以及角速度传感器 |
| CN102401653A (zh) * | 2010-09-07 | 2012-04-04 | 精工爱普生株式会社 | 角速度检测装置以及电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6357758B2 (ja) | 2018-07-18 |
| JP2015102403A (ja) | 2015-06-04 |
| US20150143903A1 (en) | 2015-05-28 |
| CN104655117A (zh) | 2015-05-27 |
| US9823071B2 (en) | 2017-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104655117B (zh) | 封装件、物理量传感器、电子设备及移动体 | |
| JP6957921B2 (ja) | 振動デバイス、角速度センサー、電子機器および移動体 | |
| JP6318590B2 (ja) | 振動素子、振動子、振動デバイス、電子機器および移動体 | |
| CN102901493B (zh) | 振动器件以及电子设备 | |
| US11650054B2 (en) | Vibrator device, electronic apparatus, and vehicle | |
| US20220236058A1 (en) | Vibrator Device, Electronic Apparatus, And Vehicle | |
| US20180283865A1 (en) | Sensor element, sensor, electronic apparatus, and vehicle | |
| JP6357759B2 (ja) | パッケージ、物理量センサー、電子機器および移動体 | |
| JP6167474B2 (ja) | センサーデバイスおよび電子機器 | |
| JP6753435B2 (ja) | 物理量センサー、電子機器および移動体 | |
| JP7552770B2 (ja) | 振動デバイス、電子機器および移動体 | |
| JP2021032841A (ja) | 振動デバイス、電子機器および移動体 | |
| JP2017015584A (ja) | 電子デバイス、電子デバイスの製造方法、電子機器、および移動体 | |
| US10393524B2 (en) | Electronic device, electronic apparatus, and moving object | |
| JP6442984B2 (ja) | 物理量検出振動素子、物理量センサー、電子機器および移動体 | |
| JP6939007B2 (ja) | センサー、電子機器および移動体 | |
| JP6464662B2 (ja) | 物理量検出振動素子、物理量センサー、電子機器および移動体 | |
| JP6488639B2 (ja) | 電子デバイス、電子機器および移動体 | |
| JP6488640B2 (ja) | 電子デバイス、電子機器および移動体 | |
| JP6492535B2 (ja) | 物理量センサー、電子機器および移動体 | |
| JP6911446B2 (ja) | センサー素子、センサー、電子機器および移動体 | |
| JP2016085185A (ja) | センサー素子、物理量センサー、電子機器および移動体 | |
| JP2016085177A (ja) | 電子デバイス、電子機器および移動体 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |