CN104639088B - 盖体、封装、电子设备、移动体以及封装的制造方法 - Google Patents

盖体、封装、电子设备、移动体以及封装的制造方法 Download PDF

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Publication number
CN104639088B
CN104639088B CN201410643722.9A CN201410643722A CN104639088B CN 104639088 B CN104639088 B CN 104639088B CN 201410643722 A CN201410643722 A CN 201410643722A CN 104639088 B CN104639088 B CN 104639088B
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package
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groove
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CN104639088A (zh
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松泽寿一郎
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Seiko Epson Corp
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201410643722.9A 2013-11-11 2014-11-10 盖体、封装、电子设备、移动体以及封装的制造方法 Active CN104639088B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910725387.XA CN110379773B (zh) 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013232791A JP6318556B2 (ja) 2013-11-11 2013-11-11 パッケージの製造方法および電子デバイスの製造方法
JP2013-232791 2013-11-11

Related Child Applications (1)

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CN201910725387.XA Division CN110379773B (zh) 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法

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CN104639088A CN104639088A (zh) 2015-05-20
CN104639088B true CN104639088B (zh) 2019-09-06

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CN201410643722.9A Active CN104639088B (zh) 2013-11-11 2014-11-10 盖体、封装、电子设备、移动体以及封装的制造方法
CN201910725387.XA Active CN110379773B (zh) 2013-11-11 2014-11-10 封装、电子设备、移动体和封装的制造方法

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US (1) US9516773B2 (enrdf_load_stackoverflow)
JP (1) JP6318556B2 (enrdf_load_stackoverflow)
CN (2) CN104639088B (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
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JP2014216123A (ja) * 2013-04-24 2014-11-17 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体及びその実装構造
JP2015087282A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP2015088644A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
JP2015088643A (ja) * 2013-10-31 2015-05-07 セイコーエプソン株式会社 電子デバイスの製造方法、電子デバイス、電子機器、移動体、および蓋体
CN109979824B (zh) * 2018-12-04 2020-05-15 江苏长电科技股份有限公司 一种陶瓷封装陶瓷盖的定位贴装方法

Citations (4)

* Cited by examiner, † Cited by third party
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JP2004304017A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 電子部品パッケ−ジ
JP2008153485A (ja) * 2006-12-19 2008-07-03 Epson Toyocom Corp 電子部品の製造方法
CN102123570A (zh) * 2010-01-09 2011-07-13 鸿富锦精密工业（深圳）有限公司 电子装置
WO2013129444A1 (ja) * 2012-02-27 2013-09-06 株式会社フジクラ 圧力センサモジュール及び蓋体

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JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
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JP3567822B2 (ja) * 1999-10-29 2004-09-22 株式会社村田製作所 電子部品と通信機装置および電子部品の製造方法
JP2001274649A (ja) 2000-03-24 2001-10-05 Daishinku Corp 水晶振動デバイスの気密封止方法
JP4277259B2 (ja) 2003-04-11 2009-06-10 セイコーエプソン株式会社 圧電デバイスおよび圧電デバイスの製造方法
US7342298B1 (en) * 2004-03-09 2008-03-11 Xilinx, Inc. Metal lid with improved adhesion to package substrate
JP2005353885A (ja) 2004-06-11 2005-12-22 Seiko Epson Corp 電子デバイスの製造方法
JP2006073679A (ja) 2004-08-31 2006-03-16 Citizen Watch Co Ltd 電子部品封止体の製造方法および製造装置
JP4244053B2 (ja) * 2006-06-16 2009-03-25 エプソントヨコム株式会社 圧電デバイスを備えた電子モジュール
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JP4893578B2 (ja) 2007-10-17 2012-03-07 株式会社大真空 電子部品の封止方法
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JP2004304017A (ja) * 2003-03-31 2004-10-28 Kyocera Kinseki Corp 電子部品パッケ−ジ
JP2008153485A (ja) * 2006-12-19 2008-07-03 Epson Toyocom Corp 電子部品の製造方法
CN102123570A (zh) * 2010-01-09 2011-07-13 鸿富锦精密工业（深圳）有限公司 电子装置
WO2013129444A1 (ja) * 2012-02-27 2013-09-06 株式会社フジクラ 圧力センサモジュール及び蓋体

Also Published As

Publication number Publication date
US20150130548A1 (en) 2015-05-14
CN110379773B (zh) 2023-04-21
JP2015094614A (ja) 2015-05-18
CN104639088A (zh) 2015-05-20
CN110379773A (zh) 2019-10-25
US9516773B2 (en) 2016-12-06
JP6318556B2 (ja) 2018-05-09

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