CN104271812B - 金属箔 - Google Patents

金属箔 Download PDF

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Publication number
CN104271812B
CN104271812B CN201380018605.7A CN201380018605A CN104271812B CN 104271812 B CN104271812 B CN 104271812B CN 201380018605 A CN201380018605 A CN 201380018605A CN 104271812 B CN104271812 B CN 104271812B
Authority
CN
China
Prior art keywords
metal foil
coating layer
alloy
foil
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380018605.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN104271812A (zh
Inventor
森山晃正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN104271812A publication Critical patent/CN104271812A/zh
Application granted granted Critical
Publication of CN104271812B publication Critical patent/CN104271812B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201380018605.7A 2012-03-30 2013-02-28 金属箔 Active CN104271812B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012083265A JP5858849B2 (ja) 2012-03-30 2012-03-30 金属箔
JP2012-083265 2012-03-30
PCT/JP2013/055572 WO2013146088A1 (ja) 2012-03-30 2013-02-28 金属箔

Publications (2)

Publication Number Publication Date
CN104271812A CN104271812A (zh) 2015-01-07
CN104271812B true CN104271812B (zh) 2016-10-05

Family

ID=49259363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380018605.7A Active CN104271812B (zh) 2012-03-30 2013-02-28 金属箔

Country Status (5)

Country Link
JP (1) JP5858849B2 (enExample)
KR (2) KR20140141704A (enExample)
CN (1) CN104271812B (enExample)
TW (1) TWI481746B (enExample)
WO (1) WO2013146088A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY183238A (en) * 2015-03-24 2021-02-18 Mitsui Mining & Smelting Co Ltd Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6683507B2 (ja) * 2015-07-22 2020-04-22 サトーホールディングス株式会社 ラベルを用いた加工物の生産を管理する方法
JP6594108B2 (ja) * 2015-08-25 2019-10-23 サトーホールディングス株式会社 ラベル、および、当該ラベルを用いた加工物の生産を管理する方法
JP6605271B2 (ja) * 2015-09-24 2019-11-13 Ｊｘ金属株式会社 離型層付き電解銅箔、積層体、半導体パッケージの製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
JP6782116B2 (ja) * 2016-08-02 2020-11-11 古河電気工業株式会社 銀被覆材料
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7251927B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
EP4166696A4 (en) * 2021-09-03 2023-08-09 Contemporary Amperex Technology Co., Limited Metal foil and method for preparing same, and current collector, electrode, battery and electric device
CA3172018A1 (en) 2021-12-24 2023-06-24 Circuit Foil Luxembourg Electrolytic copper foil and secondary battery comprising the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053818A (zh) * 1989-09-13 1991-08-14 古尔德有限公司 用于印刷电路板且其性质得到控制的箔片以及生产该箔片的工艺方法和电解液
US5834140A (en) * 1995-09-22 1998-11-10 Circuit Foil Japan Co., Ltd. Electrodeposited copper foil for fine pattern and method for producing the same
JP2004226615A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd 現像装置およびこれを使用する画像形成装置
CN1551710B (zh) * 2003-02-12 2010-06-02 古河电气工业株式会社 精密图形印刷布线用铜箔及其制造方法
JP2011123290A (ja) * 2009-12-10 2011-06-23 Fuji Xerox Co Ltd 画像形成装置および定着装置
CN102215632A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板
CN102224281A (zh) * 2008-11-25 2011-10-19 吉坤日矿日石金属株式会社 印刷电路用铜箔
JP2011216598A (ja) * 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69125573T2 (de) * 1990-05-30 1997-07-17 Gould Electronics Inc ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN
JPH1036992A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔及びその製造方法
JP4445616B2 (ja) * 1999-10-27 2010-04-07 Ｄｏｗａホールディングス株式会社 電解銅箔
JP4419161B2 (ja) * 1999-10-27 2010-02-24 Ｄｏｗａホールディングス株式会社 電解銅箔の製造方法
JP4172704B2 (ja) 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
US20090208762A1 (en) * 2005-06-23 2009-08-20 Nippon Mining & Metals Co., Ltd. Copper Foil for Printed Wiring Board
JP2009170771A (ja) 2008-01-18 2009-07-30 Toppan Printing Co Ltd 太陽電池バックシート及び太陽電池モジュール
JP2011061151A (ja) 2009-09-14 2011-03-24 Toppan Printing Co Ltd 太陽電池用裏面保護シートおよびその製造方法、太陽電池モジュール
CN102666939B (zh) * 2009-12-24 2015-08-19 吉坤日矿日石金属株式会社 表面处理铜箔
JP5634103B2 (ja) 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1053818A (zh) * 1989-09-13 1991-08-14 古尔德有限公司 用于印刷电路板且其性质得到控制的箔片以及生产该箔片的工艺方法和电解液
US5834140A (en) * 1995-09-22 1998-11-10 Circuit Foil Japan Co., Ltd. Electrodeposited copper foil for fine pattern and method for producing the same
JP2004226615A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd 現像装置およびこれを使用する画像形成装置
CN1551710B (zh) * 2003-02-12 2010-06-02 古河电气工业株式会社 精密图形印刷布线用铜箔及其制造方法
CN102224281A (zh) * 2008-11-25 2011-10-19 吉坤日矿日石金属株式会社 印刷电路用铜箔
JP2011123290A (ja) * 2009-12-10 2011-06-23 Fuji Xerox Co Ltd 画像形成装置および定着装置
JP2011216598A (ja) * 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板
CN102215632A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板

Also Published As

Publication number Publication date
CN104271812A (zh) 2015-01-07
TW201343976A (zh) 2013-11-01
JP5858849B2 (ja) 2016-02-10
WO2013146088A1 (ja) 2013-10-03
KR102095619B1 (ko) 2020-03-31
JP2013213250A (ja) 2013-10-17
KR20160137678A (ko) 2016-11-30
KR20140141704A (ko) 2014-12-10
TWI481746B (zh) 2015-04-21

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: JX NIPPON MINING & METALS CORPORATION

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Co., Ltd.

CP01 Change in the name or title of a patent holder
CP02 Change in the address of a patent holder

Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JKS Metal Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: JKS Metal Co.,Ltd.

CP02 Change in the address of a patent holder