CN103562440B - 液晶聚合物覆铜层压板及该层压板中使用的铜箔 - Google Patents
液晶聚合物覆铜层压板及该层压板中使用的铜箔 Download PDFInfo
- Publication number
- CN103562440B CN103562440B CN201280025459.6A CN201280025459A CN103562440B CN 103562440 B CN103562440 B CN 103562440B CN 201280025459 A CN201280025459 A CN 201280025459A CN 103562440 B CN103562440 B CN 103562440B
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- copper foil
- offspring
- primary particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-127772 | 2011-06-07 | ||
JP2011127772A JP5654416B2 (ja) | 2011-06-07 | 2011-06-07 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
PCT/JP2012/056318 WO2012169249A1 (ja) | 2011-06-07 | 2012-03-12 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103562440A CN103562440A (zh) | 2014-02-05 |
CN103562440B true CN103562440B (zh) | 2016-04-06 |
Family
ID=47295823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280025459.6A Active CN103562440B (zh) | 2011-06-07 | 2012-03-12 | 液晶聚合物覆铜层压板及该层压板中使用的铜箔 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9060431B2 (zh) |
EP (1) | EP2719799A1 (zh) |
JP (1) | JP5654416B2 (zh) |
KR (2) | KR20150065927A (zh) |
CN (1) | CN103562440B (zh) |
MY (1) | MY163318A (zh) |
SG (1) | SG189489A1 (zh) |
TW (2) | TWI589434B (zh) |
WO (1) | WO2012169249A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102884228B (zh) * | 2010-05-07 | 2015-11-25 | 吉坤日矿日石金属株式会社 | 印刷电路用铜箔 |
KR101740092B1 (ko) | 2010-09-27 | 2017-05-25 | 제이엑스금속주식회사 | 프린트 배선판용 구리박, 그 제조 방법, 프린트 배선판용 수지 기판 및 프린트 배선판 |
WO2013065730A2 (ja) * | 2011-11-04 | 2013-05-10 | Jx日鉱日石金属株式会社 | 印刷回路用銅箔 |
US9674955B2 (en) * | 2011-11-09 | 2017-06-06 | Lg Innotek Co., Ltd. | Tape carrier package, method of manufacturing the same and chip package |
JP6511225B2 (ja) * | 2013-04-26 | 2019-05-15 | Jx金属株式会社 | 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法 |
JP2014224313A (ja) * | 2013-04-26 | 2014-12-04 | Jx日鉱日石金属株式会社 | 高周波回路用銅箔、高周波回路用銅張積層板、高周波回路用プリント配線板、高周波回路用キャリア付銅箔、電子機器、及びプリント配線板の製造方法 |
EP3011569B1 (en) * | 2013-06-20 | 2020-11-11 | Lg Electronics Inc. | Conductive film and touch panel including the same |
JP6335449B2 (ja) * | 2013-07-24 | 2018-05-30 | Jx金属株式会社 | キャリア付銅箔、銅張積層板の製造方法及びプリント配線板の製造方法 |
JP2015134953A (ja) * | 2014-01-17 | 2015-07-27 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
CN107429417B (zh) * | 2015-03-31 | 2019-11-22 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板 |
JP6178360B2 (ja) * | 2015-05-11 | 2017-08-09 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント回路板の製造方法、銅張積層板の製造方法及びプリント配線板の製造方法 |
JP6083619B2 (ja) * | 2015-07-29 | 2017-02-22 | 福田金属箔粉工業株式会社 | 低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
US9647272B1 (en) * | 2016-01-14 | 2017-05-09 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
JP2017193778A (ja) * | 2016-04-15 | 2017-10-26 | Jx金属株式会社 | 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7178634B2 (ja) * | 2016-05-20 | 2022-11-28 | パナソニックIpマネジメント株式会社 | 金属張積層板の製造方法、電子回路基板の製造方法 |
JP7033905B2 (ja) * | 2017-02-07 | 2022-03-11 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP2017133105A (ja) * | 2017-03-06 | 2017-08-03 | Jx金属株式会社 | キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
CN108060439A (zh) * | 2017-12-01 | 2018-05-22 | 马鞍山市鑫龙特钢有限公司 | 一种耐磨耐热低合金钢的制备方法 |
EP3786315A4 (en) | 2018-04-27 | 2022-04-20 | JX Nippon Mining & Metals Corporation | SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD |
JP7267567B2 (ja) * | 2018-10-31 | 2023-05-02 | ユニチカ株式会社 | 低誘電率ポリイミド |
JP7392996B2 (ja) * | 2019-06-19 | 2023-12-06 | 金居開發股▲分▼有限公司 | アドバンスド電解銅箔及びそれを適用した銅張積層板 |
US11408087B2 (en) | 2019-06-19 | 2022-08-09 | Co-Tech Development Corp. | Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same |
TWI776168B (zh) * | 2019-06-19 | 2022-09-01 | 金居開發股份有限公司 | 進階反轉電解銅箔及應用其的銅箔基板 |
CN111002644B (zh) * | 2019-12-20 | 2022-02-22 | 江门市德众泰工程塑胶科技有限公司 | 一种低介电、高剥离强度的覆铜板的制备方法 |
KR20230121612A (ko) * | 2020-12-21 | 2023-08-18 | 아이오닉 머터리얼스, 인코퍼레이션 | 액정 고분자 복합재, 액정 고분자 복합재 필름, 및그를 포함하는 금속 클래드 라미네이트 |
CN113529078A (zh) * | 2021-06-07 | 2021-10-22 | 深圳市南斗星科技有限公司 | 屏蔽盖的制作方法和屏蔽盖 |
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JPH10341066A (ja) * | 1997-06-10 | 1998-12-22 | Furukawa Electric Co Ltd:The | 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板 |
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JP5318886B2 (ja) | 2008-11-25 | 2013-10-16 | Jx日鉱日石金属株式会社 | 印刷回路用銅箔 |
KR20120003458A (ko) * | 2009-04-24 | 2012-01-10 | 스미토모 덴키 고교 가부시키가이샤 | 프린트 배선판용 기판, 프린트 배선판, 및 그들의 제조방법 |
US20120107637A1 (en) | 2009-06-05 | 2012-05-03 | Jx Nippon Mining & Metals Corporation | Copper Foil for Semiconductor Package Substrate and Substrate for Semiconductor Package |
CN102884228B (zh) | 2010-05-07 | 2015-11-25 | 吉坤日矿日石金属株式会社 | 印刷电路用铜箔 |
-
2011
- 2011-06-07 JP JP2011127772A patent/JP5654416B2/ja active Active
-
2012
- 2012-03-12 KR KR1020157013962A patent/KR20150065927A/ko not_active Application Discontinuation
- 2012-03-12 KR KR1020137014530A patent/KR101853519B1/ko active IP Right Grant
- 2012-03-12 SG SG2013030176A patent/SG189489A1/en unknown
- 2012-03-12 MY MYPI2013001478A patent/MY163318A/en unknown
- 2012-03-12 WO PCT/JP2012/056318 patent/WO2012169249A1/ja active Application Filing
- 2012-03-12 EP EP12797597.7A patent/EP2719799A1/en not_active Withdrawn
- 2012-03-12 CN CN201280025459.6A patent/CN103562440B/zh active Active
- 2012-03-12 US US13/824,478 patent/US9060431B2/en active Active
- 2012-06-04 TW TW104125386A patent/TWI589434B/zh active
- 2012-06-04 TW TW101119924A patent/TWI554392B/zh active
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JPH10341066A (ja) * | 1997-06-10 | 1998-12-22 | Furukawa Electric Co Ltd:The | 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板 |
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Also Published As
Publication number | Publication date |
---|---|
SG189489A1 (en) | 2013-05-31 |
TW201542355A (zh) | 2015-11-16 |
TW201302456A (zh) | 2013-01-16 |
EP2719799A1 (en) | 2014-04-16 |
JP5654416B2 (ja) | 2015-01-14 |
US9060431B2 (en) | 2015-06-16 |
MY163318A (en) | 2017-09-15 |
TWI589434B (zh) | 2017-07-01 |
US20140093743A1 (en) | 2014-04-03 |
KR20150065927A (ko) | 2015-06-15 |
KR101853519B1 (ko) | 2018-04-30 |
CN103562440A (zh) | 2014-02-05 |
WO2012169249A1 (ja) | 2012-12-13 |
JP2012255180A (ja) | 2012-12-27 |
TWI554392B (zh) | 2016-10-21 |
KR20130085055A (ko) | 2013-07-26 |
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