CN104112688B - 用于将电子或光学部件安装在基板上的方法和设备 - Google Patents

用于将电子或光学部件安装在基板上的方法和设备 Download PDF

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Publication number
CN104112688B
CN104112688B CN201410154273.1A CN201410154273A CN104112688B CN 104112688 B CN104112688 B CN 104112688B CN 201410154273 A CN201410154273 A CN 201410154273A CN 104112688 B CN104112688 B CN 104112688B
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CN
China
Prior art keywords
suction member
substrate
movement
correction value
force
Prior art date
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Active
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CN201410154273.1A
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English (en)
Chinese (zh)
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CN104112688A (zh
Inventor
翰尼斯·科斯特纳
安德鲁斯·迈尔
哈拉尔德·迈克斯纳
雨果·普里斯陶茨
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Besi Switzerland AG
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Besi Switzerland AG
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Publication date
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Publication of CN104112688A publication Critical patent/CN104112688A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201410154273.1A 2013-04-19 2014-04-17 用于将电子或光学部件安装在基板上的方法和设备 Active CN104112688B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
CH00800/13 2013-04-19

Publications (2)

Publication Number Publication Date
CN104112688A CN104112688A (zh) 2014-10-22
CN104112688B true CN104112688B (zh) 2018-03-23

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410154273.1A Active CN104112688B (zh) 2013-04-19 2014-04-17 用于将电子或光学部件安装在基板上的方法和设备

Country Status (8)

Country Link
US (1) US20140311652A1 (https=)
JP (1) JP6418371B2 (https=)
KR (1) KR102394745B1 (https=)
CN (1) CN104112688B (https=)
CH (1) CH707934B1 (https=)
MY (1) MY172714A (https=)
SG (1) SG10201400099TA (https=)
TW (1) TWI588917B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
FR3073763B1 (fr) 2017-11-17 2021-05-14 Besi Switzerland Ag Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
DE102021203570A1 (de) * 2021-04-12 2022-10-13 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Ansprengen von Bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Citations (2)

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CN101335222A (zh) * 2007-06-27 2008-12-31 新光电气工业株式会社 电子元件安装装置及制造电子器件的方法
CN101868140A (zh) * 2009-04-14 2010-10-20 阿森姆布里昂有限公司 适合于将构件放置在衬底上的装置及其方法

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JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4128156B2 (ja) * 2004-06-03 2008-07-30 松下電器産業株式会社 部品実装方法及び装置
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335222A (zh) * 2007-06-27 2008-12-31 新光电气工业株式会社 电子元件安装装置及制造电子器件的方法
CN101868140A (zh) * 2009-04-14 2010-10-20 阿森姆布里昂有限公司 适合于将构件放置在衬底上的装置及其方法

Also Published As

Publication number Publication date
US20140311652A1 (en) 2014-10-23
SG10201400099TA (en) 2014-11-27
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
KR20140125728A (ko) 2014-10-29
JP6418371B2 (ja) 2018-11-07
CN104112688A (zh) 2014-10-22
KR102394745B1 (ko) 2022-05-04
TWI588917B (zh) 2017-06-21
MY172714A (en) 2019-12-11

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