TWI588917B - 用於將電子或光學元件安裝在基板上的方法和設備 - Google Patents

用於將電子或光學元件安裝在基板上的方法和設備 Download PDF

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Publication number
TWI588917B
TWI588917B TW103105623A TW103105623A TWI588917B TW I588917 B TWI588917 B TW I588917B TW 103105623 A TW103105623 A TW 103105623A TW 103105623 A TW103105623 A TW 103105623A TW I588917 B TWI588917 B TW I588917B
Authority
TW
Taiwan
Prior art keywords
substrate
suction member
head
force
moving axis
Prior art date
Application number
TW103105623A
Other languages
English (en)
Chinese (zh)
Other versions
TW201442129A (zh
Inventor
漢斯 寇斯納
安德烈斯 梅爾
哈拉德 梅西納
雨果 浦利斯陶
Original Assignee
貝西瑞士股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 貝西瑞士股份有限公司 filed Critical 貝西瑞士股份有限公司
Publication of TW201442129A publication Critical patent/TW201442129A/zh
Application granted granted Critical
Publication of TWI588917B publication Critical patent/TWI588917B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103105623A 2013-04-19 2014-02-20 用於將電子或光學元件安裝在基板上的方法和設備 TWI588917B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.

Publications (2)

Publication Number Publication Date
TW201442129A TW201442129A (zh) 2014-11-01
TWI588917B true TWI588917B (zh) 2017-06-21

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105623A TWI588917B (zh) 2013-04-19 2014-02-20 用於將電子或光學元件安裝在基板上的方法和設備

Country Status (8)

Country Link
US (1) US20140311652A1 (https=)
JP (1) JP6418371B2 (https=)
KR (1) KR102394745B1 (https=)
CN (1) CN104112688B (https=)
CH (1) CH707934B1 (https=)
MY (1) MY172714A (https=)
SG (1) SG10201400099TA (https=)
TW (1) TWI588917B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
FR3073763B1 (fr) 2017-11-17 2021-05-14 Besi Switzerland Ag Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
DE102021203570A1 (de) * 2021-04-12 2022-10-13 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Ansprengen von Bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6513233B1 (en) * 1998-10-27 2003-02-04 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
US20050060883A1 (en) * 2001-06-08 2005-03-24 Kazunobu Sakai Part mounting apparatus and part mounting method
US20080250636A1 (en) * 2004-06-03 2008-10-16 Osamu Okuda Component Mounting Method and Apparatus

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JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6513233B1 (en) * 1998-10-27 2003-02-04 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
US20050060883A1 (en) * 2001-06-08 2005-03-24 Kazunobu Sakai Part mounting apparatus and part mounting method
US20080250636A1 (en) * 2004-06-03 2008-10-16 Osamu Okuda Component Mounting Method and Apparatus

Also Published As

Publication number Publication date
US20140311652A1 (en) 2014-10-23
SG10201400099TA (en) 2014-11-27
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
CN104112688B (zh) 2018-03-23
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
KR20140125728A (ko) 2014-10-29
JP6418371B2 (ja) 2018-11-07
CN104112688A (zh) 2014-10-22
KR102394745B1 (ko) 2022-05-04
MY172714A (en) 2019-12-11

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