KR102394745B1 - 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치 - Google Patents

전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치 Download PDF

Info

Publication number
KR102394745B1
KR102394745B1 KR1020140044954A KR20140044954A KR102394745B1 KR 102394745 B1 KR102394745 B1 KR 102394745B1 KR 1020140044954 A KR1020140044954 A KR 1020140044954A KR 20140044954 A KR20140044954 A KR 20140044954A KR 102394745 B1 KR102394745 B1 KR 102394745B1
Authority
KR
South Korea
Prior art keywords
axis
movement
substrate
suction member
bonding head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020140044954A
Other languages
English (en)
Korean (ko)
Other versions
KR20140125728A (ko
Inventor
하네스 코스트너
안드레아스 마이르
하랄트 마익스너
휴고 프리슈타우츠
Original Assignee
베시 스위처랜드 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베시 스위처랜드 아게 filed Critical 베시 스위처랜드 아게
Publication of KR20140125728A publication Critical patent/KR20140125728A/ko
Application granted granted Critical
Publication of KR102394745B1 publication Critical patent/KR102394745B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020140044954A 2013-04-19 2014-04-15 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치 Active KR102394745B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
CH00800/13 2013-04-19

Publications (2)

Publication Number Publication Date
KR20140125728A KR20140125728A (ko) 2014-10-29
KR102394745B1 true KR102394745B1 (ko) 2022-05-04

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140044954A Active KR102394745B1 (ko) 2013-04-19 2014-04-15 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치

Country Status (8)

Country Link
US (1) US20140311652A1 (https=)
JP (1) JP6418371B2 (https=)
KR (1) KR102394745B1 (https=)
CN (1) CN104112688B (https=)
CH (1) CH707934B1 (https=)
MY (1) MY172714A (https=)
SG (1) SG10201400099TA (https=)
TW (1) TWI588917B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
FR3073763B1 (fr) 2017-11-17 2021-05-14 Besi Switzerland Ag Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
DE102021203570A1 (de) * 2021-04-12 2022-10-13 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Ansprengen von Bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010074A (ja) * 2007-06-27 2009-01-15 Shinko Electric Ind Co Ltd 電子部品実装装置および電子装置の製造方法
US20110005338A1 (en) * 2009-07-08 2011-01-13 Wacoh Corporation Force detection device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4128156B2 (ja) * 2004-06-03 2008-07-30 松下電器産業株式会社 部品実装方法及び装置
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010074A (ja) * 2007-06-27 2009-01-15 Shinko Electric Ind Co Ltd 電子部品実装装置および電子装置の製造方法
US20110005338A1 (en) * 2009-07-08 2011-01-13 Wacoh Corporation Force detection device

Also Published As

Publication number Publication date
US20140311652A1 (en) 2014-10-23
SG10201400099TA (en) 2014-11-27
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
CN104112688B (zh) 2018-03-23
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
KR20140125728A (ko) 2014-10-29
JP6418371B2 (ja) 2018-11-07
CN104112688A (zh) 2014-10-22
TWI588917B (zh) 2017-06-21
MY172714A (en) 2019-12-11

Similar Documents

Publication Publication Date Title
KR102394745B1 (ko) 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치
KR101353685B1 (ko) 다이 본더 및 반도체 제조 방법
KR101893137B1 (ko) 마운터 장치의 가압 제어 헤드
US9302394B2 (en) Positioning device
JP5174583B2 (ja) 電子部品実装装置の制御方法
US10477697B2 (en) Mounting apparatus
JP2018098508A (ja) 装着装置の装着ヘッドのキネマティック保持システム
KR20170041864A (ko) 실장 장치 및 측정 방법
CN102647897A (zh) 贴装装置的加压控制头
JPWO2019013274A1 (ja) 第１物体を第２物体に対して位置決めする装置及び方法
WO2005107354A1 (ja) プリント基板支持装置
CN109910426B (zh) 模板和工件的平面对准
JP7333391B2 (ja) 接合ヘッドのためのアクチュエータ
JP2021529441A5 (https=)
WO2001091534A1 (fr) Dispositif de montage de puces et procede d'alignement associe
WO2021235269A1 (ja) ボンディング装置及びボンディングヘッド調整方法
US9919423B2 (en) Positioning device
CN110176411B (zh) 安装装置及半导体器件的制造方法
JP2005332836A (ja) 電子部品実装機
JP2013026370A (ja) 電子部品の実装装置及び実装方法
JPWO2019244136A5 (https=)
TW202603955A (zh) 定位裝置
JP2002028880A (ja) 二軸並列駆動型移動装置
HK40048985A (en) Actuating drive for a bonder head
JP2003181687A (ja) 部品間の隙間設定装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20140415

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190409

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20140415

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200904

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20210427

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200904

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20210528

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20210427

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2021101001385

Request date: 20210528

J301 Trial decision

Free format text: TRIAL NUMBER: 2021101001385; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20210528

Effective date: 20220221

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20220221

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20210528

Decision date: 20220221

Appeal identifier: 2021101001385

PS0901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20220315

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20220223

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220502

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220502

End annual number: 3

Start annual number: 1

PG1601 Publication of registration