JP6418371B2 - 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置 - Google Patents

電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置 Download PDF

Info

Publication number
JP6418371B2
JP6418371B2 JP2014055916A JP2014055916A JP6418371B2 JP 6418371 B2 JP6418371 B2 JP 6418371B2 JP 2014055916 A JP2014055916 A JP 2014055916A JP 2014055916 A JP2014055916 A JP 2014055916A JP 6418371 B2 JP6418371 B2 JP 6418371B2
Authority
JP
Japan
Prior art keywords
substrate
axis
movement
component
suction member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014055916A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014212306A (ja
JP2014212306A5 (https=
Inventor
ハネス コストナー
ハネス コストナー
アンドレアス マイル
アンドレアス マイル
ハラルド マイクスナー
ハラルド マイクスナー
ヒューゴ プリスタウツ
ヒューゴ プリスタウツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of JP2014212306A publication Critical patent/JP2014212306A/ja
Publication of JP2014212306A5 publication Critical patent/JP2014212306A5/ja
Application granted granted Critical
Publication of JP6418371B2 publication Critical patent/JP6418371B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014055916A 2013-04-19 2014-03-19 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置 Active JP6418371B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00800/13A CH707934B1 (de) 2013-04-19 2013-04-19 Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
CH00800/13 2013-04-19

Publications (3)

Publication Number Publication Date
JP2014212306A JP2014212306A (ja) 2014-11-13
JP2014212306A5 JP2014212306A5 (https=) 2017-03-09
JP6418371B2 true JP6418371B2 (ja) 2018-11-07

Family

ID=51709430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014055916A Active JP6418371B2 (ja) 2013-04-19 2014-03-19 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置

Country Status (8)

Country Link
US (1) US20140311652A1 (https=)
JP (1) JP6418371B2 (https=)
KR (1) KR102394745B1 (https=)
CN (1) CN104112688B (https=)
CH (1) CH707934B1 (https=)
MY (1) MY172714A (https=)
SG (1) SG10201400099TA (https=)
TW (1) TWI588917B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN107896478A (zh) * 2017-10-11 2018-04-10 广州煌牌自动设备有限公司 一种可模块化的多轴贴片机
FR3073763B1 (fr) 2017-11-17 2021-05-14 Besi Switzerland Ag Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
CN109216390A (zh) * 2018-08-28 2019-01-15 中国电子科技集团公司第十研究所 一种长线列双探测器芯片的倒装互连方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
DE102021203570A1 (de) * 2021-04-12 2022-10-13 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Ansprengen von Bauteilen
TWI789924B (zh) * 2021-09-27 2023-01-11 友達光電股份有限公司 轉移設備及轉移方法
US12400994B2 (en) * 2021-11-02 2025-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor placing in packaging
US12300660B2 (en) * 2022-01-27 2025-05-13 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a bonded semiconductor structure
CN119786413B (zh) * 2024-12-18 2025-10-17 迈为技术(珠海)有限公司 刺针设备的校正方法、装置、计算机设备和可读存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0376236A (ja) * 1989-08-18 1991-04-02 Fujitsu Ltd ボンディング方法
JP3341855B2 (ja) * 1993-02-08 2002-11-05 東レエンジニアリング株式会社 ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置
JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP2000133995A (ja) * 1998-10-27 2000-05-12 Matsushita Electric Ind Co Ltd 部品装着方法とその装置
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP4271475B2 (ja) * 2003-03-31 2009-06-03 株式会社ワコー 力検出装置
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
JP4280169B2 (ja) * 2004-01-23 2009-06-17 芝浦メカトロニクス株式会社 平行調整装置及び平行調整方法、ボンディング装置
JP4128156B2 (ja) * 2004-06-03 2008-07-30 松下電器産業株式会社 部品実装方法及び装置
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置

Also Published As

Publication number Publication date
US20140311652A1 (en) 2014-10-23
SG10201400099TA (en) 2014-11-27
CH707934B1 (de) 2017-04-28
JP2014212306A (ja) 2014-11-13
CN104112688B (zh) 2018-03-23
CH707934A1 (de) 2014-10-31
TW201442129A (zh) 2014-11-01
KR20140125728A (ko) 2014-10-29
CN104112688A (zh) 2014-10-22
KR102394745B1 (ko) 2022-05-04
TWI588917B (zh) 2017-06-21
MY172714A (en) 2019-12-11

Similar Documents

Publication Publication Date Title
JP6418371B2 (ja) 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置
US20150234375A1 (en) Tool coordinate system correcting method of robot system, and robot system
US12308273B2 (en) Bonding apparatus and method for correcting movement amount of bonding head
CN107665847B (zh) 一种键合对准设备和方法
CN109996653A (zh) 作业位置校正方法及作业机器人
JP2018098508A (ja) 装着装置の装着ヘッドのキネマティック保持システム
KR102152667B1 (ko) 본딩 방법
JP2014212306A5 (https=)
TWI676782B (zh) 工作印刷機之對準系統、印刷機及用導電介質印刷平面工件的方法
JP7333391B2 (ja) 接合ヘッドのためのアクチュエータ
JP2021529441A5 (https=)
KR20200097798A (ko) 마찰 교반 접합 장치 및 마찰 교반 접합 방법
US11121113B2 (en) Bonding apparatus incorporating variable force distribution
WO2021235269A1 (ja) ボンディング装置及びボンディングヘッド調整方法
US9919423B2 (en) Positioning device
KR102150542B1 (ko) 실장 장치, 및 반도체 장치의 제조 방법
JP5486704B1 (ja) 部材貼り合わせ装置
JP2009152461A (ja) 実装基板製造方法
JP6278620B2 (ja) アクティブコンプライアンス装置
JP3329896B2 (ja) 調整方法及びその装置と調整システム
TW202605523A (zh) 用於定位構件的方法及設備
JPWO2019244136A5 (https=)
KR100785240B1 (ko) 부품장착 장치 및 부품장착 방법
JP2015003362A (ja) コンプライアンス装置
TW202603955A (zh) 定位裝置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170201

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170531

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180507

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180828

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180925

R150 Certificate of patent or registration of utility model

Ref document number: 6418371

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250