JP2014212306A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014212306A5 JP2014212306A5 JP2014055916A JP2014055916A JP2014212306A5 JP 2014212306 A5 JP2014212306 A5 JP 2014212306A5 JP 2014055916 A JP2014055916 A JP 2014055916A JP 2014055916 A JP2014055916 A JP 2014055916A JP 2014212306 A5 JP2014212306 A5 JP 2014212306A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- component
- joint head
- head
- movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 22
- 241000309551 Arthraxon hispidus Species 0.000 claims 15
- 238000000034 method Methods 0.000 claims 5
- 230000003287 optical effect Effects 0.000 claims 4
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH00800/13A CH707934B1 (de) | 2013-04-19 | 2013-04-19 | Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat. |
| CH00800/13 | 2013-04-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014212306A JP2014212306A (ja) | 2014-11-13 |
| JP2014212306A5 true JP2014212306A5 (https=) | 2017-03-09 |
| JP6418371B2 JP6418371B2 (ja) | 2018-11-07 |
Family
ID=51709430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014055916A Active JP6418371B2 (ja) | 2013-04-19 | 2014-03-19 | 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140311652A1 (https=) |
| JP (1) | JP6418371B2 (https=) |
| KR (1) | KR102394745B1 (https=) |
| CN (1) | CN104112688B (https=) |
| CH (1) | CH707934B1 (https=) |
| MY (1) | MY172714A (https=) |
| SG (1) | SG10201400099TA (https=) |
| TW (1) | TWI588917B (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
| CN107896478A (zh) * | 2017-10-11 | 2018-04-10 | 广州煌牌自动设备有限公司 | 一种可模块化的多轴贴片机 |
| FR3073763B1 (fr) | 2017-11-17 | 2021-05-14 | Besi Switzerland Ag | Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage |
| CH714351A1 (de) * | 2017-11-17 | 2019-05-31 | Besi Switzerland Ag | Bondkopf für die Montage von Bauelementen. |
| DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
| CN109216390A (zh) * | 2018-08-28 | 2019-01-15 | 中国电子科技集团公司第十研究所 | 一种长线列双探测器芯片的倒装互连方法 |
| US11552031B2 (en) * | 2020-03-13 | 2023-01-10 | Asmpt Singapore Pte. Ltd. | High precision bonding apparatus comprising heater |
| EP4052868A1 (de) * | 2021-02-15 | 2022-09-07 | Stöger Automation GmbH | Automatisches schraubsystem zum verbinden von bauteilen |
| DE102021203570A1 (de) * | 2021-04-12 | 2022-10-13 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Ansprengen von Bauteilen |
| TWI789924B (zh) * | 2021-09-27 | 2023-01-11 | 友達光電股份有限公司 | 轉移設備及轉移方法 |
| US12400994B2 (en) * | 2021-11-02 | 2025-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor placing in packaging |
| US12300660B2 (en) * | 2022-01-27 | 2025-05-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of forming a bonded semiconductor structure |
| CN119786413B (zh) * | 2024-12-18 | 2025-10-17 | 迈为技术(珠海)有限公司 | 刺针设备的校正方法、装置、计算机设备和可读存储介质 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376236A (ja) * | 1989-08-18 | 1991-04-02 | Fujitsu Ltd | ボンディング方法 |
| JP3341855B2 (ja) * | 1993-02-08 | 2002-11-05 | 東レエンジニアリング株式会社 | ワーク位置決めステージ装置及びそれにおける制御パラメータの補正更新方法並びにチップボンディング装置 |
| JPH0951007A (ja) * | 1995-08-09 | 1997-02-18 | Mitsubishi Electric Corp | ダイボンド装置および半導体装置の製造方法 |
| JP2000133995A (ja) * | 1998-10-27 | 2000-05-12 | Matsushita Electric Ind Co Ltd | 部品装着方法とその装置 |
| JP2002368495A (ja) * | 2001-06-08 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
| JP4271475B2 (ja) * | 2003-03-31 | 2009-06-03 | 株式会社ワコー | 力検出装置 |
| US7240711B2 (en) * | 2004-01-21 | 2007-07-10 | Asm Assembly Automation Ltd. | Apparatus and method for alignment of a bonding tool |
| JP4280169B2 (ja) * | 2004-01-23 | 2009-06-17 | 芝浦メカトロニクス株式会社 | 平行調整装置及び平行調整方法、ボンディング装置 |
| JP4128156B2 (ja) * | 2004-06-03 | 2008-07-30 | 松下電器産業株式会社 | 部品実装方法及び装置 |
| JP4958655B2 (ja) * | 2007-06-27 | 2012-06-20 | 新光電気工業株式会社 | 電子部品実装装置および電子装置の製造方法 |
| NL1036851C2 (nl) * | 2009-04-14 | 2010-10-18 | Assembléon B V | Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze. |
| KR101090333B1 (ko) * | 2009-06-03 | 2011-12-07 | 주식회사 쎄믹스 | 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법 |
| JP5439068B2 (ja) * | 2009-07-08 | 2014-03-12 | 株式会社ワコー | 力検出装置 |
-
2013
- 2013-04-19 CH CH00800/13A patent/CH707934B1/de not_active IP Right Cessation
-
2014
- 2014-02-20 TW TW103105623A patent/TWI588917B/zh active
- 2014-02-20 SG SG10201400099TA patent/SG10201400099TA/en unknown
- 2014-02-25 MY MYPI2014700432A patent/MY172714A/en unknown
- 2014-03-19 JP JP2014055916A patent/JP6418371B2/ja active Active
- 2014-04-15 KR KR1020140044954A patent/KR102394745B1/ko active Active
- 2014-04-17 CN CN201410154273.1A patent/CN104112688B/zh active Active
- 2014-04-18 US US14/256,830 patent/US20140311652A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014212306A5 (https=) | ||
| JP6418371B2 (ja) | 電子構成要素又は光学構成要素を基板上に組み付ける方法及び装置 | |
| JP4598849B2 (ja) | 嵌合の詰まり状態を修正する嵌合装置 | |
| US10068872B2 (en) | Mounting apparatus and method of correcting offset amount of the same | |
| JP2016533484A5 (https=) | ||
| US12308273B2 (en) | Bonding apparatus and method for correcting movement amount of bonding head | |
| JP2014067016A5 (https=) | ||
| TW200942857A (en) | Photographic apparatus | |
| TW201130293A (en) | Movable-mechanical-section controlling device, method of controlling movable mechanical section, and program | |
| JP2018525227A5 (https=) | ||
| JP2016035543A5 (https=) | ||
| JP2009176934A5 (https=) | ||
| CN105934313B (zh) | 用于将对象移动到目标位置的方法、装置和机器人系统 | |
| JP2013130674A5 (https=) | ||
| JP2015212722A5 (https=) | ||
| JP2015141210A5 (https=) | ||
| JP2016024235A5 (https=) | ||
| JP2015102776A5 (https=) | ||
| JP2013160812A5 (https=) | ||
| WO2009028488A1 (ja) | 型締装置及び型締制御方法 | |
| CN104281156A (zh) | 视觉对位装置、视觉对位系统及方法 | |
| JP2010284758A (ja) | ロボットの制御装置、及びロボットの制御方法 | |
| MY204833A (en) | Actuator for a bonding head | |
| JP2009147675A5 (https=) | ||
| JP2013013987A5 (ja) | ロボットシステム及び部品の製造方法 |