CN103985661B - 半导体制造装置 - Google Patents

半导体制造装置 Download PDF

Info

Publication number
CN103985661B
CN103985661B CN201310364645.9A CN201310364645A CN103985661B CN 103985661 B CN103985661 B CN 103985661B CN 201310364645 A CN201310364645 A CN 201310364645A CN 103985661 B CN103985661 B CN 103985661B
Authority
CN
China
Prior art keywords
mentioned
semiconductor chip
detector
push
elastic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310364645.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN103985661A (zh
Inventor
种泰雄
井本孝志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japanese Businessman Panjaya Co ltd
Kioxia Corp
Original Assignee
Toshiba Memory Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Publication of CN103985661A publication Critical patent/CN103985661A/zh
Application granted granted Critical
Publication of CN103985661B publication Critical patent/CN103985661B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN201310364645.9A 2013-02-13 2013-08-20 半导体制造装置 Active CN103985661B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013025685A JP5931772B2 (ja) 2013-02-13 2013-02-13 半導体製造装置
JP025685/2013 2013-02-13

Publications (2)

Publication Number Publication Date
CN103985661A CN103985661A (zh) 2014-08-13
CN103985661B true CN103985661B (zh) 2017-09-08

Family

ID=51277579

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310364645.9A Active CN103985661B (zh) 2013-02-13 2013-08-20 半导体制造装置

Country Status (3)

Country Link
JP (1) JP5931772B2 (ja)
CN (1) CN103985661B (ja)
TW (1) TWI538082B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211955B2 (ja) 2014-03-07 2017-10-11 東芝メモリ株式会社 半導体製造装置及び半導体製造方法
WO2017168498A1 (ja) * 2016-03-28 2017-10-05 富士機械製造株式会社 部品供給装置、実装装置及び部品供給方法
TWI606543B (zh) * 2016-09-13 2017-11-21 台灣積體電路製造股份有限公司 運送系統及運送加工元件的方法
JP6814674B2 (ja) * 2017-03-24 2021-01-20 株式会社ディスコ シート拡張装置
JP7274902B2 (ja) 2019-03-25 2023-05-17 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7326861B2 (ja) * 2019-05-17 2023-08-16 三菱電機株式会社 半導体製造装置及び半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335191A (zh) * 2007-06-19 2008-12-31 株式会社瑞萨科技 半导体集成电路装置的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229149A (ja) * 1990-02-02 1991-10-11 Matsushita Electric Works Ltd Ｉｃパッケージの検査装置
JP3341761B2 (ja) * 2000-11-22 2002-11-05 松下電器産業株式会社 ダイボンディング装置
JP2003247986A (ja) * 2002-02-27 2003-09-05 Sharp Corp 破損検出システムおよび破損検出方法
JP2005072559A (ja) * 2003-08-05 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007188981A (ja) * 2006-01-12 2007-07-26 Juki Corp 電子部品実装装置
JP4735443B2 (ja) * 2006-07-03 2011-07-27 株式会社村田製作所 小型部品取出装置
JP2010129588A (ja) * 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101335191A (zh) * 2007-06-19 2008-12-31 株式会社瑞萨科技 半导体集成电路装置的制造方法

Also Published As

Publication number Publication date
JP5931772B2 (ja) 2016-06-08
JP2014154826A (ja) 2014-08-25
CN103985661A (zh) 2014-08-13
TWI538082B (zh) 2016-06-11
TW201432833A (zh) 2014-08-16

Similar Documents

Publication Publication Date Title
CN103985661B (zh) 半导体制造装置
KR101473492B1 (ko) 반도체 집적 회로 장치의 제조 방법
JP5196838B2 (ja) 接着剤付きチップの製造方法
KR101729335B1 (ko) 보호 테이프 박리 방법 및 그 장치
TW527671B (en) Die pickup method and die pickup apparatus
CN109478519B (zh) 加热接合用片材、及带有切割带的加热接合用片材
JP5253996B2 (ja) ワーク分割方法およびテープ拡張装置
US20130071220A1 (en) Semiconductor chip pick-up method and semiconductor chip pick-up apparatus
JP2007042996A (ja) 半導体装置の製造方法および半導体製造装置
JP5234644B2 (ja) 粘着保持トレー
JP2011216529A (ja) 半導体装置の製造方法
JP2009289785A (ja) 半導体集積回路装置の製造方法
KR101684288B1 (ko) 웨이퍼 보호용 필름의 분리장치
TW201743375A (zh) 零件製造用膜及零件的製造方法
TW201011857A (en) Peeling off method and device
JP6017388B2 (ja) 半導体装置の製造方法
CN1296978C (zh) 半导体器件的制造方法及半导体制造装置
KR100876965B1 (ko) 반도체패키지 제조용 칩 픽업툴
CN103871863A (zh) 半导体装置的制造方法以及半导体制造装置
JP2013219245A (ja) 半導体装置の製造方法
JP4600495B2 (ja) ウエハ取り出し装置及び半導体装置の製造方法
KR101115932B1 (ko) 반도체 다이 부착 장치
TW201001566A (en) Jig and method for picking up a die
JP2010135494A (ja) ダイシングテープ
CN102832158B (zh) 半导体器件的制造装置和半导体器件的制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170807

Address after: Tokyo, Japan

Applicant after: TOSHIBA MEMORY Corp.

Address before: Tokyo, Japan

Applicant before: Toshiba Corp.

GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Kaixia Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: TOSHIBA MEMORY Corp.

Address after: Tokyo, Japan

Patentee after: TOSHIBA MEMORY Corp.

Address before: Tokyo, Japan

Patentee before: Japanese businessman Panjaya Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220110

Address after: Tokyo, Japan

Patentee after: Japanese businessman Panjaya Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: TOSHIBA MEMORY Corp.