CN103827791B - 具有精细间距互连器的柔性触摸传感器 - Google Patents

具有精细间距互连器的柔性触摸传感器 Download PDF

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Publication number
CN103827791B
CN103827791B CN201280047232.1A CN201280047232A CN103827791B CN 103827791 B CN103827791 B CN 103827791B CN 201280047232 A CN201280047232 A CN 201280047232A CN 103827791 B CN103827791 B CN 103827791B
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China
Prior art keywords
layer
conducting layer
conductive layer
metal
photoimaging
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Expired - Fee Related
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CN201280047232.1A
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English (en)
Chinese (zh)
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CN103827791A (zh
Inventor
穆图·塞巴斯蒂安
多米尼克·M·特拉瓦索
南希·S·伦霍夫
史蒂文·T·斯沃茨
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN103827791A publication Critical patent/CN103827791A/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
CN201280047232.1A 2011-09-30 2012-09-27 具有精细间距互连器的柔性触摸传感器 Expired - Fee Related CN103827791B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161541563P 2011-09-30 2011-09-30
US61/541,563 2011-09-30
PCT/US2012/057415 WO2013049267A1 (en) 2011-09-30 2012-09-27 Flexible touch sensor with fine pitch interconnect

Publications (2)

Publication Number Publication Date
CN103827791A CN103827791A (zh) 2014-05-28
CN103827791B true CN103827791B (zh) 2017-08-29

Family

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Family Applications (1)

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CN201280047232.1A Expired - Fee Related CN103827791B (zh) 2011-09-30 2012-09-27 具有精细间距互连器的柔性触摸传感器

Country Status (6)

Country Link
US (1) US9642243B2 (enExample)
JP (1) JP6129185B2 (enExample)
KR (1) KR20140072131A (enExample)
CN (1) CN103827791B (enExample)
TW (1) TWI588719B (enExample)
WO (1) WO2013049267A1 (enExample)

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CN103472964A (zh) * 2013-09-07 2013-12-25 向火平 柔性电容屏制作工艺及柔性电容屏
WO2015112419A1 (en) * 2014-01-23 2015-07-30 3M Innovative Properties Company Method for patterning a microstructure
US10168805B2 (en) 2014-08-18 2019-01-01 3M Innovative Properties Company Conductive layered structure and methods of making same
KR101902133B1 (ko) * 2014-09-22 2018-09-27 후지필름 가부시키가이샤 패턴 형상 피도금층 함유 적층체의 제조 방법, 금속층 함유 적층체의 제조 방법, 터치 패널 센서, 터치 패널, 패턴 형상 피도금층 함유 적층체, 금속층 함유 적층체
CN104553113A (zh) * 2014-12-11 2015-04-29 业成光电（深圳）有限公司 声波式指纹识别组件及其制造方法
TWI536222B (zh) * 2014-12-12 2016-06-01 群創光電股份有限公司 觸控裝置與觸控顯示裝置
US9489097B2 (en) * 2015-01-23 2016-11-08 Sony Corporation Dynamic touch sensor scanning for false border touch input detection
KR102312314B1 (ko) * 2015-01-28 2021-10-13 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
CN105843438A (zh) * 2015-01-30 2016-08-10 启耀光电股份有限公司 电子装置及电子装置的制造方法
KR102320639B1 (ko) * 2015-02-04 2021-11-02 삼성디스플레이 주식회사 터치 스크린 패널 및 이의 제조 방법
KR102322084B1 (ko) * 2015-04-30 2021-11-04 삼성디스플레이 주식회사 터치 센서 장치 및 그 제조 방법
KR102543916B1 (ko) 2015-09-21 2023-06-16 삼성디스플레이 주식회사 플렉서블 전자 장치
US9857930B2 (en) 2015-12-16 2018-01-02 3M Innovative Properties Company Transparent conductive component with interconnect circuit tab comprising cured organic polymeric material
CN208384543U (zh) * 2016-01-21 2019-01-15 3M创新有限公司 多尺寸触摸传感器
KR102796859B1 (ko) 2016-11-14 2025-04-17 삼성전자주식회사 지문 센서 및 지문 센서의 제조 방법
KR102075065B1 (ko) * 2017-02-16 2020-02-07 동우 화인켐 주식회사 터치 센서 및 이의 제조 방법
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
DE102019115946A1 (de) * 2019-06-12 2020-12-31 Preh Gmbh Eingabevorrichtung mit beweglicher Handhabe auf kapazitiver Detektionsfläche und kapazitiven Koppeleinrichtungen
CN110489017B (zh) * 2019-09-27 2022-08-30 业成科技（成都）有限公司 触控屏、触控显示屏及智能终端
CN114695443A (zh) * 2020-12-30 2022-07-01 乐金显示有限公司 显示面板和显示装置
KR102575205B1 (ko) * 2023-01-17 2023-09-08 주식회사 아이티에스솔루션 일체형 터치 스크린 패널 및 슬림 베젤 적용 센서 기기

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Also Published As

Publication number Publication date
US20140299365A1 (en) 2014-10-09
TW201319905A (zh) 2013-05-16
TWI588719B (zh) 2017-06-21
KR20140072131A (ko) 2014-06-12
US9642243B2 (en) 2017-05-02
JP2014534458A (ja) 2014-12-18
JP6129185B2 (ja) 2017-05-17
CN103827791A (zh) 2014-05-28
WO2013049267A1 (en) 2013-04-04

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