CN103817103B - 基板清洗装置及基板清洗方法 - Google Patents

基板清洗装置及基板清洗方法 Download PDF

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Publication number
CN103817103B
CN103817103B CN201310573996.0A CN201310573996A CN103817103B CN 103817103 B CN103817103 B CN 103817103B CN 201310573996 A CN201310573996 A CN 201310573996A CN 103817103 B CN103817103 B CN 103817103B
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CN
China
Prior art keywords
pure water
chemical solution
cleaning
substrate
supply valve
Prior art date
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CN201310573996.0A
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English (en)
Chinese (zh)
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CN103817103A (zh
Inventor
丰增富士彦
丸山徹
小松三教
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Ebara Corp
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Ebara Corp
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Publication of CN103817103A publication Critical patent/CN103817103A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
CN201310573996.0A 2012-11-15 2013-11-15 基板清洗装置及基板清洗方法 Active CN103817103B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-250960 2012-11-15
JP2012250960A JP6212253B2 (ja) 2012-11-15 2012-11-15 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
CN103817103A CN103817103A (zh) 2014-05-28
CN103817103B true CN103817103B (zh) 2017-05-10

Family

ID=50752556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310573996.0A Active CN103817103B (zh) 2012-11-15 2013-11-15 基板清洗装置及基板清洗方法

Country Status (5)

Country Link
US (1) US10373845B2 (https=)
JP (2) JP6212253B2 (https=)
KR (1) KR102065957B1 (https=)
CN (1) CN103817103B (https=)
TW (2) TWI696502B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6159282B2 (ja) * 2014-03-27 2017-07-05 株式会社荏原製作所 基板処理装置、および基板処理装置の配管洗浄方法
KR102357784B1 (ko) * 2014-06-09 2022-02-04 가부시키가이샤 에바라 세이사꾸쇼 세정 약액 공급장치 및 세정 약액 공급 방법
JP6378555B2 (ja) * 2014-06-26 2018-08-22 株式会社荏原製作所 洗浄ユニット
US10340159B2 (en) 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
CN107078046B (zh) * 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
CN107611010A (zh) * 2017-08-31 2018-01-19 长江存储科技有限责任公司 一种晶圆清洗方法
CN109647766A (zh) * 2017-10-12 2019-04-19 中国铁建高新装备股份有限公司 一种自动清洗烘干工具清洗机
US10460926B2 (en) * 2017-11-17 2019-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for chemical mechanical polishing process
KR102382789B1 (ko) 2020-02-26 2022-04-06 주식회사 이앤에이치 기판 세정 장치 및 기판 세정 방법
CN120497167A (zh) * 2022-06-16 2025-08-15 华海清科股份有限公司 用于晶圆处理的供给通道的清洗方法、装置和系统
KR102844262B1 (ko) * 2024-01-29 2025-08-11 엘에스이 주식회사 기판 세정 장치
KR102885877B1 (ko) * 2025-01-31 2025-11-17 엘에스이 주식회사 기판 세정 장치

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JPS596162B2 (ja) 1979-08-10 1984-02-09 東レ株式会社 多液混合方法
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
JPH1070101A (ja) 1996-08-27 1998-03-10 Hitachi Ltd 半導体装置の製造方法ならびに製造装置、洗浄方法ならびに洗浄装置、加工装置、流体混合用配管、および、洗浄用液体供給部材
JP3495208B2 (ja) * 1996-11-05 2004-02-09 大日本スクリーン製造株式会社 基板処理装置
US6240933B1 (en) * 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
JP3529251B2 (ja) 1997-10-13 2004-05-24 大日本スクリーン製造株式会社 基板処理装置
JP3891389B2 (ja) * 2000-05-29 2007-03-14 東京エレクトロン株式会社 液処理方法及び液処理装置
JP4902091B2 (ja) * 2000-12-28 2012-03-21 義治 山本 半導体基板の洗浄装置
TWI261875B (en) * 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
JP2004128251A (ja) * 2002-10-03 2004-04-22 Elpida Memory Inc 塗布機及び塗布方法
JP2004281464A (ja) * 2003-03-12 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP2005353717A (ja) * 2004-06-09 2005-12-22 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
KR100646414B1 (ko) * 2004-10-01 2006-11-15 세메스 주식회사 다수의 약액들을 공급하는 약액 공급 시스템 및 그의 제어방법
KR100639710B1 (ko) * 2005-03-17 2006-10-30 세메스 주식회사 약액 혼합 공급 방법
JP2007311559A (ja) * 2006-05-18 2007-11-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100847590B1 (ko) * 2006-06-19 2008-07-21 조현찬 반도체 장비용 약액 공급 장치, 이를 위한 모니터링 제어장치 및 모니터링이 가능한 반도체 장비용 약액 공급 장치
JP2008277576A (ja) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5198187B2 (ja) * 2007-09-26 2013-05-15 東京エレクトロン株式会社 液処理装置および処理液供給方法
US8491726B2 (en) 2007-09-26 2013-07-23 Tokyo Electron Limited Liquid processing apparatus and process liquid supplying method
JP5424597B2 (ja) * 2008-09-08 2014-02-26 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
JP2014099530A (ja) 2014-05-29
CN103817103A (zh) 2014-05-28
TWI637793B (zh) 2018-10-11
TW201900291A (zh) 2019-01-01
JP6212253B2 (ja) 2017-10-11
KR20140063436A (ko) 2014-05-27
US10373845B2 (en) 2019-08-06
TWI696502B (zh) 2020-06-21
KR102065957B1 (ko) 2020-01-14
US20140216505A1 (en) 2014-08-07
JP2017216483A (ja) 2017-12-07
TW201433372A (zh) 2014-09-01
JP6475801B2 (ja) 2019-02-27

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