TWI696502B - 基板洗淨裝置 - Google Patents

基板洗淨裝置 Download PDF

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Publication number
TWI696502B
TWI696502B TW107131138A TW107131138A TWI696502B TW I696502 B TWI696502 B TW I696502B TW 107131138 A TW107131138 A TW 107131138A TW 107131138 A TW107131138 A TW 107131138A TW I696502 B TWI696502 B TW I696502B
Authority
TW
Taiwan
Prior art keywords
supply line
pure water
substrate
cleaning
valve
Prior art date
Application number
TW107131138A
Other languages
English (en)
Chinese (zh)
Other versions
TW201900291A (zh
Inventor
豊增富士彥
丸山徹
小松三教
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201900291A publication Critical patent/TW201900291A/zh
Application granted granted Critical
Publication of TWI696502B publication Critical patent/TWI696502B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
TW107131138A 2012-11-15 2013-11-11 基板洗淨裝置 TWI696502B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-250960 2012-11-15
JP2012250960A JP6212253B2 (ja) 2012-11-15 2012-11-15 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
TW201900291A TW201900291A (zh) 2019-01-01
TWI696502B true TWI696502B (zh) 2020-06-21

Family

ID=50752556

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107131138A TWI696502B (zh) 2012-11-15 2013-11-11 基板洗淨裝置
TW102140846A TWI637793B (zh) 2012-11-15 2013-11-11 基板洗淨裝置及基板洗淨方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102140846A TWI637793B (zh) 2012-11-15 2013-11-11 基板洗淨裝置及基板洗淨方法

Country Status (5)

Country Link
US (1) US10373845B2 (https=)
JP (2) JP6212253B2 (https=)
KR (1) KR102065957B1 (https=)
CN (1) CN103817103B (https=)
TW (2) TWI696502B (https=)

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* Cited by examiner, † Cited by third party
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JP6159282B2 (ja) * 2014-03-27 2017-07-05 株式会社荏原製作所 基板処理装置、および基板処理装置の配管洗浄方法
KR102357784B1 (ko) * 2014-06-09 2022-02-04 가부시키가이샤 에바라 세이사꾸쇼 세정 약액 공급장치 및 세정 약액 공급 방법
JP6378555B2 (ja) * 2014-06-26 2018-08-22 株式会社荏原製作所 洗浄ユニット
US10340159B2 (en) 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
CN107078046B (zh) * 2014-10-31 2020-11-27 株式会社荏原制作所 基板清洗辊、基板清洗装置及基板清洗方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
CN107611010A (zh) * 2017-08-31 2018-01-19 长江存储科技有限责任公司 一种晶圆清洗方法
CN109647766A (zh) * 2017-10-12 2019-04-19 中国铁建高新装备股份有限公司 一种自动清洗烘干工具清洗机
US10460926B2 (en) * 2017-11-17 2019-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for chemical mechanical polishing process
KR102382789B1 (ko) 2020-02-26 2022-04-06 주식회사 이앤에이치 기판 세정 장치 및 기판 세정 방법
CN120497167A (zh) * 2022-06-16 2025-08-15 华海清科股份有限公司 用于晶圆处理的供给通道的清洗方法、装置和系统
KR102844262B1 (ko) * 2024-01-29 2025-08-11 엘에스이 주식회사 기판 세정 장치
KR102885877B1 (ko) * 2025-01-31 2025-11-17 엘에스이 주식회사 기판 세정 장치

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JP2001338903A (ja) * 2000-05-29 2001-12-07 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2008277576A (ja) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2009098128A (ja) * 2007-09-26 2009-05-07 Tokyo Electron Ltd 液処理装置および処理液供給方法

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JPS596162B2 (ja) 1979-08-10 1984-02-09 東レ株式会社 多液混合方法
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
JPH1070101A (ja) 1996-08-27 1998-03-10 Hitachi Ltd 半導体装置の製造方法ならびに製造装置、洗浄方法ならびに洗浄装置、加工装置、流体混合用配管、および、洗浄用液体供給部材
JP3495208B2 (ja) * 1996-11-05 2004-02-09 大日本スクリーン製造株式会社 基板処理装置
US6240933B1 (en) * 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
JP3529251B2 (ja) 1997-10-13 2004-05-24 大日本スクリーン製造株式会社 基板処理装置
JP4902091B2 (ja) * 2000-12-28 2012-03-21 義治 山本 半導体基板の洗浄装置
TWI261875B (en) * 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
JP2004128251A (ja) * 2002-10-03 2004-04-22 Elpida Memory Inc 塗布機及び塗布方法
JP2004281464A (ja) * 2003-03-12 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP2005353717A (ja) * 2004-06-09 2005-12-22 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
KR100646414B1 (ko) * 2004-10-01 2006-11-15 세메스 주식회사 다수의 약액들을 공급하는 약액 공급 시스템 및 그의 제어방법
KR100639710B1 (ko) * 2005-03-17 2006-10-30 세메스 주식회사 약액 혼합 공급 방법
JP2007311559A (ja) * 2006-05-18 2007-11-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100847590B1 (ko) * 2006-06-19 2008-07-21 조현찬 반도체 장비용 약액 공급 장치, 이를 위한 모니터링 제어장치 및 모니터링이 가능한 반도체 장비용 약액 공급 장치
US8491726B2 (en) 2007-09-26 2013-07-23 Tokyo Electron Limited Liquid processing apparatus and process liquid supplying method
JP5424597B2 (ja) * 2008-09-08 2014-02-26 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001338903A (ja) * 2000-05-29 2001-12-07 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2008277576A (ja) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2009098128A (ja) * 2007-09-26 2009-05-07 Tokyo Electron Ltd 液処理装置および処理液供給方法

Also Published As

Publication number Publication date
JP2014099530A (ja) 2014-05-29
CN103817103A (zh) 2014-05-28
TWI637793B (zh) 2018-10-11
TW201900291A (zh) 2019-01-01
JP6212253B2 (ja) 2017-10-11
KR20140063436A (ko) 2014-05-27
US10373845B2 (en) 2019-08-06
KR102065957B1 (ko) 2020-01-14
US20140216505A1 (en) 2014-08-07
JP2017216483A (ja) 2017-12-07
CN103817103B (zh) 2017-05-10
TW201433372A (zh) 2014-09-01
JP6475801B2 (ja) 2019-02-27

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