CN103562334A - 导热性压敏粘接剂组合物、导热性压敏粘接性片状成型体、它们的制造方法及电子部件 - Google Patents
导热性压敏粘接剂组合物、导热性压敏粘接性片状成型体、它们的制造方法及电子部件 Download PDFInfo
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- CN103562334A CN103562334A CN201280023461.XA CN201280023461A CN103562334A CN 103562334 A CN103562334 A CN 103562334A CN 201280023461 A CN201280023461 A CN 201280023461A CN 103562334 A CN103562334 A CN 103562334A
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- mass parts
- thermal conductivity
- methyl
- sensitive adhesive
- conductivity pressure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-212718 | 2011-09-28 | ||
JP2011212718 | 2011-09-28 | ||
PCT/JP2012/072777 WO2013047145A1 (fr) | 2011-09-28 | 2012-09-06 | Composition adhésive sensible à la pression conductrice de la chaleur, corps moulé de type feuille adhésive sensible à la pression conducteur de la chaleur, procédé de fabrication d'une composition adhésive sensible à la pression conductrice de la chaleur, procédé de fabrication d'un corps moulé de type feuille adhésive sensible à la pression conducteur de la chaleur, et composant électronique |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103562334A true CN103562334A (zh) | 2014-02-05 |
Family
ID=47995185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280023461.XA Pending CN103562334A (zh) | 2011-09-28 | 2012-09-06 | 导热性压敏粘接剂组合物、导热性压敏粘接性片状成型体、它们的制造方法及电子部件 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2013047145A1 (fr) |
KR (1) | KR20140074869A (fr) |
CN (1) | CN103562334A (fr) |
TW (1) | TW201319194A (fr) |
WO (1) | WO2013047145A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112852309A (zh) * | 2021-02-24 | 2021-05-28 | 东莞市博翔电子材料有限公司 | 一种用于动力电池铝塑膜的胶粘剂及其加工工艺 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5652365B2 (ja) * | 2011-09-28 | 2015-01-14 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品 |
WO2015045918A1 (fr) * | 2013-09-26 | 2015-04-02 | 日本ゼオン株式会社 | Composition adhésive autocollante thermoconductrice, article stratiforme adhésif autocollant thermoconducteur, leur procédé de production et matériel électronique |
WO2015045919A1 (fr) * | 2013-09-26 | 2015-04-02 | 日本ゼオン株式会社 | Composition adhésive sensible à la pression et thermoconductrice, article stratiforme adhésif sensible à la pression et thermoconducteur, leur procédé de production et équipement électronique |
US9353245B2 (en) | 2014-08-18 | 2016-05-31 | 3M Innovative Properties Company | Thermally conductive clay |
EP3064560B1 (fr) * | 2015-03-05 | 2022-05-04 | Henkel AG & Co. KGaA | Adhésif thermiquement conducteur |
JP7232474B2 (ja) * | 2017-09-26 | 2023-03-03 | 国立大学法人北海道大学 | 高靭性繊維複合エラストマー |
JP6944708B2 (ja) * | 2017-12-28 | 2021-10-06 | 北川工業株式会社 | 熱伝導エラストマー組成物、及び熱伝導成形体 |
CN113302734A (zh) * | 2019-01-15 | 2021-08-24 | 可舒磨润滑油株式会社 | 固化性组合物及固化物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101454419A (zh) * | 2006-03-28 | 2009-06-10 | 日本瑞翁株式会社 | 导热压敏粘合剂组合物和片材形式的导热压敏粘合剂制品 |
JP2011068721A (ja) * | 2009-09-24 | 2011-04-07 | Nippon Zeon Co Ltd | 熱伝導性感圧接着性積層シート、及び電子部品 |
JP2011093985A (ja) * | 2009-10-28 | 2011-05-12 | Nippon Zeon Co Ltd | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 |
CN102131879A (zh) * | 2008-08-25 | 2011-07-20 | 日本瑞翁株式会社 | 导热性压敏粘接剂组合物、导热性压敏粘接性片以及电子部件 |
WO2011102170A1 (fr) * | 2010-02-19 | 2011-08-25 | 日本ゼオン株式会社 | Composition d'adhésif autocollant thermiquement conducteur, feuille adhésive autocollante thermiquement conductrice et composant électronique |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02263882A (ja) * | 1989-04-03 | 1990-10-26 | Matsushita Electric Ind Co Ltd | 接着剤 |
JP2008163145A (ja) * | 2006-12-27 | 2008-07-17 | Asahi Kasei Chemicals Corp | 放熱材料及び放熱材料で成形した放熱シート |
JP5169292B2 (ja) * | 2008-02-20 | 2013-03-27 | 日本ゼオン株式会社 | 熱伝導性感圧接着剤組成物、及び、熱伝導性感圧接着性シート |
JP2011111544A (ja) * | 2009-11-27 | 2011-06-09 | Nippon Zeon Co Ltd | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 |
JP5717353B2 (ja) * | 2010-04-02 | 2015-05-13 | ソマール株式会社 | 熱伝導性粘着シート |
-
2012
- 2012-09-06 WO PCT/JP2012/072777 patent/WO2013047145A1/fr active Application Filing
- 2012-09-06 CN CN201280023461.XA patent/CN103562334A/zh active Pending
- 2012-09-06 JP JP2013536128A patent/JPWO2013047145A1/ja not_active Withdrawn
- 2012-09-06 KR KR1020137030473A patent/KR20140074869A/ko not_active Application Discontinuation
- 2012-09-26 TW TW101135277A patent/TW201319194A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101454419A (zh) * | 2006-03-28 | 2009-06-10 | 日本瑞翁株式会社 | 导热压敏粘合剂组合物和片材形式的导热压敏粘合剂制品 |
CN102131879A (zh) * | 2008-08-25 | 2011-07-20 | 日本瑞翁株式会社 | 导热性压敏粘接剂组合物、导热性压敏粘接性片以及电子部件 |
JP2011068721A (ja) * | 2009-09-24 | 2011-04-07 | Nippon Zeon Co Ltd | 熱伝導性感圧接着性積層シート、及び電子部品 |
JP2011093985A (ja) * | 2009-10-28 | 2011-05-12 | Nippon Zeon Co Ltd | 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 |
WO2011102170A1 (fr) * | 2010-02-19 | 2011-08-25 | 日本ゼオン株式会社 | Composition d'adhésif autocollant thermiquement conducteur, feuille adhésive autocollante thermiquement conductrice et composant électronique |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112852309A (zh) * | 2021-02-24 | 2021-05-28 | 东莞市博翔电子材料有限公司 | 一种用于动力电池铝塑膜的胶粘剂及其加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
KR20140074869A (ko) | 2014-06-18 |
JPWO2013047145A1 (ja) | 2015-03-26 |
TW201319194A (zh) | 2013-05-16 |
WO2013047145A1 (fr) | 2013-04-04 |
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