CN103518002A - 包括保护装置的管状靶材 - Google Patents

包括保护装置的管状靶材 Download PDF

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Publication number
CN103518002A
CN103518002A CN201280017348.0A CN201280017348A CN103518002A CN 103518002 A CN103518002 A CN 103518002A CN 201280017348 A CN201280017348 A CN 201280017348A CN 103518002 A CN103518002 A CN 103518002A
Authority
CN
China
Prior art keywords
tubular target
molybdenum
tubular
protective device
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280017348.0A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯汀·林克
曼弗莱德·苏利克
马丁·卡特赖因
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee SE
Original Assignee
Plansee SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee SE filed Critical Plansee SE
Priority to CN201811191898.XA priority Critical patent/CN109609917A/zh
Publication of CN103518002A publication Critical patent/CN103518002A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201280017348.0A 2011-04-08 2012-04-05 包括保护装置的管状靶材 Pending CN103518002A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811191898.XA CN109609917A (zh) 2011-04-08 2012-04-05 包括保护装置的管状靶材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM203/2011 2011-04-08
ATGM203/2011U AT12695U1 (de) 2011-04-08 2011-04-08 Rohrtarget mit schutzvorrichtung
PCT/AT2012/000094 WO2012135883A1 (de) 2011-04-08 2012-04-05 Rohrtarget mit schutzvorrichtung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201811191898.XA Division CN109609917A (zh) 2011-04-08 2012-04-05 包括保护装置的管状靶材

Publications (1)

Publication Number Publication Date
CN103518002A true CN103518002A (zh) 2014-01-15

Family

ID=46968455

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280017348.0A Pending CN103518002A (zh) 2011-04-08 2012-04-05 包括保护装置的管状靶材
CN201811191898.XA Pending CN109609917A (zh) 2011-04-08 2012-04-05 包括保护装置的管状靶材

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201811191898.XA Pending CN109609917A (zh) 2011-04-08 2012-04-05 包括保护装置的管状靶材

Country Status (8)

Country Link
US (1) US10978279B2 (enExample)
EP (1) EP2694697B1 (enExample)
JP (1) JP6328550B2 (enExample)
KR (1) KR102068366B1 (enExample)
CN (2) CN103518002A (enExample)
AT (1) AT12695U1 (enExample)
TW (1) TWI568870B (enExample)
WO (1) WO2012135883A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105296944A (zh) * 2015-10-27 2016-02-03 有研亿金新材料有限公司 一种具有抗氧化镀层的靶材组件
CN108517498A (zh) * 2018-04-17 2018-09-11 洛阳科威钨钼有限公司 一种用于磁控溅射的一体式管状钼靶材的制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9992917B2 (en) 2014-03-10 2018-06-05 Vulcan GMS 3-D printing method for producing tungsten-based shielding parts
TW201911853A (zh) * 2017-08-10 2019-03-16 聚晶半導體股份有限公司 雙攝像頭影像擷取裝置及其攝像方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1103103A (zh) * 1993-06-29 1995-05-31 三井东压化学株式会社 密封膜制液晶室树脂组合物
WO2001077402A2 (en) * 2000-04-07 2001-10-18 Surface Engineered Products Corporation Method and apparatus for magnetron sputtering
CN1538545A (zh) * 2003-04-16 2004-10-20 刘奥宇 可控金属燃料电池
CN1992112A (zh) * 2005-12-29 2007-07-04 华晶科技股份有限公司 控制开关连接结构
CN101386719A (zh) * 2008-08-28 2009-03-18 冯守中 多功能涂料及其制备方法
CN101434818A (zh) * 2007-11-15 2009-05-20 郭东明 异氰酸酯改性水性聚合物防水涂料

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Publication number Priority date Publication date Assignee Title
US2301559A (en) * 1938-10-21 1942-11-10 Hancock Mfg Company Door latch
US4719035A (en) 1984-01-27 1988-01-12 The United States Of America As Represented By The Secretary Of The Air Force Corrosion inhibitor formulation for molybdenum tungsten and other metals
JPH02301559A (ja) 1989-05-15 1990-12-13 Kojundo Chem Lab Co Ltd 一体構造型スパッタリングターゲット
JPH0499270A (ja) 1990-08-11 1992-03-31 Fujitsu Ltd スパッターターゲット及びスパッター成膜方法
JPH0539566A (ja) 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH0817763A (ja) 1994-06-28 1996-01-19 Riyouka Massey Kk スパッタリングターゲット
JP3712553B2 (ja) 1999-02-19 2005-11-02 忠弘 大見 スパッタリング装置
AU2001284441A1 (en) * 2000-09-08 2002-03-22 Asahi Glass Company, Limited Cylindrical target and method of manufacturing the cylindrical target
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
JP2004123874A (ja) * 2002-10-01 2004-04-22 Nippon Steel Chem Co Ltd フィルム形成用樹脂組成物及びフィルム状接着剤
EP1766721B1 (en) * 2004-06-04 2011-08-17 Radiall USA, Inc. Circuit component and circuit component assembly for antenna circuit
US20050279630A1 (en) * 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
DE102005030484B4 (de) 2005-06-28 2007-11-15 Carl Freudenberg Kg Elastischer Vliesstoff, Verfahren zu dessen Herstellung und dessen Verwendung
EP1752556B1 (de) * 2005-08-02 2007-10-31 Applied Materials GmbH & Co. KG Rohrkathode für die Verwendung bei einem Sputterprozess
AT8697U1 (de) * 2005-10-14 2006-11-15 Plansee Se Rohrtarget
WO2007049765A1 (ja) * 2005-10-27 2007-05-03 Mitsubishi Plastics, Inc. 燃料電池用セパレータ、該セパレータを用いた燃料電池及び該セパレータ調製用塗料組成物
DE102006003279B4 (de) 2006-01-23 2010-03-25 W.C. Heraeus Gmbh Sputtertarget mit hochschmelzender Phase
JP2007302981A (ja) 2006-05-15 2007-11-22 Hitachi Metals Ltd 円筒型Ｍｏ合金スパッタリングターゲット材の製造方法
US20080127887A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Vertically mounted rotary cathodes in sputtering system on elevated rails
US20080296352A1 (en) 2007-05-30 2008-12-04 Akihiro Hosokawa Bonding method for cylindrical target
US7785921B1 (en) * 2009-04-13 2010-08-31 Miasole Barrier for doped molybdenum targets
US20110014469A1 (en) * 2009-07-14 2011-01-20 Sakai Chemical Industry Co., Ltd. Magnesium oxide particle, method for producing it, exoergic filler, resin composition, exoergic grease and exoergic coating composition
US8449818B2 (en) * 2010-06-30 2013-05-28 H. C. Starck, Inc. Molybdenum containing targets
JP2012162759A (ja) 2011-02-04 2012-08-30 Sumitomo Metal Mining Co Ltd 円筒形スパッタリングターゲット

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1103103A (zh) * 1993-06-29 1995-05-31 三井东压化学株式会社 密封膜制液晶室树脂组合物
WO2001077402A2 (en) * 2000-04-07 2001-10-18 Surface Engineered Products Corporation Method and apparatus for magnetron sputtering
CN1538545A (zh) * 2003-04-16 2004-10-20 刘奥宇 可控金属燃料电池
CN1992112A (zh) * 2005-12-29 2007-07-04 华晶科技股份有限公司 控制开关连接结构
CN101434818A (zh) * 2007-11-15 2009-05-20 郭东明 异氰酸酯改性水性聚合物防水涂料
CN101386719A (zh) * 2008-08-28 2009-03-18 冯守中 多功能涂料及其制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105296944A (zh) * 2015-10-27 2016-02-03 有研亿金新材料有限公司 一种具有抗氧化镀层的靶材组件
CN108517498A (zh) * 2018-04-17 2018-09-11 洛阳科威钨钼有限公司 一种用于磁控溅射的一体式管状钼靶材的制备方法
CN108517498B (zh) * 2018-04-17 2020-04-21 洛阳科威钨钼有限公司 一种用于磁控溅射的一体式管状钼靶材的制备方法

Also Published As

Publication number Publication date
JP6328550B2 (ja) 2018-05-23
EP2694697A1 (de) 2014-02-12
AT12695U1 (de) 2012-10-15
EP2694697B1 (de) 2018-08-01
US10978279B2 (en) 2021-04-13
US20140027276A1 (en) 2014-01-30
JP2014514449A (ja) 2014-06-19
WO2012135883A1 (de) 2012-10-11
KR102068366B1 (ko) 2020-01-20
CN109609917A (zh) 2019-04-12
TW201245482A (en) 2012-11-16
TWI568870B (zh) 2017-02-01
KR20140018274A (ko) 2014-02-12

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Application publication date: 20140115

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