CN103493292A - 半柔性封装上的系统集成和毫米波相控阵列天线 - Google Patents

半柔性封装上的系统集成和毫米波相控阵列天线 Download PDF

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CN103493292A
CN103493292A CN201280013382.0A CN201280013382A CN103493292A CN 103493292 A CN103493292 A CN 103493292A CN 201280013382 A CN201280013382 A CN 201280013382A CN 103493292 A CN103493292 A CN 103493292A
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substrate
integrated circuit
millimeter wave
antenna
array
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CN103493292B (zh
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H·K·潘
M·鲁伯托
B·D·霍里内
S·拉维德
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Intel Corp
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    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
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    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/067—Two dimensional planar arrays using endfire radiating aerial units transverse to the plane of the array
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    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
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    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
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    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H01Q3/36—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means with variable phase-shifters
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    • Y10T29/00—Metal working
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Abstract

本文描述了用于实现三维波束覆盖的无线天线阵列系统的实施例。公开了具有一个RFIC的柔性衬底上的集成多个相控天线阵列。用这样的方法，模块可以被模制到例如笔记本或个人区域网络或局域网的中心的平台的轮廓上。多个相控阵列可以在紧凑的尺寸中3D弯曲以便适应于薄的移动平台。当由一个RFIC同时驱动时，不同的阵列天线或天线在具有波束扫描能力的不同的球面方向中辐射。

Description

半柔性封装上的系统集成和毫米波相控阵列天线
对相关申请的交叉引用
本申请要求2011年3月15日提交的名称为“ANTENNAARCHITECTURE，ANTENNA SYSTEM AND A METHOD THEREOF″的美国临时申请No.61／452，754的优先权，其整个公开通过引用全部并入本文。
技术领域
总的来说，本发明一般涉及毫米波接收器和传送器并且特别涉及采用相控阵列的集成毫米波装置。
背景技术
近年来，商业通信和雷达应用的操作频率也已经朝着无线电频谱的顶端增大，包括在毫米波长的操作。随着硅片在更小的区域以更低成本在更高的频率呈现更强的功能性，为商业和消费电子应用制造高频宽带IC在经济上正变得可行。高频宽带IC应用现在包括毫米(mm)波应用，例如在24GHz和60GHz的短程通信和在24GHz和77GHz的汽车雷达。
技术发展允许大量的语音、视频、图像和数字信息的数字化和压缩。在无线移动无线电通信中的装置之间传输数据的需要要求在高数据速率的准确数据流的接收。提供允许无线电，尤其是无线移动装置处理增长的容量的天线，同时提供实现在方位角和仰角上的天线覆盖的改进质量将是有利的。提供并入集成、紧凑、高性能的天线的更小波形因数给移动互联网装置和／或接入点也将是有利的。
附图说明
在说明书的结束部分特别指出被认为是本发明的主题并明确对其要求权利。然而，当和附图一起阅读通过参考以下详细描述可最好地理解本发明，关于操作的方法和组织，连同其目标、特征和优点，其中：
图1是根据实施例的图示使用极高频率无线电信号来在无线网络中通信的装置的框图；
图2是根据实施例的N元素毫米波收发器RFIC架构的框图；
图3是根据实施例的使用在顶部具有柔性层的半柔性封装用于以下的FR-4封装和天线集成的共形天线模块的图示；
图4是根据实施例的柔性衬底上的毫米波相控天线阵列与标准FR-4层叠上的BBIC／RFIC集成的图示；
图5是根据实施例的包括用来提供顶部和正面区域波束扫描覆盖的顶部的2X8矩形阵列和2X8矩形阵列的天线模块的图示；
图6是根据实施例的提供顶部、侧面和正面空间覆盖的3D相控天线阵列包装的图示；
图7是根据实施例的具有附连的单个高增益天线以提供顶部、侧面和正面空间覆盖的3D相控天线阵列包装的图示；
图8示出根据实施例的一对共线毫米波锥形缝隙天线阵列(2X8)和关联的辐射图；
图9图示根据实施例的相控阵列天线配置和扫描角之间的关系；
图10示出根据实施例的缝隙回路(slot loop)天线和关联的辐射图；以及
图11示出根据实施例的稍微向上弯曲以便为毫米波应用提供期望的覆盖和阵列的扫描辐射图的相控天线阵列(2X8)。
具体实施方式
如本文使用的术语PBSS控制点(PCP)被定义为作为毫米波网络的控制点操作的站(STA)。
如本文使用的术语接入点(AP)被定义为具有STA功能性并且经由无线媒体(WM)为相关联的STA提供到分配服务的接入的任何实体。
如本文使用的术语无线网络控制器被定义为作为无线网络的AP和／或作为PCP操作的站。
如本文使用的术语方向带(DBand)被定义为其中信道启动频率超过45GHz的任何频率带。
如本文使用的术语DBand STA被定义为其无线电传送器在DBand内的信道上操作的STA。
如本文使用的术语个人基本服务集(PBSS)被定义为基本服务集(BSS)，所述BSS形成ad hoc自包含网络，在DBand操作，包括一个PBSS控制点(PCP)，并且其中到分配系统(DS)的接入不出现但PBSS内转发服务可选地出现。
如本文使用的术语调度的服务期(SP)由服务质量(QoS)AP或PCP调度。如果期望的话，调度的SP可在固定的时间间隔处开始。
如本文使用的术语“业务”和／或“业务流”被定义为例如STA的无线装置之间的流和／或数据流。本文使用的术语“会话”被定义为保存或存储具有建立的直接物理链接(例如，排除转发)的一对站中的状态信息；状态信息可描述或定义会话。
如本文使用的术语“无线装置”包括，例如能够无线通信的装置、能够无线通信的通信装置、能够无线通信的通信站、能够无线通信的便携式或非便携式装置等。在一些实施例中，无线装置可以是或可包括与计算机集成的外围装置或附在计算机上的外围装置。在一些实施例中，术语“无线装置”可以可选地包括无线服务。
本文描述的本发明的实施例可包括用于60GHz无线个人区域网络和／或无线局域网(WPAN／WLAN)通信系统的活动的共形相控阵列天线模块。这里描述的设计方法由在平台上部署在60GHz的尽可能少的活动天线模块的需要所指引以便在大量制造生产中用低成本和低功耗得到完全的或伪全面的覆盖。
本发明的示范性实施例可包括笔记本和／或笔记本平台，其被假定为个人区域网络或局域网的中心，尽管本发明的范围在这方面不受限制。如果希望的话，本发明的实施例可同等地应用到手持设备、平板和任何其他通信装置。
尽管本发明的范围在这方面不受限制，具有用于降低成本的给定的技术的最佳方法可以是使许多天线印刷到单个薄的共形(柔性)封装材料上，当用单个射频集成电路(RFI C)芯片驱动时，所述封装材料可被模制(mold)到平台的轮廓上(如果期望的话)。
例如，将许多相控阵列或固定天线印刷到单个材料柔性衬底上可使得在由单个RFI C芯片同时驱动时，不同阵列天线和／或其他类型的天线能够在具有波束扫描能力的不同的球面方向中辐射。在RFIC芯片内实现数字信号处理算法可能够实现扫描跨过不同的正交方向的无缝波束。在这个方法中，单个毫米波模块具有在所有方向提供完整的准全面覆盖的能力。唯一的要求是平台的一个区域需要足够结实(rugged)以便使RFIC的倒装芯片附连适应于平台并且以便允许所有的数字／偏差和RF低中频(IF)频率信号的导入(porting)以及允许线缆端口和／或焊料放落垫(landing pad)适应外部线缆连接(cabling)的附连。例如，RFIC可包括集成的毫米波收发器并且相位阵列天线可包括共形天线。
应该理解本发明可在各种应用中使用。尽管本发明在这方面不受限制，本文公开的电路和技术可在例如无线电系统的站的许多仪器中使用。意在被包括在本发明的范围内的站包括(仅举例来说)WLAN站、无线个人网络(WPAN)等。
意在在本发明的范围内的WPAN站的类型包括(虽然不限于)能够作为多频带站操作的站、能够作为PCP操作的站、能够作为AP操作的站、能够作为DBand站操作的站、移动站、接入点、用于接收和传送扩频信号(诸如，例如跳频扩频(FHSS)、直接序列扩频(DSSS)、补码键控(CCK)、正交频分复用(OFDM)等)的站。
本公开的附加特征和优点将在接着的描述中阐述，并且根据描述部分将是显而易见的，或可通过本公开的实践学习。本公开的特征和优点可通过在附加的权利要求中特别指出的组合和仪器来实现和获得。根据以下的描述和附加的权利要求，本公开的这些和其他特征将变得更完全显而易见，或可通过如本文阐述的本公开的实践学习。
在下面的细节中讨论本公开的各种实施例。虽然讨论特定的实现，应该理解这只是为了说明的目的而进行。相关领域的技术人员将认识到在不脱离本公开的精神和范围的情况下，可使用其他部件和配置。
尽管本发明的实施例在这方面不受限制，利用诸如，例如“处理”、“计算”、“演算”、“确定”、“应用”、“接收”、“建立”、“分析”、“检查”等的术语的讨论可涉及计算机、计算平台、计算系统或其他电子计算装置的操作和／或过程，所述操作和／或过程操纵计算机的寄存器和／或存储器内表示为物理(例如电子)量的数据和／或将其变换成计算机的寄存器和／或存储器或可存储用于执行操作和／或过程的指令的其他信息存储媒体内类似地表示为物理量的其他数据。
尽管本发明的实施例在这方面不受限制，本文使用的术语“复数”和“复数”可包括，例如“多个”或“两个或更多”。术语“复数”和“复数”可用于整个说明书来描述两个或更多部件、装置、元件、单元、参数等。例如，“多个电阻器”可包括两个或更多电阻器。如本文使用的术语耦合被定义为以任何期望的形式(例如机械地、电子地、数字地、直接地、通过软件、通过硬件等)可操作连接。
图1是根据实施例的无线通信系统100的示意框图。系统100包括一对可多频带站102和104，例如同等的服务质量(QSTA)站。尽管为了简单只示出两个站(STA)，本发明不限于任何特定数量的STA。使用第一可多频带站102作为示例，每个STA包括具有用于收发原语的MAC接口(未示出)的站管理实体(SME)126和146、用于在原语和MAC帧之间转换的处理器120以及用于收发原语-转换的MAC帧的物理层接口(未示出)。物理层(PHY)实体116具有用于收发MAC帧的MAC接口(未示出)以及连接到例如STA104的同等STA PHY实体的用于收发物理层通信的在线上(未示出)的物理层接口。
通常，PHY实体(STA102和104中的116)经由附图标记121表示的无线链接，通过包括印刷到单个薄的共形(柔性)封装材料上的天线的天线160(STA102)和天线260(STA104)来通信，当用与执行传送器140和接收器150的功能的天线阵列相关联的一个RFIC250驱动时，所述封装材料可被模制到平台的轮廓上。天线160或260可包括内部和／或外部RF天线，例如偶极天线、单极天线、全方向天线、端部馈电天线、圆偏振天线、微带天线、分集式天线或适合用于传送和／或接收无线通信信号、块、帧、传送流、分组、消息和／或数据的任何其他类型的天线。在一些实施例中，站110可包括例如一个或多个处理器120、一个或多个存储器单元130、一个或多个传送器140、一个或多个接收器150以及一个或多个天线160或260。站110还可包括其他适当的硬件部件和／或软件部件。虽然RFIC250和天线260示出为离散部件，在不影响装置的功能性的情况下，预期这些装置可以被集成为单个衬底并且其他部件可以被加入或移除。此外，RFIC250可包括集成的毫米波收发器并且天线260可包括共形天线。在RFIC250内实现数字信号处理算法使得无缝的单毫米波模块能够提供在所有方向中的完全的准全面覆盖。
处理器120可包括例如中央处理单元(CPU)、数字信号处理器(DSP)、微处理器、控制器、芯片、微芯片、集成电路(IC)或任何其他适当的多用途或特定处理器或控制器。处理器120可例如处理由站102接收到的数据和／或处理意在用于通过站102传送的数据。
存储器单元130可包括例如随机存取存储器(RAM)、只读存储器(ROM)、动态RAM(DRAM)、同步DRAM(SD-RAM)、闪速存储器、易失性存储器、非易失性存储器、高速缓冲存储器、缓冲器、短期存储器单元、长期存储器单元或其他适当的存储器单元或存储单元。存储器单元130可例如存储由站104接收到的数据和／或存储意在用于通过站102传送的数据和／或存储用于执行包括例如本文描述的方法的实施例的站102的操作的指令。
根据本发明的一些实施例，传送器140可包括例如能够传送RF信号(例如通过天线160)的无线射频(RF)传送器，并且可以能够传送由例如多流多频带正交频分调制(MSMB OFDM)系统生成的信号。传送器140可使用例如传送器、收发器或传送器-接收器或能够执行传送和／或接收无线通信信号、块、帧、传送流、分组、消息和／或数据的分离或集成功能的一个或多个单元来实现。系统实现的一个方法可以包括基带信号(IF信号)在模块中被调制到IF载波上的分离的模块拓扑，所述模块可以在物理上远离包括电路和天线的天线模块平台。然后，来自基带模块的IF信号经由线缆连接被导入到一个或多个共形天线模块，并且然后通过集成在共形天线模块中的射频电路被上转换到例如60GHz的期望的频率。然后，上转换的60GHz信号由分离器分离N次以便驱动例如在衬底上的多个毫米波天线的N个芯片上的收发器。如图2所示，每个收发器是双向的，包括移相器264和低噪声放大器(LNA)和／或功率放大器(PA)266。
根据本发明的一些实施例，接收器150可包括例如能够接收RF信号(例如通过天线160)的无线射频(RF)接收器，并且可以能够接收由例如多流多频带正交频分调制(MSMB OFDM)系统生成的信号。接收器150可使用例如接收器、收发器或传送器-接收器或能够执行接收和／或传送／接收无线通信信号、块、帧、传送流、分组、消息和／或数据的分离或集成功能的一个或多个单元来实现。
图2是根据实施例的N元素毫米波收发器RFIC架构的框图。N个收发器中的每一个可连接到N元素相控阵列天线中的天线元件260。在一个示范性实施例中，天线模块包括具有2GHz基带信号的多个毫米波天线(N=32)，所述2GHz基带信号在像基带集成电路(BBIC)的远程模块中被调制到例如12GHz的载波上。12GHz的被调制的信号可到达共形天线模块并且在例如RFIC250的框图中示出的RFIC的端口252的IF信号输入／输出端口处被导入Si CMOS RFIC250中。
根据示范性实施例，在传送器(TX)或接收器(RX)模式中，在端口252的单端的12GHz的被调制的信号可在无源的双向混频器254中被上转换／下转换到60GHz。然后信号通过双向放大器258并且在分离器262被分离N次。然后信号的相位由移相器262控制并且相应地在TX／RX模式通过PA／LNA266。然后信号经由倒装凸点(flip bump)进入具有集成天线的封装材料中。振荡器256生成被馈送到无源双向混频器254的输出信号以在端口252上转换／下转换IF信号。振荡器256具有输入／输出端口257以在与上转换的信号(60GHz)相同的频率提供样本输出信号或接收例如控制信号的来自外部源的信号。由于振荡器(晶体)256对温度变化的敏感性，它可以在不同的封装中。例如不平衡变压器253的不平衡变压器电路可用于平衡电路之间的信号。同样地，全面的RX输入信号还可以通过例如放大器259的放大器电路放大。
图3是根据实施例的使用在顶部具有柔性层的半柔性封装用于以下的FR-4封装和天线集成的共形天线模块的图示。示出装入在共形毫米波天线模块上的RFIC250倒装芯片。附图图示在例如PCIe卡模块的混合薄片模块(半柔性封装)衬底310上的RFIC250和BBIC340的直接芯片附连(DCA)，但是它还可以只是具有如在关于图1的先前段落中描述的IF接口的集成在模块上的RFIC。RFIC250或BBIC340芯片是在具有管芯区(die area)布线(routing)的共形天线模块上放落(350)的倒装芯片。天线模块260建立在薄片封装的顶层上。虽然示出为单成，它可以不限于单层并且可以是多个柔性顶层。顶部的柔性层可使用低损耗正切材料以实现最低毫米波损耗和最佳毫米波天线性能。存在有可以在顶层上实现的多种柔性材料衬底310，例如，例如Ultralam3000的液晶聚合物(LCP)、聚酰亚胺、特氟纶、低温共烧陶瓷、氧化铝、天线级核心材料和薄片、杜罗伊德合金钢、高电阻率硅或用于毫米波应用的一个或多个其他适当的衬底。在管芯区下，标准FR-4薄片330被放置在柔性层下用于不是关键毫米波RF信号并且实现最低制造成本的数字／功率／地布线。RFIC259电路被固定到例如玻璃纤维板(如FR-4封装)的底部衬底使得平台(柔性衬底310)的一个区域足够结实(rugged)以便使RFIC的倒装芯片附连适应于平台并且以便允许所有的数字／偏差和RF低中频(IF)频率信号的导入以及允许线缆端口和／或焊料放落垫适应外部线缆连接的附连。RFIC250还可以由从组中选择的其他衬底来固定，所述组包括印刷电路板(PCB)、温度抵抗(temperature-res istant)玻璃纤维板(FR-5)、陶瓷衬底、金属核PCB(MCPCB)、直接铜接合(DCB)衬底、金属复合板、镀铜铝板以及铝板。
在这个设计方法中，毫米波相控阵列天线或其他任何其他天线设计可以是共形的以提供柔性来适应例如笔记本或移动装置的任何移动平台，并且在增益、带宽和扫描能力方面保持最佳电磁性能。传统地，天线元件由它自己的活动装置控制。然而，在控制天线元件中使用的活动装置可以是昂贵的，并且在一些情况下可甚至要求放大器的一级或多级。甚至当活动装置是相对便宜时，系统可要求大容量数字存储器来支持一大组视野(FOV)。对于具有单个控制器的相控阵列系统，问题是在不同天线阵列元件臂之间的布线320内的信号延迟。为了最小化延迟，布线320被维持大致相等距离以便为宽带波束图稳定性控制组延迟。选择线路的长度使得天线元件将被激励成与其余的天线元件同相，或当接收来自通信装置的信号时被激励使得信号将大致在相同时间到达RFI C250。根据拓扑，这要求传送线路弯曲以便使封装内的不同臂之间的延迟相等。
图4是根据实施例的柔性衬底上的毫米波相控天线阵列与标准FR-4层叠上的BBIC／RFIC集成的图示。根据另一个实施例，提供了相控天线阵列实现。因为缝隙回路天线阵列设计是在单层电介质衬底上，它可以用与用于示出的RFIC／BBIC410布线320的低成本FR-4板／HDI(高密度互连)技术330组合的扩展低成本柔性层来实现。相控天线阵列可弯曲成不同配置例如弯曲405成垂直的用于空间覆盖并且仍保持紧凑尺寸。包括集成封装和IC的整个毫米波相控天线阵列可以呈紧凑波形因数的形状。相控天线阵列还可通过分离柔性衬底的每个侧面上的阵列的一半来设计并且最终如图4所示在平台上共同弯曲。用这种方法，存在简单的踪迹布线并且它还通过馈送如关于布线320所示的踪迹而最小化天线元件耦合。相控天线阵列的上半部稍微向上弯曲以便提供用常规的相控阵列设计可能无法实现的顶部上的覆盖。
存在有可以被实现以提供板空间波束扫描覆盖的许多天线阵列设计。附图5-11展示用来提供不同的空间方向性增益和空间覆盖的许多不同的天线阵列配置。注意到毫米波天线设计和配置不限于以下示出的图示。根据平台和应用，它可以以许多其他方式被实现以利用共形天线模块。
图5是根据实施例的包括用来提供顶部和正面区域波束扫描覆盖的顶部上的2X8矩形阵列和正面上的2X8矩形阵列的天线模块的图示。两个2X8矩形阵列提供相等的增益和覆盖给顶部和正面，如在顶部波束430和正面区域波束440扫描覆盖所示。这个拓扑可以在膝上型计算机盖或基座中实现以提供远离用户的空间覆盖。RFIC250芯片示出在靠近分离矩形阵列的弯曲区域420的天线模块的上部分。阵列可以通过具有单排阵列(1X8)和添加一排到正面阵列(3X8)来进一步修改。在这个拓扑中，顶部扫描具有与大约2dB阵列增益衰减相同的覆盖。但是因为毫米波应用可在室内环境中使用。来自修改的装置的空间覆盖可以少于(LT)三米范围。在另一方面，通过使用附加的元件矩形阵列来增大正面覆盖以实现更高的增益。
图6是根据实施例的提供顶部、侧面和正面空间覆盖的3D相控天线阵列包装的图示。图6中的实施例将柔性衬底上的多个相控天线阵列与单个RFIC集成。用这种方法，模块可被模制到例如膝上型计算机或笔记本计算机的平台的轮廓上。多个相控阵列可以在紧凑的尺寸中3D弯曲以便适应于薄的移动平台。这个实施例提供具有相控天线阵列的集成RFIC的解决方案并且传递准全面毫米波空间覆盖。为了实现完整的三维空间覆盖，如果期望的化，可使用图示的天线配置。图示的是四个子阵列：用于提供正面630中的空间覆盖的2X8矩形阵列604、用于提供到顶部区域620的覆盖的1X8线性阵列602以及用于提供两个侧面610上的短程覆盖的两个线性1X4阵列605。使用膝上型计算机作为示例，由于摄像头和麦克风放置在盖的中央，侧面线性阵列中的一个具有更长得多的踪迹布线和毫米波踪迹上更高的路径损耗。即使这样，它还可提供并入更长踪迹损耗的阵列增益(大约5-6dB)。它可通过侧面装置通信链接提供在附近的覆盖。并且通信链路装置的另一端也可具有更高的天线增益(大于10-15dB)以增强覆盖区域。它还可用右边的单个高增益天线来实现以克服来自放置在膝上型计算机盖的中央的盖电子的阻塞。示出扫描顶部620、扫描正面630和扫描尺寸610的空间覆盖。
图7是根据实施例的具有用于提供顶部、侧面和正面空间覆盖的附连的单个高增益天线的3D相控天线阵列包装的图示。锥形缝隙天线(TSA)和它的扫描侧面720空间覆盖一起示出。单个高增益天线710可以是八木、调谐驻波天线或任何其他高增益天线设计。由于使用单个高增益天线710，不存在到那个侧面的扫描能力，但是具有固定的方向增益。单个高增益天线也同样需要克服盖中央电子阻塞。在所有的设计中，可包括放置在天线阵列设计的边缘上的边缘仿真天线元件。边缘仿真天线元件的目的是当波束扫描到不同角度时，使天线阵列带宽和频率覆盖稳定。那些边缘仿真天线元件与负载电阻器端接。
图8示出根据实施例的一对共线毫米波锥形缝隙天线阵列(2X8)和相关联的辐射图。这个实施例将线性相控天线阵列放置在封装设计的顶部810和底部820层上。中间的两层线性阵列间隔可以小于五百微米(≤500μm)。线性相控阵列天线放置不限于封装设计的顶部810和底部820层。当要求多于两个线性阵列时，它们还可例如被放置在板的顶部和底部层上，并且模块可以沿着高度维度被放置在移动平台基座的中间。图示共线2X8锥形缝隙端射阵列天线的示例。如所示的，天线元件设计不限于锥形缝隙天线并且它还可以是八木、折叠偶极、弯曲偶极／单极设计等。这个方法学可使用180偏馈来实现更高的分离并且能够实现密集的天线阵列放置。如在元件毫米波TSA阵列辐射图830中所示，N元素(16)密集毫米波阵列传递阵列天线增益(≥15dBi)中的增长。为了扩展设计概念，存在有可与一个RFIC集成并且传递准全面空间覆盖的多个阵列天线设计。
当前，平面的端射阵列天线是或者单个线性阵列或者实现到3D结构中。单个线性阵列天线具有更高的封装路径损耗并且对于大量的阵列元件更难实现。3D阵列结构是庞大的、昂贵的并且难以适应于移动平台。这个实施例允许多个线性阵列在薄的平面封装中堆叠起来。用这个方法，可实现高密度集成。
根据本发明的实施例，天线可包括在薄的平面封装结构中的两个线性阵列的实现并且可使用180相位偏移方法来最小化串扰并且允许密集的集成。它允许多于一个的线性阵列集成在密集的薄的封装多层结构中。
本发明的实施例可传递紧凑的毫米波阵列天线设计和RFIC集成以及提供用于方向适应的波束形成的高增益。本发明能够实现其他方法可能无法提供的毫米波阵列天线的薄的平面封装。
备选的是，但不限于，端射辐射图天线阵列可只提供水平面上的方位角覆盖，但是不提供宽面(broads ide)上的覆盖。例如，在平台成本、大小和平台实现上要求多个相控天线阵列的膝上型计算机和其他移动装置是能够实现60GHz技术的主要约束。根据本发明的一些实施例，为了解决上述问题，本发明的实施例可提供单个柔性电介质衬底缝隙回路天线阵列，所述天线阵列为移动装置提供完整的半球空间覆盖并且为全世界的60GHz技术部署提供大于十一千兆赫(>11GHz)的带宽覆盖。例如，毫米波天线元件设计可替代常规的宽面辐射图天线元件，缝隙回路天线形成磁回路，其等效于电偶极，如图10中所示。通过调谐回路两个边缘长度比(a／b)，实现更宽的辐射图。缝隙回路天线设计可以是圆形的或矩形的。
图9图示根据实施例的相控阵列天线配置和扫描角之间的关系。相控阵列天线配置910和在0度(0°)920、30度(30°)和45度(45°)940的辐射图。实现所示天线阵列中的倾斜辐射图天线元件，矩形毫米波天线元件(2X8)提供在90度的10dBi增益和在宽面的15dBi。如果在膝上型计算机或移动装置的两个边缘上使用两个天线阵列，它将具有完整的正面和侧面覆盖。如从图中可以看到的，线性1X16阵列提供沿着YZ的干扰减轻，但是具有对移动的敏感性。2X8阵列是干扰减轻和对移动的敏感性之间的折衷。4X4阵列对移动较不敏感但是在干扰减轻中不一样强大。
图10示出根据实施例的缝隙回路天线和相关联的辐射图。根据本发明的另一实施例，缝隙回路天线260可提供如所示的宽面辐射图1010和沿着xz平面1020的接近半球的全面辐射图0。沿着xz平面1020的更宽的辐射图可提供沿着x轴1005的180度的宽的波束扫描范围。毫米波缝隙回路天线设计使用单层电介质来简化具有分离的金属的结构以消除反向辐射。回程损耗低于(<10dB)跨过55-66GHz并且为全世界的60GHz技术部署提供较大(>11GHz)的带宽覆盖。根据这个实施例，缝隙回路天线阵列还可免受互耦。这提供了天线阵列波束扫描中的更好性能。缝隙回路天线可以被倾斜以改变特定方向中的增益。例如，平面的表面上的天线设计可提供45度倾斜波束。由具有偏移带状线馈送的地平面所支持的矩形缝隙回路天线实现了45倾斜波束。两个边缘比(a／b)和开口缝隙缺口中的调谐将实现45度倾斜波束图。可以用峰值增益(4dB-8dB的范围)来实现宽天线带宽(55-64GHz的范围)。毫米波天线元件设计可使用在标准FR-4制造过程中使用的低损耗聚四氟乙烯(PTFE)衬底材料。
图11示出根据实施例的稍微向上弯曲以便为毫米波应用提供期望的覆盖和阵列的扫描辐射图的相控天线阵列(2X8)。相控天线阵列260的上半部稍微向上弯曲以提供用如图9所示的矩形阵列(2X8)的常规相控阵列设计可能无法实现的顶部1110上的覆盖。由于上半部天线阵列260上的弯曲的小角度，那些天线元件仍提供辐射增益到天线阵列的正面。这个阵列可以实现沿着Y轴1120的正面区域中的增益(大约15-17dB)中的增大。单独的天线元件具有沿着Y轴的接近全面辐射图。因此，它还提供侧面辐射图覆盖1130。共形的单层柔性毫米波相控天线阵列很容易在例如膝上型计算机盖的移动平台中实现。它可用简单的夹子在移动平台的盖壁上保持在适当位置。
虽然以上描述可包括特定细节，它们不应该被理解为以任何方法限制权利要求。本公开的描述的实施例的其他配置是这个公开的范围的一部分。例如，本公开的原理可应用到每个单独的用户，其中每个用户可单独部署这样的系统。这使得每个用户能够利用本公开的好处(即使大量的可能应用中的任何一个不需要本文描述的功能性)。换句话说，存在有以各种可能方法各自处理内容的部件的多个实例。它不一定需要是由所有终端用户使用的一个系统。因此，应该只有附加的权利要求和它们的合法等同限定本公开，而不是给定的任何特定示例。

Claims (21)

1.一种毫米波(mm-wave)通信装置，包括：
衬底上包括多个毫米波天线的天线模块，其中所述衬底可以被模制或弯曲以在不同球面方向中辐射；以及
通过传送线路连接到所述多个毫米波天线的所述衬底上的集成电路；
其中所述集成电路配置成使用毫米波信号通信。
2.如权利要求1所述的毫米波通信装置，其中所述集成电路选自包括射频集成电路(RFIC)、基带集成电路(BBIC)或其组合的组。
3.如权利要求2所述的毫米波通信装置，其中连接所述多个毫米波天线的所述传送线路被布线成使所述天线模块中的延迟相等。
4.如权利要求2所述的毫米波通信装置，其中所述RFIC包括用于组合从所述多个毫米波天线被引导的信号并且将信号分成多个信号以便驱动所述天线模块的分离器。
5.如权利要求4所述的毫米波通信装置，其中所述集成电路通过从芯片和电线组装件、板上芯片组装件或倒装芯片组装件中选择的技术被附连到所述衬底。
6.如权利要求5所述的毫米波通信装置，其中所述衬底由选自包括液晶聚合物、特氟纶、低温共烧陶瓷、氧化铝、天线级核心材料和薄片、杜罗伊德合金钢、高电阻率硅或用于毫米波应用的一个或多个其他适当衬底的组中的材料而制成。
7.如权利要求6所述的毫米波通信装置，其中所述集成电路被固定到较低层衬底，所述较低层衬底选自包括印刷电路板(PCB)、玻璃纤维板(FR-4)、温度抵抗玻璃纤维板(FR-5)、陶瓷衬底、金属核PCB(MCPCB)、直接铜接合(DCB)衬底、金属复合板、镀铜铝板以及铝板的组。
8.一种适合于安装在电子装置中以便与其他电子装置通信的通信系统，包括：
适合于传输和接收来自天线模块的在第一频率的信号的接口；以及
所述天线模块包括：
衬底上包括多个毫米波天线的至少一个天线阵列，其中所述衬底可以被模制或弯曲以在不同球面方向中辐射；
通过传送线路连接到所述多个毫米波天线的所述衬底上的集成电路；
其中所述集成电路配置成在所述接口和所述天线模块之间交换信号，并且使用毫米波信号与其他电子装置通信。
9.如权利要求8所述的通信系统，其中所述集成电路是射频集成电路(RFIC)并且其中所述接口是基带集成电路(BBIC)。
10.如权利要求9所述的通信系统，其中连接所述多个毫米波天线的所述传送线路被布线成使所述至少一个天线阵列中的延迟相等。
11.如权利要求9所述的通信系统，其中所述RFIC包括用于组合从所述多个毫米波天线所引导的信号并且将信号分成多个信号以便驱动所述多个毫米波天线的分离器。
12.如权利要求11所述的通信系统，其中所述集成电路通过从芯片和电线组装件、板上芯片组装件或倒装芯片组装件中选择的技术被附连到所述衬底。
13.如权利要求12所述的通信系统，其中所述衬底由选自包括液晶聚合物、特氟纶、低温共烧陶瓷、氧化铝、天线级核心材料和薄片、杜罗伊德合金钢、高电阻率硅或用于毫米波应用的一个或多个其他适当衬底的组中的材料而制成。
14.如权利要求13所述的通信系统，其中所述集成电路被固定到较低层衬底，所述较低层衬底选自包括印刷电路板(PCB)、玻璃纤维板(FR-4)、温度抵抗玻璃纤维板(FR-5)、陶瓷衬底、金属核PCB(MCPCB)、直接铜接合(DCB)衬底、金属复合板、镀铜铝板以及铝板的组。
15.一种安装在电子装置中以便与其他电子装置通信的多点无线通信装置，包括：
包括具有多个毫米波天线的天线模块的柔性衬底，其中所述柔性衬底包括可以配置成改变所述天线阵列模块的辐射图的柔韧材料；以及
通过传送线路连接到所述多个毫米波天线的所述柔性衬底上的集成电路；
其中所述集成电路配置成使用毫米波信号通信。
16.如权利要求15所述的多点无线通信装置，其中所述集成电路选自包括射频集成电路(RFIC)、基带集成电路(BBIC)或其组合的组。
17.如权利要求16所述的多点无线通信装置，其中连接所述多个毫米波天线的所述传送线路被布线成使所述天线阵列中的延迟相等。
18.如权利要求16所述的多点无线通信装置，其中所述RFIC包括用于组合从所述多个毫米波天线所引导的信号并且将信号分成多个信号以便驱动所述天线阵列的分离器。
19.如权利要求18所述的多点无线通信装置，其中所述集成电路通过从芯片和电线组装件、板上芯片组装件或倒装芯片组装件中选择的技术被附连到所述衬底。
20.如权利要求19所述的多点无线通信装置，其中所述衬底由选自包括液晶聚合物、特氟纶、低温共烧陶瓷、氧化铝、天线级核心材料和薄片、杜罗伊德合金钢、高电阻率硅或用于毫米波应用的一个或多个其他适当衬底的组中材料而制成。
21.如权利要求20所述的多点无线通信装置，其中所述集成电路被固定到较低层衬底，所述较低层衬底选自包括印刷电路板(PCB)、玻璃纤维板(FR-4)、温度抵抗玻璃纤维板(FR-5)、陶瓷衬底、金属核PCB(MCPCB)、直接铜接合(DCB)衬底、金属复合板、镀铜铝板以及铝板的组。
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