CN103460373A - 半导体存储器件 - Google Patents
半导体存储器件 Download PDFInfo
- Publication number
- CN103460373A CN103460373A CN2012800091090A CN201280009109A CN103460373A CN 103460373 A CN103460373 A CN 103460373A CN 2012800091090 A CN2012800091090 A CN 2012800091090A CN 201280009109 A CN201280009109 A CN 201280009109A CN 103460373 A CN103460373 A CN 103460373A
- Authority
- CN
- China
- Prior art keywords
- aforementioned
- diffusion layer
- type
- transistor
- access transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 55
- 238000003860 storage Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000009792 diffusion process Methods 0.000 claims description 266
- 230000002265 prevention Effects 0.000 claims description 36
- 230000006870 function Effects 0.000 claims description 11
- 238000012423 maintenance Methods 0.000 claims description 5
- 230000003068 static effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 362
- 238000009826 distribution Methods 0.000 description 51
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 47
- 229910052710 silicon Inorganic materials 0.000 description 47
- 239000010703 silicon Substances 0.000 description 47
- 229910021332 silicide Inorganic materials 0.000 description 30
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 30
- 239000002019 doping agent Substances 0.000 description 22
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 238000005304 joining Methods 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000002513 implantation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/053533 WO2013121537A1 (fr) | 2012-02-15 | 2012-02-15 | Dispositif semiconducteur de stockage |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103460373A true CN103460373A (zh) | 2013-12-18 |
Family
ID=48983698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012800091090A Pending CN103460373A (zh) | 2012-02-15 | 2012-02-15 | 半导体存储器件 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20130118949A (fr) |
CN (1) | CN103460373A (fr) |
TW (1) | TW201334161A (fr) |
WO (1) | WO2013121537A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111899775A (zh) * | 2020-07-24 | 2020-11-06 | 安徽大学 | 一种可实现多种逻辑功能和bcam运算的sram存储单元电路 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201184A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体記憶装置 |
US6111799A (en) * | 1998-10-29 | 2000-08-29 | Nec Corporation | Semiconductor memory in which access to broken word line is inhibited |
CN102024815A (zh) * | 2009-09-14 | 2011-04-20 | 日本优尼山帝斯电子株式会社 | 半导体存储器件及其制造方法 |
-
2012
- 2012-02-15 WO PCT/JP2012/053533 patent/WO2013121537A1/fr active Application Filing
- 2012-02-15 KR KR1020137021568A patent/KR20130118949A/ko not_active Application Discontinuation
- 2012-02-15 CN CN2012800091090A patent/CN103460373A/zh active Pending
-
2013
- 2013-02-08 TW TW102105178A patent/TW201334161A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201184A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体記憶装置 |
US6111799A (en) * | 1998-10-29 | 2000-08-29 | Nec Corporation | Semiconductor memory in which access to broken word line is inhibited |
CN102024815A (zh) * | 2009-09-14 | 2011-04-20 | 日本优尼山帝斯电子株式会社 | 半导体存储器件及其制造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111899775A (zh) * | 2020-07-24 | 2020-11-06 | 安徽大学 | 一种可实现多种逻辑功能和bcam运算的sram存储单元电路 |
Also Published As
Publication number | Publication date |
---|---|
TW201334161A (zh) | 2013-08-16 |
WO2013121537A1 (fr) | 2013-08-22 |
KR20130118949A (ko) | 2013-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131218 |