KR20130118949A - 반도체 기억 장치 - Google Patents
반도체 기억 장치 Download PDFInfo
- Publication number
- KR20130118949A KR20130118949A KR1020137021568A KR20137021568A KR20130118949A KR 20130118949 A KR20130118949 A KR 20130118949A KR 1020137021568 A KR1020137021568 A KR 1020137021568A KR 20137021568 A KR20137021568 A KR 20137021568A KR 20130118949 A KR20130118949 A KR 20130118949A
- Authority
- KR
- South Korea
- Prior art keywords
- diffusion layer
- type
- layer
- pmos
- transistor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 52
- 230000015654 memory Effects 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 230000003068 static effect Effects 0.000 claims abstract description 5
- 238000009792 diffusion process Methods 0.000 claims description 268
- 230000002265 prevention Effects 0.000 claims description 27
- 238000002955 isolation Methods 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 15
- 239000000945 filler Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 230000006870 function Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 366
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 47
- 229910052710 silicon Inorganic materials 0.000 description 47
- 239000010703 silicon Substances 0.000 description 47
- 229910021332 silicide Inorganic materials 0.000 description 29
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 29
- 239000012535 impurity Substances 0.000 description 19
- 238000002513 implantation Methods 0.000 description 14
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/053533 WO2013121537A1 (fr) | 2012-02-15 | 2012-02-15 | Dispositif semiconducteur de stockage |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130118949A true KR20130118949A (ko) | 2013-10-30 |
Family
ID=48983698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137021568A KR20130118949A (ko) | 2012-02-15 | 2012-02-15 | 반도체 기억 장치 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20130118949A (fr) |
CN (1) | CN103460373A (fr) |
TW (1) | TW201334161A (fr) |
WO (1) | WO2013121537A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111899775A (zh) * | 2020-07-24 | 2020-11-06 | 安徽大学 | 一种可实现多种逻辑功能和bcam运算的sram存储单元电路 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201184A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体記憶装置 |
JP3248497B2 (ja) * | 1998-10-29 | 2002-01-21 | 日本電気株式会社 | 半導体記憶装置 |
JP5524547B2 (ja) * | 2009-09-14 | 2014-06-18 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体記憶装置 |
-
2012
- 2012-02-15 WO PCT/JP2012/053533 patent/WO2013121537A1/fr active Application Filing
- 2012-02-15 KR KR1020137021568A patent/KR20130118949A/ko not_active Application Discontinuation
- 2012-02-15 CN CN2012800091090A patent/CN103460373A/zh active Pending
-
2013
- 2013-02-08 TW TW102105178A patent/TW201334161A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201334161A (zh) | 2013-08-16 |
WO2013121537A1 (fr) | 2013-08-22 |
CN103460373A (zh) | 2013-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |