CN103430100B - 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法 - Google Patents
感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法 Download PDFInfo
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- CN103430100B CN103430100B CN201280011581.8A CN201280011581A CN103430100B CN 103430100 B CN103430100 B CN 103430100B CN 201280011581 A CN201280011581 A CN 201280011581A CN 103430100 B CN103430100 B CN 103430100B
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- 150000003022 phthalic acids Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- YDXDIMCNCUMLTO-UHFFFAOYSA-N prop-2-enoate propylazanium Chemical compound CCCN.OC(=O)C=C YDXDIMCNCUMLTO-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- OSFBJERFMQCEQY-UHFFFAOYSA-N propylidene Chemical group [CH]CC OSFBJERFMQCEQY-UHFFFAOYSA-N 0.000 description 1
- 150000003921 pyrrolotriazines Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002151 riboflavin Substances 0.000 description 1
- 229960002477 riboflavin Drugs 0.000 description 1
- 235000019192 riboflavin Nutrition 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- WHAFDJWJDDPMDO-UHFFFAOYSA-N trimethyl(phenyl)phosphanium Chemical compound C[P+](C)(C)C1=CC=CC=C1 WHAFDJWJDDPMDO-UHFFFAOYSA-N 0.000 description 1
- JEVGKYBUANQAKG-UHFFFAOYSA-N victoria blue R Chemical compound [Cl-].C12=CC=CC=C2C(=[NH+]CC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JEVGKYBUANQAKG-UHFFFAOYSA-N 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-046373 | 2011-03-03 | ||
| JP2011046373 | 2011-03-03 | ||
| PCT/JP2012/054824 WO2012118031A1 (ja) | 2011-03-03 | 2012-02-27 | 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及び導体パターンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103430100A CN103430100A (zh) | 2013-12-04 |
| CN103430100B true CN103430100B (zh) | 2016-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280011581.8A Active CN103430100B (zh) | 2011-03-03 | 2012-02-27 | 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法以及导体图案的形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5878040B2 (ko) |
| KR (1) | KR101811091B1 (ko) |
| CN (1) | CN103430100B (ko) |
| TW (1) | TWI608298B (ko) |
| WO (1) | WO2012118031A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5990366B2 (ja) * | 2011-03-31 | 2016-09-14 | 旭化成株式会社 | 積層体及びそれを用いたロール |
| JP5842077B1 (ja) * | 2015-07-01 | 2016-01-13 | 三井金属鉱業株式会社 | キャリア付銅箔、銅張積層板及びプリント配線板 |
| JP6567952B2 (ja) * | 2015-10-26 | 2019-08-28 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 |
| CN108628093A (zh) * | 2017-03-23 | 2018-10-09 | 株式会社田村制作所 | 感光性树脂组合物 |
| CN109388026A (zh) * | 2017-08-11 | 2019-02-26 | 日兴材料株式会社 | 光致抗蚀膜、抗蚀图案的形成方法及导体图案的形成方法 |
| MY197618A (en) * | 2017-11-06 | 2023-06-28 | Asahi Chemical Ind | Photosensitive resin laminate and method for producing resist pattern |
| CN110531583B (zh) * | 2019-09-14 | 2023-09-29 | 浙江福斯特新材料研究院有限公司 | 感光性树脂组合物、干膜抗蚀层 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741621A (en) * | 1994-01-10 | 1998-04-21 | E. I. Du Pont De Nemours And Company | Process for using photoimageable films prepared for aqueous photoimageable liquid emulsions |
| JP2006519404A (ja) * | 2003-02-27 | 2006-08-24 | エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション | 感光性組成物及びそれの使用 |
| JP2006259700A (ja) * | 2005-03-15 | 2006-09-28 | E I Du Pont De Nemours & Co | ポリイミドコンポジットカバーレイならびにそれに関する方法および組成物 |
| JP2007122028A (ja) * | 2005-09-28 | 2007-05-17 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物およびその積層体 |
| CN101568882A (zh) * | 2007-02-02 | 2009-10-28 | 旭化成电子材料株式会社 | 感光性树脂组合物及层压体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4416660A1 (de) * | 1993-05-14 | 1994-11-17 | Du Pont | Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad |
| DE69502741T2 (de) * | 1994-01-10 | 1998-10-01 | Du Pont | Lichtempfindliche wässrige Emulsion, lichtempfindlicher Film und Verfahren zur Herstellung |
| JP5356934B2 (ja) * | 2009-07-02 | 2013-12-04 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
-
2012
- 2012-02-27 CN CN201280011581.8A patent/CN103430100B/zh active Active
- 2012-02-27 KR KR1020137026142A patent/KR101811091B1/ko active IP Right Grant
- 2012-02-27 WO PCT/JP2012/054824 patent/WO2012118031A1/ja active Application Filing
- 2012-02-29 JP JP2012042872A patent/JP5878040B2/ja active Active
- 2012-03-02 TW TW101106904A patent/TWI608298B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741621A (en) * | 1994-01-10 | 1998-04-21 | E. I. Du Pont De Nemours And Company | Process for using photoimageable films prepared for aqueous photoimageable liquid emulsions |
| JP2006519404A (ja) * | 2003-02-27 | 2006-08-24 | エイゼット・エレクトロニック・マテリアルズ・ユーエスエイ・コーポレイション | 感光性組成物及びそれの使用 |
| JP2006259700A (ja) * | 2005-03-15 | 2006-09-28 | E I Du Pont De Nemours & Co | ポリイミドコンポジットカバーレイならびにそれに関する方法および組成物 |
| JP2007122028A (ja) * | 2005-09-28 | 2007-05-17 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物およびその積層体 |
| CN101568882A (zh) * | 2007-02-02 | 2009-10-28 | 旭化成电子材料株式会社 | 感光性树脂组合物及层压体 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103430100A (zh) | 2013-12-04 |
| KR101811091B1 (ko) | 2017-12-20 |
| KR20140010131A (ko) | 2014-01-23 |
| TW201245870A (en) | 2012-11-16 |
| JP2012194552A (ja) | 2012-10-11 |
| JP5878040B2 (ja) | 2016-03-08 |
| TWI608298B (zh) | 2017-12-11 |
| WO2012118031A1 (ja) | 2012-09-07 |
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