CN103389618B - 防尘薄膜组件框架 - Google Patents

防尘薄膜组件框架 Download PDF

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Publication number
CN103389618B
CN103389618B CN201310170901.0A CN201310170901A CN103389618B CN 103389618 B CN103389618 B CN 103389618B CN 201310170901 A CN201310170901 A CN 201310170901A CN 103389618 B CN103389618 B CN 103389618B
Authority
CN
China
Prior art keywords
dustproof film
film component
component framework
plateau
mask sticker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310170901.0A
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English (en)
Chinese (zh)
Other versions
CN103389618A (zh
Inventor
关原一敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN103389618A publication Critical patent/CN103389618A/zh
Application granted granted Critical
Publication of CN103389618B publication Critical patent/CN103389618B/zh
Active legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
CN201310170901.0A 2012-05-11 2013-05-10 防尘薄膜组件框架 Active CN103389618B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012109518A JP5746662B2 (ja) 2012-05-11 2012-05-11 ペリクルフレーム
JP2012-109518 2012-05-11

Publications (2)

Publication Number Publication Date
CN103389618A CN103389618A (zh) 2013-11-13
CN103389618B true CN103389618B (zh) 2015-12-23

Family

ID=49533925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310170901.0A Active CN103389618B (zh) 2012-05-11 2013-05-10 防尘薄膜组件框架

Country Status (5)

Country Link
JP (1) JP5746662B2 (ja)
KR (1) KR102070074B1 (ja)
CN (1) CN103389618B (ja)
HK (1) HK1188486A1 (ja)
TW (1) TWI457699B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6293041B2 (ja) * 2014-12-01 2018-03-14 信越化学工業株式会社 ペリクルフレームおよびこれを用いたペリクル
JP6347741B2 (ja) 2014-12-25 2018-06-27 信越化学工業株式会社 ペリクル
JP6632057B2 (ja) * 2016-01-07 2020-01-15 信越化学工業株式会社 ペリクル
KR102002689B1 (ko) * 2017-09-08 2019-07-23 주식회사 에프에스티 펠리클 프레임
TWI670562B (zh) * 2018-06-21 2019-09-01 美商微相科技股份有限公司 光罩保護組件結構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3642145B2 (ja) 1997-02-21 2005-04-27 信越化学工業株式会社 ペリクルの製造方法及びペリクルのレチクル貼着用粘着剤層への貼着用ライナー
JP3330898B2 (ja) * 1999-04-26 2002-09-30 沖電気工業株式会社 ペリクル
JP4007752B2 (ja) * 1999-07-30 2007-11-14 旭化成エレクトロニクス株式会社 大型ペリクル用枠体及び大型ペリクル
JP2005091983A (ja) * 2003-09-19 2005-04-07 Toppan Printing Co Ltd Ｒｆタグにより識別されるフォトマスク、ペリクル、ペリクル付きフォトマスク及び収納ケース
JP2005308901A (ja) * 2004-04-19 2005-11-04 Shin Etsu Chem Co Ltd ペリクルフレーム及びそれを用いたフォトリソグラフィー用ペリクル
JP4637053B2 (ja) * 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
JP4921184B2 (ja) * 2007-01-19 2012-04-25 信越化学工業株式会社 ペリクルフレームへの膜接着剤の塗布方法
CN102944973B (zh) * 2008-09-12 2015-01-21 旭化成电子材料株式会社 表膜构件框体、表膜构件和表膜构件框体的使用方法
JP5481106B2 (ja) * 2009-06-24 2014-04-23 信越化学工業株式会社 ペリクルフレーム及びリソグラフィ用ペリクル
JP5199217B2 (ja) * 2009-11-02 2013-05-15 信越化学工業株式会社 ペリクル
JP2011164402A (ja) 2010-02-10 2011-08-25 Shin-Etsu Chemical Co Ltd ペリクルの製造方法
JP5940283B2 (ja) * 2011-11-04 2016-06-29 信越化学工業株式会社 ペリクル

Also Published As

Publication number Publication date
CN103389618A (zh) 2013-11-13
JP5746662B2 (ja) 2015-07-08
JP2013238637A (ja) 2013-11-28
KR20130126465A (ko) 2013-11-20
HK1188486A1 (zh) 2014-05-02
TWI457699B (zh) 2014-10-21
KR102070074B1 (ko) 2020-01-28
TW201400978A (zh) 2014-01-01

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