TWI457699B - 防塵薄膜組件框架 - Google Patents
防塵薄膜組件框架 Download PDFInfo
- Publication number
- TWI457699B TWI457699B TW102116299A TW102116299A TWI457699B TW I457699 B TWI457699 B TW I457699B TW 102116299 A TW102116299 A TW 102116299A TW 102116299 A TW102116299 A TW 102116299A TW I457699 B TWI457699 B TW I457699B
- Authority
- TW
- Taiwan
- Prior art keywords
- pellicle frame
- pellicle
- frame
- width
- mask adhesive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012109518A JP5746662B2 (ja) | 2012-05-11 | 2012-05-11 | ペリクルフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201400978A TW201400978A (zh) | 2014-01-01 |
TWI457699B true TWI457699B (zh) | 2014-10-21 |
Family
ID=49533925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102116299A TWI457699B (zh) | 2012-05-11 | 2013-05-08 | 防塵薄膜組件框架 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5746662B2 (ja) |
KR (1) | KR102070074B1 (ja) |
CN (1) | CN103389618B (ja) |
HK (1) | HK1188486A1 (ja) |
TW (1) | TWI457699B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI670562B (zh) * | 2018-06-21 | 2019-09-01 | 美商微相科技股份有限公司 | 光罩保護組件結構 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6293041B2 (ja) * | 2014-12-01 | 2018-03-14 | 信越化学工業株式会社 | ペリクルフレームおよびこれを用いたペリクル |
JP6347741B2 (ja) | 2014-12-25 | 2018-06-27 | 信越化学工業株式会社 | ペリクル |
JP6632057B2 (ja) * | 2016-01-07 | 2020-01-15 | 信越化学工業株式会社 | ペリクル |
KR102002689B1 (ko) * | 2017-09-08 | 2019-07-23 | 주식회사 에프에스티 | 펠리클 프레임 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001109135A (ja) * | 1999-07-30 | 2001-04-20 | Asahi Kasei Electronics Co Ltd | 大型ペリクル用枠体及び大型ペリクル |
TWI271598B (en) * | 2004-04-19 | 2007-01-21 | Shinetsu Chemical Co | Pellicle frame and pellicle assembly for photolithography using the pellicle frame |
CN101224457A (zh) * | 2007-01-19 | 2008-07-23 | 信越化学工业株式会社 | 对防护薄膜框架涂布膜接合剂的方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3642145B2 (ja) | 1997-02-21 | 2005-04-27 | 信越化学工業株式会社 | ペリクルの製造方法及びペリクルのレチクル貼着用粘着剤層への貼着用ライナー |
JP3330898B2 (ja) * | 1999-04-26 | 2002-09-30 | 沖電気工業株式会社 | ペリクル |
JP2005091983A (ja) * | 2003-09-19 | 2005-04-07 | Toppan Printing Co Ltd | Rfタグにより識別されるフォトマスク、ペリクル、ペリクル付きフォトマスク及び収納ケース |
JP4637053B2 (ja) * | 2006-05-15 | 2011-02-23 | 信越化学工業株式会社 | ペリクルおよびペリクル剥離装置 |
CN102132210B (zh) * | 2008-09-12 | 2013-01-23 | 旭化成电子材料株式会社 | 表膜构件框体、表膜构件和表膜构件框体的使用方法 |
JP5481106B2 (ja) * | 2009-06-24 | 2014-04-23 | 信越化学工業株式会社 | ペリクルフレーム及びリソグラフィ用ペリクル |
JP5199217B2 (ja) * | 2009-11-02 | 2013-05-15 | 信越化学工業株式会社 | ペリクル |
JP2011164402A (ja) | 2010-02-10 | 2011-08-25 | Shin-Etsu Chemical Co Ltd | ペリクルの製造方法 |
JP5940283B2 (ja) * | 2011-11-04 | 2016-06-29 | 信越化学工業株式会社 | ペリクル |
-
2012
- 2012-05-11 JP JP2012109518A patent/JP5746662B2/ja active Active
-
2013
- 2013-03-29 KR KR1020130034428A patent/KR102070074B1/ko active IP Right Grant
- 2013-05-08 TW TW102116299A patent/TWI457699B/zh active
- 2013-05-10 CN CN201310170901.0A patent/CN103389618B/zh active Active
-
2014
- 2014-02-18 HK HK14101538.1A patent/HK1188486A1/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001109135A (ja) * | 1999-07-30 | 2001-04-20 | Asahi Kasei Electronics Co Ltd | 大型ペリクル用枠体及び大型ペリクル |
TWI271598B (en) * | 2004-04-19 | 2007-01-21 | Shinetsu Chemical Co | Pellicle frame and pellicle assembly for photolithography using the pellicle frame |
CN101224457A (zh) * | 2007-01-19 | 2008-07-23 | 信越化学工业株式会社 | 对防护薄膜框架涂布膜接合剂的方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI670562B (zh) * | 2018-06-21 | 2019-09-01 | 美商微相科技股份有限公司 | 光罩保護組件結構 |
Also Published As
Publication number | Publication date |
---|---|
JP2013238637A (ja) | 2013-11-28 |
HK1188486A1 (zh) | 2014-05-02 |
TW201400978A (zh) | 2014-01-01 |
KR102070074B1 (ko) | 2020-01-28 |
CN103389618A (zh) | 2013-11-13 |
CN103389618B (zh) | 2015-12-23 |
JP5746662B2 (ja) | 2015-07-08 |
KR20130126465A (ko) | 2013-11-20 |
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GD4A | Issue of patent certificate for granted invention patent |