TWI457699B - Pellicle frame - Google Patents
Pellicle frame Download PDFInfo
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- TWI457699B TWI457699B TW102116299A TW102116299A TWI457699B TW I457699 B TWI457699 B TW I457699B TW 102116299 A TW102116299 A TW 102116299A TW 102116299 A TW102116299 A TW 102116299A TW I457699 B TWI457699 B TW I457699B
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- pellicle frame
- pellicle
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- mask adhesive
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
本發明涉及防塵薄膜組件在光罩設置時使用的遮罩粘著劑的厚度可以均一形成的防塵薄膜組件框架。 The present invention relates to a pellicle frame which can be uniformly formed by a thickness of a mask adhesive used for a pellicle assembly.
LSI以及超LSI等的半導體製造或液晶顯示器等的製造中，要進行對半導體晶圓或液晶用原板進行光照射，以進行圖案的製作的光刻的作業。此時，光罩(photomask)或倍縮光罩(reticle)如有灰塵附著，則有時灰塵被印入而轉印的圖案會變形，有時先端不齊，還會發生基底變黒、髒汙等的現象。該作業通常在無塵室中進行，但是要經常保持光罩的清浄也是困難的。例如光刻時，將防塵薄膜組件在光罩上設置，在防止光罩上的灰塵的附著的同時，將焦點對在光罩的圖案上進行曝光，就可以不受防塵薄膜的上附著的灰塵的影響而轉印。 In the manufacture of semiconductors such as LSI and super LSI, and liquid crystal displays, etc., it is necessary to perform photolithography work for performing light irradiation on a semiconductor wafer or a liquid crystal original plate to perform pattern formation. At this time, if a photomask or a reticle is attached with dust, sometimes the dust is printed and the transferred pattern is deformed, and sometimes the tip is not aligned, and the substrate may become dirty or dirty. Stained and other phenomena. This work is usually carried out in a clean room, but it is also difficult to keep the hood clean. For example, in photolithography, the pellicle is disposed on the reticle, and the focus is placed on the reticle to prevent the dust from adhering to the reticle, thereby preventing the dust from adhering to the pellicle. The effect of the transfer.
防塵薄膜組件在光罩的設置中，為隔著在防塵薄膜組件框架的一個框面設置的遮罩粘著劑將光罩貼附。此時，由於要求要沒有防塵薄膜組件的內側和外側的通氣源(以下，稱氣體通路)，所以遮罩粘著劑和光罩和之間，全周面要均一密著。專利文 獻1中記載了氣體通路的形成的防止方法。 In the arrangement of the reticle, the pellicle is attached to the reticle via a mask adhesive provided on one frame surface of the pellicle frame. At this time, since it is required to have no ventilation source (hereinafter referred to as a gas passage) on the inner side and the outer side of the pellicle, the entire peripheral surface is uniformly adhered between the mask adhesive and the mask. Patent In the first aspect, a method of preventing formation of a gas passage is described.
遮罩粘著劑，除了使用兩面膠帶的場合，一般使用搭載有空壓式的分配器(dispenser)的3軸卡氏座標機器人(cartesian coordinate robot)等在防塵薄膜組件框架上塗布遮罩粘著劑而形成。專利文獻2記載了在防塵薄膜組件框架塗布粘著劑的方法。 In the case of using a double-sided tape, a mask adhesive is applied to a dust-proof film module frame by using a three-axis Cartesian coordinate robot equipped with a vacuum-type dispenser. Formed by the agent. Patent Document 2 describes a method of applying an adhesive to a pellicle frame.
【專利文獻】 [Patent Literature]
【專利文獻1】日本特開平10-239831號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-239831
【專利文獻2】日本特開2011-164402號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2011-164402
本發明目的為，提供一種遮罩粘著劑的厚度可以均一形成，氣體通路不發生的防塵薄膜組件框架，以及使用該防塵薄膜組件框架的防塵薄膜組件。 SUMMARY OF THE INVENTION An object of the present invention is to provide a pellicle frame which can be uniformly formed in a thickness of a mask adhesive, which does not occur in a gas passage, and a pellicle assembly using the pellicle frame.
上述的目的可以通過以下技術方案來達成： The above objectives can be achieved by the following technical solutions:
1．一種防塵薄膜組件框架，為四角為圓弧的矩形的防塵薄膜組件框架，其特徵在於：在一個框面全周，靠防塵薄膜組件框架的內周部分上設置有作為遮罩粘著劑的塗布用面的連續的高臺部，靠外周為低臺部，四角圓弧部分的高臺部的寬度，比防塵薄膜組件框架直線部分的高臺部的寬度要大。 1. A dustproof film assembly frame is a rectangular pellicle frame having a circular arc shape, and is characterized in that a coating as a mask adhesive is disposed on an inner peripheral portion of the pellicle frame over the entire circumference of one frame surface. The continuous high table portion of the surface is a low table portion on the outer circumference, and the width of the high table portion of the four-corner arc portion is larger than the width of the upper portion of the straight portion of the pellicle frame.
2.上述1所述的防塵薄膜組件框架，其特徵在於：臺部的圓弧部和直線部平滑地連接而形成。 2. The pellicle frame according to the above 1, characterized in that the arc portion and the straight portion of the land portion are smoothly connected to each other.
3.上述1或2記載的防塵薄膜組件框架，其特徵在於：防塵薄膜組件框架的另一框面側，有防塵薄膜貼附。 3. The pellicle frame according to the above 1 or 2, characterized in that the other frame side of the pellicle frame is attached with a pellicle.
本發明的防塵薄膜組件框架，滿足圓弧部中的遮罩粘著劑的厚度和直線部中的遮罩粘著劑的厚度的差的要求精度。使用該防塵薄膜組件框架的防塵薄膜組件，在光罩設置時不產生氣體通路。 The pellicle frame of the present invention satisfies the required accuracy of the difference between the thickness of the mask adhesive in the arc portion and the thickness of the mask adhesive in the straight portion. The pellicle assembly using the pellicle frame does not generate a gas passage when the reticle is disposed.
1‧‧‧防塵薄膜組件 1‧‧‧Plastic membrane assembly
2‧‧‧防塵薄膜組件框架 2‧‧‧Plastic membrane assembly frame
3‧‧‧臺部 3‧‧‧Department
4‧‧‧遮罩粘著劑 4‧‧‧Mask Adhesive
5‧‧‧防塵薄膜 5‧‧‧Plastic film
10‧‧‧遮罩粘著劑的隆起部 10‧‧‧The ridge of the mask adhesive
A‧‧‧直線部 A‧‧‧Linear Department
B‧‧‧圓弧部 B‧‧‧Arc Department
C‧‧‧內周 C‧‧‧ inner week
D‧‧‧外周 D‧‧‧outweek
Wc‧‧‧圓弧部中的高臺部的最大寬度 Wc‧‧‧Maximum width of the platform in the arc
Ws‧‧‧直線部中的高臺部的寬度 Ws‧‧‧Width of the platform in the straight section
【圖1】使用本發明的防塵薄膜組件框架的防塵薄膜組件的一例的斜視圖。 Fig. 1 is a perspective view showing an example of a pellicle according to a pellicle frame of the present invention.
【圖2】防塵薄膜組件框架的X-X線的截面圖。 Fig. 2 is a cross-sectional view taken along the line X-X of the pellicle frame.
【圖3】防塵薄膜組件框架的圓弧部B的擴大平面圖。 Fig. 3 is an enlarged plan view showing a circular arc portion B of the pellicle frame.
【圖4】防塵薄膜組件框架的圓弧部B的另一個例子的平面圖。 Fig. 4 is a plan view showing another example of the arc portion B of the pellicle frame.
【圖5】在防塵薄膜組件框架上塗布的遮罩粘著劑的隆起狀態的斜視圖。 Fig. 5 is a perspective view showing a state in which a mask adhesive applied to a pellicle frame is raised.
使用本發明的防塵薄膜組件框架製作的防塵薄膜組件的一例用圖1進行表示。防塵薄膜組件1，於四角為圓弧形狀的矩形的防塵薄膜組件框架2的下面將防塵薄膜5繃緊貼附，於上面形成為了貼附光刻等使用的光罩(圖示省略)的遮罩粘著劑4。防塵薄膜組件框架2中，臺部3被設置。 An example of a pellicle film assembly produced using the pellicle frame of the present invention is shown in Fig. 1 . In the pellicle film assembly 1, the pellicle film 5 is stretched and attached to the lower surface of the rectangular pellicle frame 2 having a circular arc shape, and a mask (not shown) for attaching lithography or the like is formed thereon. Cover adhesive 4. In the pellicle frame 2, the land portion 3 is provided.
圖2為圖1的X-X線截面圖。圖2中的(a)在防塵薄膜組件框架2中，其內周C和外周D之間設置有臺部3，其截 面形狀，圖2中的(a)~圖2中的(c)表示的那樣靠內周為高臺部，靠外周為低臺部。高臺部上有遮罩粘著劑4形成。臺部3，限制了在高臺部塗布的遮罩粘著劑4流動的範圍，遮罩粘著劑4具有所期待的寬度。臺部3的截面形狀，也可以為凹字形狀或V字形狀的溝。遮罩粘著劑4的截面形狀，圖2中的(a)表示的圓弧形狀之外，圖2中的(b)表示的圓角形狀或圖2中的(c)表示的四角形狀，但是從貼附負荷的減低和氣體通路形成防止的觀點，以圖2中的(a)的圓弧形狀為優選。 Fig. 2 is a cross-sectional view taken along line X-X of Fig. 1; In (a) of Fig. 2, in the pellicle frame 2, a land portion 3 is provided between the inner circumference C and the outer circumference D, and The surface shape is as shown in (a) to (c) of FIG. 2, and the inner circumference is a high stage portion, and the outer circumference is a low stage portion. A mask adhesive 4 is formed on the upper portion. The stage portion 3 limits the range in which the mask adhesive 4 applied to the upper stage portion flows, and the mask adhesive 4 has a desired width. The cross-sectional shape of the land portion 3 may be a groove shape or a V-shaped groove. The cross-sectional shape of the mask adhesive 4, in addition to the circular arc shape indicated by (a) in FIG. 2, the rounded shape indicated by (b) in FIG. 2 or the four-corner shape indicated by (c) in FIG. 2, However, from the viewpoint of the reduction of the adhesion load and the prevention of the formation of the gas passage, the arc shape of (a) in Fig. 2 is preferable.
另外，遮罩粘著劑4的一側沿防塵薄膜組件框架2的內周C形成，光罩設置時，在防塵薄膜組件內側，防塵薄膜組件框架表面不露出，可以防止灰塵的發生。 Further, the side of the mask adhesive 4 is formed along the inner circumference C of the pellicle frame 2, and when the mask is disposed, the surface of the pellicle frame is not exposed inside the pellicle assembly, and the occurrence of dust can be prevented.
圖3為防塵薄膜組件框架2的圓弧狀的四角的一個的擴大平面圖。防塵薄膜組件框架2的高臺部的寬度，圓弧部B中最大的Wc(圓弧部中的高臺部的最大寬度)比直線部A的Ws(直線部中的高臺部的寬度)要大。遮罩粘著劑，塗布後會流動，但是，圓弧部B的高臺部的寬度加大，由於表面張力，不會向圓弧部B的內周C集中流動，在高臺部全體展開，沒有厚度在局部特厚的問題。 Fig. 3 is an enlarged plan view showing one of the four corners of the arc of the pellicle frame 2; The width of the elevated portion of the pellicle frame 2, the largest Wc of the arc portion B (the maximum width of the high portion of the arc portion) is Ws of the straight portion A (the width of the high portion of the straight portion) Bigger. The mask adhesive flows and flows after application. However, the width of the upper portion of the arc portion B is increased, and the surface tension does not flow toward the inner circumference C of the arc portion B, and the entire portion of the high portion is expanded. There is no problem that the thickness is particularly thick locally.
另外，在此，所謂的圓弧部，為矩形的防塵薄膜組件框架的內周和外周，各個的相鄰的2邊，具有圓的一部而接續時，形成圓弧形狀的內周和外周所挾持的區域，所謂直線部，矩形的防塵薄膜組件框架各邊的內周和外周挾持的區域。 Here, the arc portion is an inner circumference and an outer circumference of the rectangular pellicle frame, and each of the adjacent two sides has a round portion and is connected to form an inner circumference and an outer circumference of the arc shape. The area to be held, the so-called straight portion, the inner circumference of each side of the rectangular pellicle frame and the area held by the outer circumference.
圖3中的高臺部的寬度，為考慮塗布的遮罩粘著劑的粘度而設置的。雖然沒有特別的限定，但是直線部A中的Ws(直線部中的高臺部的寬度)通常3~10mm，圓弧部B的Wc(圓弧部中的高臺部的最大寬度)以為Ws(直線部中的高臺部的寬度)的110~150%為優選。 The width of the platform portion in Fig. 3 is set in consideration of the viscosity of the applied masking adhesive. Although not particularly limited, Ws in the linear portion A (the width of the elevated portion in the straight portion) is usually 3 to 10 mm, and Wc in the circular portion B (the maximum width of the elevated portion in the circular arc portion) is considered to be Ws. 110 to 150% of the width (the width of the elevated portion in the straight portion) is preferable.
遮罩粘著劑4的厚度，沒有特別的限定，但是，通常為1~3mm，圓弧部B的平均厚度，與直線部A中的平均厚度的差在10%以內為優選，5%以內為更優選。 The thickness of the mask adhesive 4 is not particularly limited, but is usually 1 to 3 mm, and the difference between the average thickness of the arc portion B and the average thickness in the straight portion A is preferably within 10%, and within 5%. More preferred.
圖4中，表示圓弧部B中的臺部3的形狀的另外的例。圖4中的(a)那樣張角形狀也可以，圖4中的(b)那樣的一部分突出的形狀也可以。 FIG. 4 shows another example of the shape of the land portion 3 in the circular arc portion B. The shape of the opening angle as shown in Fig. 4(a) may be a shape in which a part of the shape as shown in Fig. 4(b) may protrude.
遮罩粘著劑4形成後，有時，要將其擠碎，以使厚度均一平坦化，但是本發明中，平坦化是不必要的，即使進行平坦化的場合，厚度差更不會發生，也是有優點的。 After the masking adhesive 4 is formed, it is sometimes crushed to flatten the thickness uniformly. However, in the present invention, flattening is unnecessary, and even in the case of planarization, the thickness difference does not occur. There are also advantages.
【實施例】 [Examples]
以下，用實施例對本發明進行詳細說明，但是本發明的範圍並不受這些實施例的限制。 Hereinafter, the present invention will be described in detail by way of examples, but the scope of the invention is not limited thereto.
圖1表示的那樣的外寸為785×1338mm，內寸為767×1320mm，高3．8mm的鋁合金製防塵薄膜組件框架2用機械加工進行製作。防塵薄膜組件框架2的一個面側全周的靠內周，作為遮罩粘著劑塗布區域的高臺部，高度為0．2mm，直線部A中的寬度Ws(直線部中的高臺部的寬度)為4 mm，圓弧部B中的最大寬度Wc(圓弧部中的高臺部的最大寬度)為6mm的臺部3被設置(參照圖3)。 The aluminum alloy pellicle frame 2 having an outer dimension of 785 x 1338 mm, an inner dimension of 767 x 1320 mm, and a height of 3.8 mm is produced by machining. The inner peripheral surface of the entire surface of one side of the pellicle frame 2 is used as a high-stage portion of the mask adhesive application region, and has a height of 0.2 mm, and a width Ws in the straight portion A (a high portion of the straight portion) Width) is 4 In mm, the table portion 3 having a maximum width Wc (the maximum width of the high table portion in the arc portion) of 6 mm is provided (see FIG. 3).
使用防塵薄膜組件框架2，對圖1表示的防塵薄膜組件1進行製作。級別10的無塵室內中，將防塵薄膜組件用純水和界面活性劑良好地洗浄，完全乾燥。使用氣體加壓式分配器將矽粘著劑(信越化學工業(株)製)進行塗布，設定吐出量，將遮罩粘著劑4在防塵薄膜組件框架2的高臺部的區域全部覆蓋地塗布。進一步，隔著塗布的防塵薄膜接著層，將防塵薄膜5貼附，安裝遮罩粘著劑4的保護用分隔片以及通氣孔用過濾器等，完成防塵薄膜組件1的製作。對該防塵薄膜組件的遮罩粘著劑4的圓弧部進行觀察，沒有發現隆起。 The pellicle film assembly 1 shown in Fig. 1 was produced using the pellicle frame 2. In the dust-free room of level 10, the pellicle assembly is well washed with pure water and a surfactant, and completely dried. By using a gas pressure type dispenser, a ruthenium adhesive (manufactured by Shin-Etsu Chemical Co., Ltd.) is applied, and the discharge amount is set, and the mask adhesive 4 is entirely covered in the region of the high-rise portion of the pellicle frame 2 Coating. Further, the pellicle film 5 is attached via the applied pellicle film, and the pellicle for protection 1 is attached, and the protective separator for the mask adhesive 4 and the filter for the vent hole are attached to complete the production of the pellicle film assembly 1. The arc portion of the mask adhesive 4 of the pellicle was observed, and no bulge was observed.
遮罩粘著劑4的厚度用針盤量規(dial gauge)進行計測，直線部A中的厚度平均為1．25mm，圓弧部中的厚度為平均1．29mm。進一步，在良好洗浄的平滑的石英玻璃板上將該防塵薄膜組件貼附，從玻璃面側對遮罩粘著劑4的外觀進行觀察。其結果，遮罩粘著劑4在全周面幾乎以均等寬度進行貼附，沒有觀察到局部的變細以及浮起。 The thickness of the mask adhesive 4 was measured with a dial gauge, and the thickness in the straight portion A was 1.25 mm on average, and the thickness in the circular arc portion was 1.29 mm on average. Further, the pellicle was attached to the smooth quartz glass plate which was well cleaned, and the appearance of the mask adhesive 4 was observed from the glass surface side. As a result, the mask adhesive 4 was attached to almost the entire circumference on the entire circumference, and no local thinning or floating was observed.
【比較例】 [Comparative example]
除了高臺部的直線部A中的寬度Ws(直線部中的高臺部的寬度)和圓弧部B中的最大寬度Wc(圓弧部中的高臺部的最大寬度)都為4mm以外，與實施例同樣，在防塵薄膜組件框架上進行遮罩粘著劑塗布。塗布後，稍停一段時間，如圖5表示 的那樣，用目視確認到：由於表面張力，遮罩粘著劑4從圓弧部的外周區域向防塵薄膜組件框架2的內周C流動，而遮罩粘著劑的隆起部10形成。由於遮罩粘著劑4和光罩之間由氣體通路生成，不能作為防塵薄膜組件使用。 The width Ws (the width of the upper portion of the straight portion) and the maximum width Wc of the circular portion B (the maximum width of the upper portion of the circular arc portion) in the straight portion A of the elevated portion are both 4 mm. As in the embodiment, the masking agent coating was performed on the pellicle frame. After coating, stop for a while, as shown in Figure 5. As described above, it was visually confirmed that the mask adhesive 4 flows from the outer peripheral region of the circular arc portion to the inner circumference C of the pellicle frame 2 due to the surface tension, and the ridge portion 10 of the mask adhesive is formed. Since the mask adhesive 4 and the photomask are formed by the gas passage, they cannot be used as a pellicle.
2‧‧‧防塵薄膜組件框架 2‧‧‧Plastic membrane assembly frame
3‧‧‧臺部 3‧‧‧Department
4‧‧‧遮罩粘著劑 4‧‧‧Mask Adhesive
A‧‧‧直線部 A‧‧‧Linear Department
B‧‧‧圓弧部 B‧‧‧Arc Department
C‧‧‧內周 C‧‧‧ inner week
D‧‧‧外周 D‧‧‧outweek
Wc‧‧‧圓弧部中的高臺部的最大寬度 Wc‧‧‧Maximum width of the platform in the arc
Ws‧‧‧直線部中的高臺部的寬度 Ws‧‧‧Width of the platform in the straight section
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012109518A JP5746662B2 (en) | 2012-05-11 | 2012-05-11 | Pellicle frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201400978A TW201400978A (en) | 2014-01-01 |
| TWI457699B true TWI457699B (en) | 2014-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102116299A TWI457699B (en) | 2012-05-11 | 2013-05-08 | Pellicle frame |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5746662B2 (en) |
| KR (1) | KR102070074B1 (en) |
| CN (1) | CN103389618B (en) |
| HK (1) | HK1188486A1 (en) |
| TW (1) | TWI457699B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI670562B (en) * | 2018-06-21 | 2019-09-01 | 美商微相科技股份有限公司 | Photomask protection component structure |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6293041B2 (en) * | 2014-12-01 | 2018-03-14 | 信越化学工業株式会社 | Pellicle frame and pellicle using the same |
| JP6347741B2 (en) | 2014-12-25 | 2018-06-27 | 信越化学工業株式会社 | Pellicle |
| JP6632057B2 (en) * | 2016-01-07 | 2020-01-15 | 信越化学工業株式会社 | Pellicle |
| KR102002689B1 (en) * | 2017-09-08 | 2019-07-23 | 주식회사 에프에스티 | Pellicle frame |
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| JP2001109135A (en) * | 1999-07-30 | 2001-04-20 | Asahi Kasei Electronics Co Ltd | Frame for large-sized pellicle and large-sized pellicle |
| TWI271598B (en) * | 2004-04-19 | 2007-01-21 | Shinetsu Chemical Co | Pellicle frame and pellicle assembly for photolithography using the pellicle frame |
| CN101224457A (en) * | 2007-01-19 | 2008-07-23 | 信越化学工业株式会社 | Method for coating bonding adhesive on protecting film framework |
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| JP3642145B2 (en) | 1997-02-21 | 2005-04-27 | 信越化学工業株式会社 | Method for producing pellicle and liner for attaching pellicle to adhesive layer for attaching reticle to reticle |
| JP3330898B2 (en) | 1999-04-26 | 2002-09-30 | 沖電気工業株式会社 | Pellicle |
| JP2005091983A (en) | 2003-09-19 | 2005-04-07 | Toppan Printing Co Ltd | Photomask discriminated with rf tag, pellicle, photomask with pellicle, and storage case |
| JP4637053B2 (en) * | 2006-05-15 | 2011-02-23 | 信越化学工業株式会社 | Pellicle and pellicle peeling device |
| CN102944973B (en) | 2008-09-12 | 2015-01-21 | 旭化成电子材料株式会社 | Pellicle frame, pellicle and method for using pellicle frame |
| JP5481106B2 (en) * | 2009-06-24 | 2014-04-23 | 信越化学工業株式会社 | Pellicle frame and lithography pellicle |
| JP5199217B2 (en) * | 2009-11-02 | 2013-05-15 | 信越化学工業株式会社 | Pellicle |
| JP2011164402A (en) | 2010-02-10 | 2011-08-25 | Shin-Etsu Chemical Co Ltd | Method for manufacturing pellicle |
| JP5940283B2 (en) * | 2011-11-04 | 2016-06-29 | 信越化学工業株式会社 | Pellicle |
-
2012
- 2012-05-11 JP JP2012109518A patent/JP5746662B2/en active Active
-
2013
- 2013-03-29 KR KR1020130034428A patent/KR102070074B1/en active IP Right Grant
- 2013-05-08 TW TW102116299A patent/TWI457699B/en active
- 2013-05-10 CN CN201310170901.0A patent/CN103389618B/en active Active
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- 2014-02-18 HK HK14101538.1A patent/HK1188486A1/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001109135A (en) * | 1999-07-30 | 2001-04-20 | Asahi Kasei Electronics Co Ltd | Frame for large-sized pellicle and large-sized pellicle |
| TWI271598B (en) * | 2004-04-19 | 2007-01-21 | Shinetsu Chemical Co | Pellicle frame and pellicle assembly for photolithography using the pellicle frame |
| CN101224457A (en) * | 2007-01-19 | 2008-07-23 | 信越化学工业株式会社 | Method for coating bonding adhesive on protecting film framework |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI670562B (en) * | 2018-06-21 | 2019-09-01 | 美商微相科技股份有限公司 | Photomask protection component structure |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130126465A (en) | 2013-11-20 |
| KR102070074B1 (en) | 2020-01-28 |
| JP2013238637A (en) | 2013-11-28 |
| TW201400978A (en) | 2014-01-01 |
| HK1188486A1 (en) | 2014-05-02 |
| CN103389618A (en) | 2013-11-13 |
| CN103389618B (en) | 2015-12-23 |
| JP5746662B2 (en) | 2015-07-08 |
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