TW200622487A - Radiation sensitive resin composition - Google Patents

Radiation sensitive resin composition

Info

Publication number
TW200622487A
TW200622487A TW094135321A TW94135321A TW200622487A TW 200622487 A TW200622487 A TW 200622487A TW 094135321 A TW094135321 A TW 094135321A TW 94135321 A TW94135321 A TW 94135321A TW 200622487 A TW200622487 A TW 200622487A
Authority
TW
Taiwan
Prior art keywords
resin composition
radiation sensitive
sensitive resin
active agent
surface active
Prior art date
Application number
TW094135321A
Other languages
Chinese (zh)
Other versions
TWI377440B (en
Inventor
Yuko Nakano
Yujiro Kawaguchi
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200622487A publication Critical patent/TW200622487A/en
Application granted granted Critical
Publication of TWI377440B publication Critical patent/TWI377440B/en

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)

Abstract

A radiation sensitive resin composition comprising an alkali soluble resin (A) having curalility, a quinonediazide compound (B), a solvent (C), silicone-based surface active agent (D) and a fluorine-based surface active agent (E), is provided in the present invention.
TW094135321A 2004-10-14 2005-10-11 Radiation sensitive resin composition TWI377440B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004300159 2004-10-14

Publications (2)

Publication Number Publication Date
TW200622487A true TW200622487A (en) 2006-07-01
TWI377440B TWI377440B (en) 2012-11-21

Family

ID=36706872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135321A TWI377440B (en) 2004-10-14 2005-10-11 Radiation sensitive resin composition

Country Status (3)

Country Link
KR (1) KR20060052211A (en)
CN (1) CN1760758B (en)
TW (1) TWI377440B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI536094B (en) * 2007-12-25 2016-06-01 Asahi Kasei Emd Corp Photosensitive resin laminate
JP5607346B2 (en) * 2009-01-06 2014-10-15 住友化学株式会社 Photosensitive resin composition, coating film, pattern and display device
KR101669085B1 (en) * 2009-01-28 2016-10-25 제이에스알 가부시끼가이샤 Radiation sensitive resin composition, and interlayer insulating film and forming method thereof
KR20160095879A (en) * 2015-02-04 2016-08-12 동우 화인켐 주식회사 Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU661438B1 (en) * 1994-01-25 1995-07-20 Morton International, Inc. Waterborne photoresists having polysiloxanes
JP2000267270A (en) * 1999-03-19 2000-09-29 Clariant (Japan) Kk Photosensitive resin composition for roll coating and roll coating method
US6984476B2 (en) * 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device

Also Published As

Publication number Publication date
CN1760758B (en) 2010-11-03
TWI377440B (en) 2012-11-21
KR20060052211A (en) 2006-05-19
CN1760758A (en) 2006-04-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees