CN103378025A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN103378025A
CN103378025A CN2013100930773A CN201310093077A CN103378025A CN 103378025 A CN103378025 A CN 103378025A CN 2013100930773 A CN2013100930773 A CN 2013100930773A CN 201310093077 A CN201310093077 A CN 201310093077A CN 103378025 A CN103378025 A CN 103378025A
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China
Prior art keywords
radiator
semiconductor element
semiconductor device
semiconductor
resin
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CN2013100930773A
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CN103378025B (zh
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村田大辅
菊池正雄
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN103378025A publication Critical patent/CN103378025A/zh
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Abstract

本发明提供能够抑制热应力导致的翘曲、提高可靠性的半导体装置。散热器3a～3f互相离开而配置。晶体管元件1a～1c安装在散热器3a～3c上，其下表面与散热器3a～3c接合。晶体管元件1d～1f安装在散热器3d～3f上，其下表面与散热器3d～3f接合。模制树脂8覆盖散热器3a～3f及晶体管元件1a～1f。具有比模制树脂8高的刚性的增强部件9在模制树脂8内横穿散热器3a～3f之间的区域而设置。

Description

半导体装置
技术领域
本发明涉及用于控制汽车或电车等的电机的逆变器、发电/再生用转换器等的半导体装置。
背景技术
在散热器上安装半导体元件、并用树脂密封散热器及半导体元件的半导体装置得到使用（例如，参照专利文献1）。
现有技术文献
专利文献
[专利文献1]日本特开2004－165281号公报。
在互相离开的2个散热器上分别安装有半导体元件的半导体装置中，在2个散热器之间的区域存在树脂。由于树脂和散热器的线膨胀系数不同，如果使用时产生热而发生温度变化，则产生热应力。因此，冷热循环被过量地施加的情况下，从2个散热器之间的区域产生翘曲。进一步，有如下问题，即剥离在树脂和散热器或引线框等的内置部件之间进行，对可靠性造成影响。
发明内容
本发明为解决如上述那样的课题而作出，其目的是获得能够抑制热应力导致的翘曲、提高可靠性的半导体装置。
本发明的半导体装置，其特征在于，具备：第1散热器；第2散热器，其与所述第1散热器离开而配置；第1半导体元件，其安装在所述第1散热器上，下表面与所述第1散热器接合；第2半导体元件，其安装在所述第2散热器上，下表面与所述第2散热器接合；树脂，其覆盖所述第1及第2散热器、以及所述第1及第2半导体元件；增强部件，其在所述树脂内横穿所述第1散热器和所述第2散热器之间的区域而设置，具有比所述树脂高的刚性。
根据本发明，能够抑制热应力导致的翘曲，提高可靠性。
附图说明
图1是示出本发明的实施方式1的半导体装置的电路图；
图2是示出本发明的实施方式1的半导体装置的内部的透视俯视图；
图3是示出本发明的实施方式1的半导体装置的内部（省略增强部件）的透视俯视图；
图4是沿图2的I－II的截面图；
图5是沿图3的III－IV的截面图；
图6是示出本发明的实施方式1的半导体装置的变形例的内部（省略增强部件）的透视俯视图；
图7是示出本发明的实施方式2的半导体装置的截面图；
图8是示出本发明的实施方式3的半导体装置的内部的透视俯视图。
具体实施方式
关于本发明的实施方式的半导体装置，参照附图进行说明。存在对相同或对应的构成要件附上相同标号，省略反复说明的情况。
实施方式1
图1是示出本发明的实施方式1的半导体装置的电路图。晶体管元件1a～1f和二极管2a～2f的6对构成3相半桥式电路。来自电源的电力经由U、V、W端子供给负载。晶体管元件1a～1f是将由电源供给的电流仅在需要的时间导通的绝缘栅型双极晶体管（IGBT：Insulated Gate Bipolar Transistor）。在晶体管元件1a～1f从导通状态成为截止状态时，二极管2a～2f使电流回流。
图2是示出本发明的实施方式1的半导体装置的内部的透视俯视图。图3是示出本发明的实施方式1的半导体装置的内部（省略增强部件）的透视俯视图。图4是沿图2的I－II的截面图。
散热器3a～3c和散热器3d～3f左右离开而配置。散热器3a～3f互相分离。晶体管元件1a～1c及二极管2a～2c分别安装在散热器3a～3c上，它们的下表面用焊料4个别地与散热器3a～3c接合。晶体管元件1d～1f及二极管2d～2f分别安装在散热器3d～3f上，它们的下表面分别用焊料4个别地与散热器3d～3f接合。
互相分离的布线部件5a～5c分别用焊料4个别地与晶体管元件1a～1c及二极管2a～2c的上表面接合。布线部件5d用焊料4共同地与晶体管元件1d～1f及二极管2d～2f的上表面接合。此外，也可以代替焊料4，使用导电性粘结剂等。布线部件5a～5c分别与散热器3d～3f的上表面的周边部接合。互相分离的布线部件5e～5g分别与散热器3a～3c的上表面的周边部接合。
信号布线6a～6c分别导线连接到晶体管元件1a～1c的控制端子。信号布线6d～6f分别导线连接到晶体管元件1d～1f的控制端子。为了与外部的绝缘，绝缘层7设置在散热器3d～3f的下表面。这些散热器3a～3f、晶体管元件1a～1f、二极管2a～2f、一部分布线部件5a～5g、一部分信号布线6a～6f以及绝缘层7的上表面及侧面，被模制树脂8覆盖。
布线部件5a～5g担负与装置外部的电力的授受。关于布线部件5a～5g及信号布线6a～6f，例如，如引线框那样地冲裁或蚀刻同一金属板，以在外框连结为一体的状态形成。在用模制树脂8覆盖其一部分而将其机械地保持之后，除去外框而将布线部件5a～5g及信号布线6a～6f分割开。由此，由于能够总括地组装数量较多的布线部件5a～5g及信号布线6a～6f，所以量产性好，并且工业上的价值变高。
在本实施方式中，具有比模制树脂8高的刚性的增强部件9在模制树脂8内横穿散热器3a～3f之间的区域而设置。增强部件9不与晶体管元件1a～1f、二极管2a～2f等相接，与晶体管元件1a～1f、二极管2a～2f等相比设置在上方。
增强部件9例如是金属制的板部件。如果增强部件9是金属部件，则拉伸弹性模量相对于模制树脂8充分高，因此，能够提高增强效果。另外，如果增强部件9是如纤维增强塑料那样地被强化的有机材料、陶瓷材料等，则适于减轻重量。另外，不仅是板形状，增强部件9也可以是向上翘曲时抑制弯曲那样的L字、U字型形状。
通过利用该增强部件9增强散热器3a～3f之间的区域，从而，在该区域能够抑制由于热应力产生的翘曲。其结果是，能够防止破损、提高可靠性。
另外，晶体管元件1a～1f、二极管2a～2f、散热器3a～3f、布线部件5a～5g及信号布线6a～6f，构成控制电机等负载的逆变器电路所需要的3相半桥式电路。在如此用1个半导体装置构成3相半桥式电路的情况下，封装件尺寸变大，翘曲的问题变得显著。然而，利用本实施方式的构成能够抑制翘曲，因此，能够提高可靠性。
另外，布线部件5a～5c横穿散热器3a～3c和散热器3d～3f之间的区域，分别连接晶体管元件1a～1c的上表面和散热器3d～3f。该布线部件5a～5c作为电气电路发挥功能，并且也能够增强该区域。从而，能够不增加部件件数地抑制热应力导致的翘曲。其结果是，能够不损失量产性地提高可靠性。
图5是沿图3的III－IV的截面图。布线部件5a～5c即使是平坦的构造，利用金属的刚性也能获得增强效果，但是，通过在布线部件5a～5c的一部分在从上表面到下表面方向设置U字状的凹陷10，能够提高厚度方向的刚性。如果凹陷10的深度是布线部件5a～5c的厚度的1.5倍左右，则加工是可能的，并能获得充分的增强效果。此外，也可以在布线部件5a～5c的从下表面到上表面方向设置凹陷10，凹陷10也可以不是U字状，而是三角状、半圆状等。
图6是示出本发明的实施方式1的半导体装置的变形例的内部（省略增强部件）的透视俯视图。晶体管元件1a～1c及二极管2a～2c并排安装在1个散热器3g上，它们的下表面用焊料4共同地与散热器3a接合。由此，装置的左侧由刚性高的散热器3g支撑。布线部件5h与散热器3g的上表面的周边部接合。
通过如此将同电位的散热器3a～3c汇总到1个散热器3g，能够降低封装件在散热器3g的长度方向的翘曲。另外，也能够降低部件件数，能够简化装配。此外，关于散热器3g的长度方向，如果平行于封装件的端子取出面则容易布线因而优选，但是，也可以为垂直于端子取出面的方向。
实施方式2
图7是示出本发明的实施方式2的半导体装置的截面图。在绝缘层7的下方能够确保各元件之间的绝缘，因此，在绝缘层7之下跨及多个散热器3a～3f设置1块铜箔11。该铜箔11比绝缘层7厚，横穿散热器3a～3f之间的区域。通过用增厚的铜箔11增强散热器3a～3f之间的区域，从而，在该区域能够抑制由于热应力产生的翘曲。其结果是，能够防止破损、提高可靠性。另外，铜箔11也能够利用于封装件和冷却器的粘结。
实施方式3
图8是示出本发明的实施方式3的半导体装置的内部的透视俯视图。散热器3g具有与散热器3d～3f对置的凹部12。散热器3d～3f具有进入凹部12的延伸设置部13。由此，通过增强散热器3g和散热器3d～3f之间的区域，从而，在该区域能够抑制由于热应力产生的翘曲。其结果是，能够防止破损、提高可靠性。此外，延伸设置部13优选按照半导体元件的形状的长方形，但是，也可以是如S线那样的曲线状、三角形状等。
附图标记说明
1a～1c　晶体管元件（第1半导体元件）
1d～1f　晶体管元件（第2半导体元件）
2a～2c　二极管（第1半导体元件）
2d～2f　二极管（第2半导体元件）
3a～3c　散热器（第1散热器）
3d～3f　散热器（第2散热器）
5a～5h　布线部件
7　绝缘层
8　模制树脂（树脂）
9　增强部件
10　凹陷
11　铜箔（金属层）
12　凹部
13　延伸设置部。

Claims (7)

1. 一种半导体装置，其特征在于，具备：
第1散热器；
第2散热器，其与所述第1散热器离开而配置；
第1半导体元件，其安装在所述第1散热器上，下表面与所述第1散热器接合；
第2半导体元件，其安装在所述第2散热器上，下表面与所述第2散热器接合；
树脂，其覆盖所述第1及第2散热器、以及所述第1及第2半导体元件；以及
增强部件，其在所述树脂内横穿所述第1散热器和所述第2散热器之间的区域而设置，具有比所述树脂高的刚性。
2. 如权利要求1所述的半导体装置，其特征在于，
所述增强部件不与所述第1及第2半导体元件相接，与所述第1及第2半导体元件相比设置在上方。
3. 如权利要求1所述的半导体装置，其特征在于，
还具备绝缘层，其设置在所述第1及第2散热器的下表面，
其中，所述增强部件设置在所述绝缘层之下，是比所述绝缘层厚的金属层。
4. 一种半导体装置，其特征在于，具备：
第1散热器；
第2散热器，其与所述第1散热器离开而配置；
第1半导体元件，其安装在所述第1散热器上，下表面与所述第1散热器接合；
第2半导体元件，其安装在所述第2散热器上，下表面与所述第2散热器接合；以及
树脂，其覆盖所述第1及第2散热器、以及所述第1及第2半导体元件，
其中，所述第1散热器具有与所述第2散热器对置的凹部，
所述第2散热器具有进入所述凹部的延伸设置部。
5. 如权利要求1~4的任一项所述的半导体装置，其特征在于，
还具备布线部件，其连接所述第1半导体元件的上表面和所述第2散热器，具有凹陷。
6. 如权利要求1~4的任一项所述的半导体装置，其特征在于，
所述第1半导体元件具有多个半导体元件，
所述多个半导体元件的下表面共同地与1个所述第1散热器接合。
7. 如权利要求1~4的任一项所述的半导体装置，其特征在于，
所述第1及第2散热器、以及所述第1及第2半导体元件构成3相半桥式电路。
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