CN107958901B - 模压智能电源模块 - Google Patents

模压智能电源模块 Download PDF

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CN107958901B
CN107958901B CN201710248384.2A CN201710248384A CN107958901B CN 107958901 B CN107958901 B CN 107958901B CN 201710248384 A CN201710248384 A CN 201710248384A CN 107958901 B CN107958901 B CN 107958901B
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power module
transistor
driving
chip pad
pins
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CN107958901A (zh
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徐范锡
牛志强
赵原震
胡照群
陈松
步俊明
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Alpha and Omega Semiconductor Cayman Ltd
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Alpha and Omega Semiconductor Cayman Ltd
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    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
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Abstract

一种智能电源模块具有第一、第二、第三和第四芯片焊盘，第一、第二、第三、第四、第五和第六晶体管，连接杆、低压IC、高压IC、第一、第二和第三升压二极管、多个引脚和一个模压封装。第一晶体管连接到第一芯片焊盘上。第二晶体管连接到第二芯片焊盘上。第三晶体管连接到第三芯片焊盘上。第四、第五和第六晶体管连接到第四芯片焊盘上。低压和高压IC连接到连接杆。模压封装包围着第一、第二、第三和第四芯片焊盘，第一、第二、第三、第四、第五和第六晶体管，连接杆、低压IC、高压IC、第一、第二和第三升压二极管。本发明与现有的智能电源模块相比，具有减小顶表面积以及引脚数量的优点。

Description

模压智能电源模块
技术领域
本发明主要涉及一种用于驱动电动机的模压智能电源模块(IPM)。更确切地说，本发明是关于一种模压IPM，与传统的IPM相比，减小了顶表面积，并且减少了引脚数量。
背景技术
传统的IPM使用绝缘金属衬底(IMS)。IMS通常由两个铜层嵌制而成。在本说明书中，在一个过模压型IPM中使用引线框和芯片焊盘，简化了制备工艺，降低了制备成本。用于驱动发动机的传统IPM具有三个驱动集成电路(IC)。在本说明书中，IPM具有一个低压IC和一个高压IC。
通过优化布局，获得了紧凑的封装尺寸。优化布局使用两个驱动IC，代替三个驱动IC，沿邻近的芯片焊盘引入等角的弯曲边。通过将两个驱动IC连接在同一个拉杆上，并通过接合引线将三个升压二极管连接到电源引脚上的选定引脚上，来实现减少引脚数量的目的。
发明内容
本发明的目的是提供一种用于驱动电动机的模压智能电源模块，本发明提出了一种具有第一、第二、第三和第四芯片焊盘的IPM，第一、第二、第三、第四、第五和第六金属-氧化物-半导体场效应晶体管(MOSFET)，连接杆、低压IC、高压IC、第二和第三升压二极管、多个引脚以及一个模压封装。第一MOSFET连接到第一芯片焊盘。第二MOSFET连接到第二芯片焊盘。第三MOSFET连接到第三芯片焊盘。第四、第五和第六MOSFET连接到第四芯片焊盘。低压和高压IC连接到连接杆。模压封装密封了第一、第二和第三和第四芯片焊盘、第一、第二、第三、第四、第五和第六MOSFET、连接杆、低压和高压IC以及第一、第二和第三升压二极管。
至少四个通孔沿沟槽分布，隔开连接杆以及第一、第二、第三和第四芯片焊盘。这四个通孔分布在连接杆的底部边缘中间部分和第一、第二、第三和第四芯片焊盘的顶部边缘之间。通孔有助于减少湿气的形成。配置至少四个通孔，以便在模压过程中接收至少四个支持引脚。
为了实现以上目的，本发明通过以下技术方案实现：
一种用于驱动发动机的模压智能电源模块，包含：一个第一、第二、第三和第四芯片焊盘；一个第一晶体管连接到第一芯片焊盘上；一个第二晶体管连接到第二芯片焊盘上；一个第三晶体管连接到第三芯片焊盘上；第五和第六晶体管连接到第四芯片焊盘上；连接杆具有第一端、第二端和中间范围延伸物；一个低压集成电路连接到连接杆；低压集成电路电连接到第一、第二和第三晶体管；一个高压集成电路连接到连接杆；高压集成电路电连接到第四、第五和第六晶体管；第二和第三升压二极管；多个引脚以及模压封装包围着第一、第二、第三和第四芯片焊盘，第一、第二、第三、第四、第五和第六晶体管，连接杆、低压集成电路、高压集成电路和第一、第二和第三升压二极管；其中多个引脚部分嵌入在模压封装中。
优选地，所述模压封装在连接杆的第一端附近设有第一缺口，以及在连接杆的第二端附近设有第二缺口。
优选地，在第一、第二和第三升压二极管附近，所述模压封装具有绝缘缺口。
优选地，所述连接杆的中间范围延伸物机械并电连接到接地引脚。
优选地，其中第一、第二、第三和第四芯片焊盘的顶部边缘是共面的；其中连接杆的底部边缘的中间部分平行于第一、第二、第三和第四芯片焊盘的顶部边缘；其中至少四个通孔在连接杆底部边缘的中间部分和第一、第二、第三、第四芯片焊盘的顶部边缘之间，并且所述至少四个通孔沿长轴方向对齐。
优选地，其中配置至少四个通孔，以便在模压过程中，接收四个支撑引脚。
优选地，其中低压集成电路通过多个接合引线，电连接到第一、第二和第三晶体管。
优选地，其中高压集成电路通过多个接合引线，电连接到第四、第五和第六晶体管。
优选地，其中第一接合引线将第一升压二极管连接到多个引脚的一个邻近引脚上；
第二接合引线将第二升压二极管连接到第一升压二极管；
第三接合引线将第三升压二极管连接到第二升压二极管。
优选地，所述邻近引脚机械并电连接到电源Vcc引脚。
优选地，其中多个引脚的至少两个所选引脚具有长方形缺口，以便用作引线挡梢。
优选地，其中第三芯片焊盘的第一曲边和第四焊盘的第二曲边具有相同的曲率中心，且所述第一曲边的曲率半径大于第二曲边的曲率半径。
优选地，所述模压智能电源模块进一步设有第一连接构件，其将第一芯片焊盘连接到多个引脚的第一引脚；第二连接构件，其将第二芯片焊盘连接到多个引脚的第二引脚；第三连接构件，其将第三芯片焊盘连接到多个引脚的第三引脚；并且所述第一、第二和第三连接构件具有相同的宽度。
优选地，所述低压集成电路和高压集成电路直接连接到连接杆，并且其中所述模压智能电源模块不包括直接连接到连接杆上的另一个集成电路。
优选地，其中第一晶体管为第一个金属-氧化物-半导体场效应晶体管；第二晶体管为第二个金属-氧化物-半导体场效应晶体管；第三晶体管为第三个金属-氧化物-半导体场效应晶体管；第四晶体管为第四个金属-氧化物-半导体场效应晶体管；第五晶体管为第五个金属-氧化物-半导体场效应晶体管；第六晶体管为第六个金属-氧化物-半导体场效应晶体管。
本发明与现有技术相比具有以下优点：
本发明通过优化布局，使用两个驱动IC，代替三个驱动IC，沿邻近的芯片焊盘引入等角的弯曲边，且将两个驱动IC连接在同一个拉杆上，并将三个升压二极管连接到电源引脚上的选定引线上，具有紧凑的封装尺寸，减少顶表面积与引脚数量的优点。
本发明的连接构件的宽度比现有技术的连接构件的宽度宽。较宽的连接构件可以提供较强的机械支撑，通过降低电阻和增强热耗散，提高电流性能。
附图说明
图1表示在本发明的示例中，用于驱动发动机的智能电源模块的电路图；
图2表示在本发明的示例中，驱动发动机的智能电源模块的透视图；
图3表示在本发明的示例中，驱动发动机的智能电源模块(带有图中没有表示出的模压封装)的仰视图；
图4A表示驱动发动机的智能电源模块的俯视图；
图4B表示驱动发动机的智能电源模块垂直于AA平面的剖面图；
图4C表示驱动发动机的智能电源模块的侧视图。
具体实施方式
以下结合附图，通过详细说明一个较佳的具体实施例，对本发明做进一步阐述。
图1表示在本发明的示例中，用于驱动发动机IPM的电路图100。低压集成电路(IC)120控制第一晶体管142、第二晶体管144和第三晶体管146。高压IC122控制第四晶体管152、第五晶体管154和第六晶体管156。在本发明的示例中，晶体管为金属-氧化物-半导体场效应晶体管。
图2表示在本发明的示例中，IPM 200的透视图。IPM 200的顶面积202最多有500平方毫米。传统的IPM顶面积约为750平方毫米。
图3表示在本发明的示例中，IPM(带有图中没有表示出的模压封装)的仰视图。IPM300具有第一芯片焊盘302A、第二芯片焊盘302B、第三芯片焊盘302C、第四芯片焊盘302D、第一晶体管342、第二晶体管344、第三晶体管346、第四晶体管352、第五晶体管354、第六晶体管356、连接杆310、低压IC320、高压IC 322、第一升压二极管372、第二升压二极管374、第三升压二极管376、多个引脚380以及图4A所示的模压封装。
第一芯片焊盘302A、第二芯片焊盘302B、第三芯片焊盘302C和第四芯片焊盘302D相互隔开，一个接一个地按照每个芯片焊盘的一个边缘基本呈一条直线的顺序排列。第一晶体管342连接到第一芯片焊盘302A。第二晶体管344连接到第二芯片焊盘302B。第三晶体管346连接到第三芯片焊盘302C。第四晶体管352、第五晶体管354和第六晶体管356连接到第四芯片焊盘302D。
连接杆310沿芯片焊盘的对准边缘延伸。连接杆310的第一端312在第一芯片焊盘302A的外边缘上方延伸。连接杆310的第二端314在第四芯片焊盘302D的外边缘上方延伸。在本发明的示例中，连接杆310还包括一个中间范围的延伸物316，在第一端312和第二端314之间。连接杆310的中间范围延伸物316机械连接到接地引脚，并电连接起来。中间范围延伸物316在垂直于芯片焊盘的对准边的水平方向(Y-方向)延伸。低压IC 320连接到连接杆310的第一延伸区，在第一端312和第二芯片焊盘302B附近的中间范围延伸物316之间。在本发明的示例中，通过接合引线306，低压IC 320电连接到第一晶体管342、第二晶体管344和第三晶体管346。高压IC 322连接到连接杆310的第二延伸区，在第二端314和第四芯片焊盘302D附近的中间范围延伸物316之间。在本发明的示例中，通过接合引线308，高压IC 322电连接到第四晶体管352、第五晶体管354和第六晶体管356。
在本发明的示例中，图4A所示的模压封装密封了第一芯片焊盘302A、第二芯片焊盘302B、第三芯片焊盘302C、第四芯片焊盘302D、第一晶体管342、第二晶体管344、第三晶体管346、第四晶体管352、第五晶体管354、第六晶体管356、连接杆310、低压IC 320、高压IC322、第一升压二极管372、第二升压二极管374、第三升压二极管376。在本发明的示例中，多个引脚380部分嵌入到图4A所示的模压封装中。在本发明的示例中，第一端312的底面和连接杆310的第二端314，从模压封装498的边缘面裸露出来。
在本发明的示例中，第一芯片焊盘302A的顶部边缘362、364、366和368、第二芯片焊盘302B、第三芯片焊盘302C和第四芯片焊盘302D对齐。连接杆310的底部边缘的中间部分318平行于顶部边缘362、364、366和368。图4A所示的至少四个通孔488A、488B、488C和488D在连接杆310的底部边缘的中间部分318和第一芯片焊盘302A、第二芯片焊盘302B、第三芯片焊盘302C和第四芯片焊盘302D的顶部边缘362、364、366和368之间。图4A所示的至少四个通孔488A、488B、488C和488D沿长轴方向(X-方向)对齐。配置图4A所示的至少四个通孔488A、488B、488C和488D在模压过程中，接收至少四个支撑引脚。
在本发明的示例中，第一接合引线304A将第一升压二极管372连接到多个引脚380的邻近引脚388上。第二接合引线304B将第二升压二极管374连接到第一升压二极管372。第三接合引线304C将第三升压二极管376连接到第二升压二极管374。在本发明的示例中，多个引脚380的邻近引脚388为电源(Vcc)引脚。
在本发明的示例中，第三芯片焊盘302C的第一曲边334和第四芯片焊盘302D的第二曲边336,具有相同的曲率中心332。第一曲边334的曲率半径大于第二曲边336的曲率半径。
第一连接构件392将第一芯片焊盘302A连接到多个引脚380的第一引脚382上。第二连接构件394将第二芯片焊盘302B连接到多个引脚380的第二引脚384上。第三连接构件396将第三芯片焊盘302C连接到多个引脚380的第三引脚386上。第一连接构件392、第二连接构件394和第三连接构件396具有相同的宽度。在本发明的示例中，相同的宽度至少为1.2毫米。传统的连接构件的宽度在0.7毫米至0.8毫米范围内。较宽的连接构件可以提供较强的机械支撑，通过降低电阻和增强热耗散，提高电流性能。
在本发明的示例中，多个引脚380的引脚总数最多23个。传统IPM的引脚总数至少是26个。
在本发明的示例中，图4A为IPM 400的俯视图，图4B为垂直于AA平面的剖面图，图4C为侧视图。通孔488A、488B、488C和488D有助于减少湿气的形成。
在本发明的示例中，模压封装498在连接杆310的第一端312附近，具有第一缺口452，在连接杆310的第二端314附近具有第二缺口454。第一和第二缺口452和454用于螺钉安装。在本发明的示例中，第一和第二缺口452和454为半圆形。
在本发明的示例中，模压封装498具有绝缘缺口478A、478B和478C，在第一升压二极管372、第二升压二极管374和第三升压二极管376附近。
在本发明的示例中，图3所示的多个引脚380中至少两个所选引脚468具有长方形缺口，以用于引线挡梢。
本领域的技术人员将理解所述实施例可能存在修正。例如，具有长方形缺口的所选引线468的总数可以变化。本领域的技术人员可能还有其他修正，这些修正都被视为属于本发明的范围内，由权利要求书限定。

Claims (14)

1.一种用于驱动发动机的智能电源模块，其特征在于，包含：
一个第一、第二、第三和第四芯片焊盘；
一个第一晶体管连接到第一芯片焊盘上；
一个第二晶体管连接到第二芯片焊盘上；
一个第三晶体管连接到第三芯片焊盘上；
第四、第五和第六晶体管连接到第四芯片焊盘上；
连接杆具有第一端、第二端和中间范围延伸物；
一个低压集成电路连接到连接杆；低压集成电路电连接到第一、第二和第三晶体管；
一个高压集成电路连接到连接杆；高压集成电路电连接到第四、第五和第六晶体管；
第一、第二和第三升压二极管；
多个引脚以及模压封装包围着第一、第二、第三和第四芯片焊盘，第一、第二、第三、第四、第五和第六晶体管，连接杆、低压集成电路、高压集成电路和第一、第二和第三升压二极管；
其中多个引脚部分嵌入在模压封装中；
所述连接杆的第一端的底面和连接杆的第二端，从所述模压封装的边缘面裸露出来；
所述模压智能电源模块进一步设有第一连接构件，其将第一芯片焊盘连接到多个引脚的第一引脚；
第二连接构件，其将第二芯片焊盘连接到多个引脚的第二引脚；
第三连接构件，其将第三芯片焊盘连接到多个引脚的第三引脚；并且
所述第一、第二和第三连接构件具有相同的宽度。
2.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，所述模压封装在连接杆的第一端附近设有第一缺口，以及在连接杆的第二端附近设有第二缺口。
3.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，在第一、第二和第三升压二极管附近，所述模压封装具有绝缘缺口。
4.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，所述连接杆的中间范围延伸物机械并电连接到接地引脚。
5.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中第一、第二、第三和第四芯片焊盘的顶部边缘是共面的；
其中连接杆的底部边缘的中间部分平行于第一、第二、第三和第四芯片焊盘的顶部边缘；
其中至少四个通孔在连接杆底部边缘的中间部分和第一、第二、第三、第四芯片焊盘的顶部边缘之间，并且所述至少四个通孔沿长轴方向对齐。
6.如权利要求5所述一种用于驱动发动机的智能电源模块，其特征在于，其中配置至少四个通孔，以便在模压过程中，接收四个支撑引脚。
7.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中低压集成电路通过多个接合引线，电连接到第一、第二和第三晶体管。
8.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中高压集成电路通过多个接合引线，电连接到第四、第五和第六晶体管。
9.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中第一接合引线将第一升压二极管连接到多个引脚的一个邻近引脚上；
第二接合引线将第二升压二极管连接到第一升压二极管；
第三接合引线将第三升压二极管连接到第二升压二极管。
10.如权利要求9所述一种用于驱动发动机的智能电源模块，其特征在于，所述邻近引脚机械并电连接到电源Vcc引脚。
11.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中多个引脚的至少两个所选引脚具有长方形缺口，以便用作引线挡梢。
12.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中第三芯片焊盘的第一曲边和第四焊盘的第二曲边具有相同的曲率中心，且所述第一曲边的曲率半径大于第二曲边的曲率半径。
13.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，所述低压集成电路和高压集成电路直接连接到连接杆。
14.如权利要求1所述一种用于驱动发动机的智能电源模块，其特征在于，其中第一晶体管为第一个金属-氧化物-半导体场效应晶体管；
第二晶体管为第二个金属-氧化物-半导体场效应晶体管；
第三晶体管为第三个金属-氧化物-半导体场效应晶体管；
第四晶体管为第四个金属-氧化物-半导体场效应晶体管；
第五晶体管为第五个金属-氧化物-半导体场效应晶体管；
第六晶体管为第六个金属-氧化物-半导体场效应晶体管。
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