CN103258948B - 发光器件 - Google Patents

发光器件 Download PDF

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Publication number
CN103258948B
CN103258948B CN201310055479.4A CN201310055479A CN103258948B CN 103258948 B CN103258948 B CN 103258948B CN 201310055479 A CN201310055479 A CN 201310055479A CN 103258948 B CN103258948 B CN 103258948B
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CN
China
Prior art keywords
moulded parts
lead electrode
light emitting
cavity
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310055479.4A
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English (en)
Chinese (zh)
Other versions
CN103258948A (zh
Inventor
李东镕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN103258948A publication Critical patent/CN103258948A/zh
Application granted granted Critical
Publication of CN103258948B publication Critical patent/CN103258948B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Led Device Packages (AREA)
CN201310055479.4A 2012-02-21 2013-02-21 发光器件 Active CN103258948B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120017640A KR20130096094A (ko) 2012-02-21 2012-02-21 발광소자 패키지, 발광 소자 패키지 제조방법 및 이를 구비한 조명 시스템
KR10-2012-0017640 2012-02-21

Publications (2)

Publication Number Publication Date
CN103258948A CN103258948A (zh) 2013-08-21
CN103258948B true CN103258948B (zh) 2017-05-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310055479.4A Active CN103258948B (zh) 2012-02-21 2013-02-21 发光器件

Country Status (5)

Country Link
US (2) US8860074B2 (enExample)
EP (1) EP2631957B1 (enExample)
JP (1) JP6166546B2 (enExample)
KR (1) KR20130096094A (enExample)
CN (1) CN103258948B (enExample)

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TWI619208B (zh) * 2014-03-31 2018-03-21 菱生精密工業股份有限公司 具聚光結構之光學模組的封裝方法
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JP6152409B1 (ja) * 2015-12-21 2017-06-21 レノボ・シンガポール・プライベート・リミテッド 粘着部材および電子機器
JP6579019B2 (ja) 2016-04-01 2019-09-25 日亜化学工業株式会社 発光素子載置用基体の製造方法及びそれを用いた発光装置の製造方法並びに発光素子載置用基体及びそれを用いた発光装置。
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WO2018139535A1 (ja) * 2017-01-25 2018-08-02 古河電気工業株式会社 照明装置及び該照明装置の製造方法
CN108511566A (zh) * 2018-03-13 2018-09-07 广东省半导体产业技术研究院 一种发光二极管制作方法
CN111148338A (zh) * 2018-11-01 2020-05-12 邱昱维 在布局有电路的陶瓷基板上成形环绕壁的方法及该基板
TWI668877B (zh) * 2018-11-13 2019-08-11 同泰電子科技股份有限公司 具有擋牆的光電機構的製作方法
JPWO2021251147A1 (enExample) * 2020-06-09 2021-12-16
JP7206505B2 (ja) * 2020-09-30 2023-01-18 日亜化学工業株式会社 発光装置及びその製造方法

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CN101432875A (zh) * 2006-04-26 2009-05-13 科锐香港有限公司 用于安装电子元件的装置和方法

Also Published As

Publication number Publication date
US20140367732A1 (en) 2014-12-18
EP2631957B1 (en) 2017-04-05
JP2013172154A (ja) 2013-09-02
JP6166546B2 (ja) 2017-07-19
KR20130096094A (ko) 2013-08-29
CN103258948A (zh) 2013-08-21
EP2631957A1 (en) 2013-08-28
US20130214319A1 (en) 2013-08-22
US8860074B2 (en) 2014-10-14
US9112125B2 (en) 2015-08-18

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Effective date of registration: 20210818

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address