CN103227273A - 布线衬底、发光器件、以及布线衬底的制造方法 - Google Patents

布线衬底、发光器件、以及布线衬底的制造方法 Download PDF

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Publication number
CN103227273A
CN103227273A CN201310027970.6A CN201310027970A CN103227273A CN 103227273 A CN103227273 A CN 103227273A CN 201310027970 A CN201310027970 A CN 201310027970A CN 103227273 A CN103227273 A CN 103227273A
Authority
CN
China
Prior art keywords
wiring pattern
layer
reflective layer
light emitting
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310027970.6A
Other languages
English (en)
Chinese (zh)
Inventor
村松茂次
清水浩
堀川泰爱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN103227273A publication Critical patent/CN103227273A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Led Device Packages (AREA)
CN201310027970.6A 2012-01-25 2013-01-24 布线衬底、发光器件、以及布线衬底的制造方法 Pending CN103227273A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-013243 2012-01-25
JP2012013243A JP6096413B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Publications (1)

Publication Number Publication Date
CN103227273A true CN103227273A (zh) 2013-07-31

Family

ID=47709855

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310027970.6A Pending CN103227273A (zh) 2012-01-25 2013-01-24 布线衬底、发光器件、以及布线衬底的制造方法

Country Status (4)

Country Link
US (1) US9084372B2 (https=)
EP (1) EP2621250B1 (https=)
JP (1) JP6096413B2 (https=)
CN (1) CN103227273A (https=)

Cited By (5)

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Publication number Priority date Publication date Assignee Title
CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
CN112467018A (zh) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
CN112997591A (zh) * 2018-11-08 2021-06-18 株式会社村田制作所 陶瓷电子部件
CN113644545A (zh) * 2020-04-24 2021-11-12 浙江睿熙科技有限公司 可分区导通的vcsel激光光源及其制备方法和驱动方法
CN121171983A (zh) * 2025-11-21 2025-12-19 华南理工大学 一种半导体芯片及其安装方法

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JP6280710B2 (ja) * 2013-09-02 2018-02-14 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP2015146346A (ja) * 2014-01-31 2015-08-13 イビデン株式会社 多層配線板
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
JP2016012621A (ja) * 2014-06-27 2016-01-21 三星ダイヤモンド工業株式会社 光ファイバ保持装置及びこれを有するレーザ発振器
CN104142087B (zh) * 2014-08-04 2015-12-09 杨文举 一种提高散热器热效率的散热片制造方法
JP6361385B2 (ja) * 2014-09-04 2018-07-25 日亜化学工業株式会社 回路基板およびこれを用いた発光装置
JP6511762B2 (ja) * 2014-10-03 2019-05-15 三菱電機株式会社 発光素子実装基板
US10062820B2 (en) 2015-05-15 2018-08-28 Panasonic Intellectual Property Management Co., Ltd. Interposer
JP6729025B2 (ja) * 2016-06-14 2020-07-22 日亜化学工業株式会社 発光装置
KR101801195B1 (ko) 2017-06-15 2017-11-27 디비라이텍 주식회사 조명모듈 제조방법 및 이에 의하여 제조되는 조명모듈
JP6838528B2 (ja) * 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
EP4191692A4 (en) * 2020-07-31 2024-10-16 Kyocera Corporation LIGHT-EMITTING DEVICE AND LIGHTING DEVICE
WO2022090035A1 (en) * 2020-10-29 2022-05-05 Signify Holding B.V. Insulating metal pcb with light-blocking layer
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure

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JPH07123186B2 (ja) 1992-09-25 1995-12-25 松下電工株式会社 回路装置
JP3169907B2 (ja) 1998-09-25 2001-05-28 日本電気株式会社 多層配線構造およびその製造方法
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JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
US6936336B2 (en) 2002-03-15 2005-08-30 Kyocera Corporation Transfer sheet and production method of the same and wiring board and production method of the same
US7201497B2 (en) 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
JP2006294898A (ja) * 2005-04-12 2006-10-26 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
JP4821854B2 (ja) 2006-06-14 2011-11-24 パナソニック株式会社 放熱配線基板
JP2009105379A (ja) * 2007-10-05 2009-05-14 Panasonic Electric Works Co Ltd 発光装置
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
KR20090068587A (ko) 2007-12-24 2009-06-29 삼성전기주식회사 발광 다이오드 기판모듈과 그 제조방법 및 백라이트 유닛과그 제조방법
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JP5280818B2 (ja) * 2008-11-28 2013-09-04 シャープ株式会社 発光装置
KR101077264B1 (ko) * 2009-02-17 2011-10-27 (주)포인트엔지니어링 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법
JP5295010B2 (ja) * 2009-06-25 2013-09-18 京セラ株式会社 発光装置
JP2011018801A (ja) * 2009-07-09 2011-01-27 Citizen Electronics Co Ltd 半導体装置の製造方法
EP2455991B1 (en) 2009-07-17 2017-05-10 Denka Company Limited Led chip assembly, led package, and manufacturing method of led package
JP2011151248A (ja) * 2010-01-22 2011-08-04 Seiwa Electric Mfg Co Ltd 発光装置及び発光装置の製造方法
JP5375630B2 (ja) * 2010-01-25 2013-12-25 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
CN102414851B (zh) * 2010-03-11 2016-06-22 松下知识产权经营株式会社 发光模块、光源装置、液晶显示装置和发光模块的制造方法
WO2011142097A1 (ja) * 2010-05-13 2011-11-17 パナソニック株式会社 実装用基板及びその製造方法、発光モジュール並びに照明装置
JP5810302B2 (ja) * 2010-06-28 2015-11-11 パナソニックＩｐマネジメント株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
KR101775428B1 (ko) * 2010-12-28 2017-09-06 삼성전자 주식회사 발광 소자 패키지 및 그 제조 방법

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
CN112997591A (zh) * 2018-11-08 2021-06-18 株式会社村田制作所 陶瓷电子部件
CN113644545A (zh) * 2020-04-24 2021-11-12 浙江睿熙科技有限公司 可分区导通的vcsel激光光源及其制备方法和驱动方法
CN112467018A (zh) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
CN112467018B (zh) * 2020-10-20 2021-10-15 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
CN121171983A (zh) * 2025-11-21 2025-12-19 华南理工大学 一种半导体芯片及其安装方法
CN121171983B (zh) * 2025-11-21 2026-02-27 华南理工大学 一种半导体芯片及其安装方法

Also Published As

Publication number Publication date
US20130188361A1 (en) 2013-07-25
JP6096413B2 (ja) 2017-03-15
EP2621250B1 (en) 2014-02-26
EP2621250A1 (en) 2013-07-31
JP2013153069A (ja) 2013-08-08
US9084372B2 (en) 2015-07-14

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Application publication date: 20130731