JP6096413B2 - 配線基板、発光装置及び配線基板の製造方法 - Google Patents

配線基板、発光装置及び配線基板の製造方法 Download PDF

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Publication number
JP6096413B2
JP6096413B2 JP2012013243A JP2012013243A JP6096413B2 JP 6096413 B2 JP6096413 B2 JP 6096413B2 JP 2012013243 A JP2012013243 A JP 2012013243A JP 2012013243 A JP2012013243 A JP 2012013243A JP 6096413 B2 JP6096413 B2 JP 6096413B2
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JP
Japan
Prior art keywords
layer
reflective layer
wiring pattern
light emitting
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012013243A
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English (en)
Japanese (ja)
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JP2013153069A5 (https=
JP2013153069A (ja
Inventor
村松　茂次
茂次 村松
清水　浩
浩 清水
堀川　泰愛
泰愛 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012013243A priority Critical patent/JP6096413B2/ja
Priority to US13/749,070 priority patent/US9084372B2/en
Priority to CN201310027970.6A priority patent/CN103227273A/zh
Priority to EP13152505.7A priority patent/EP2621250B1/en
Publication of JP2013153069A publication Critical patent/JP2013153069A/ja
Publication of JP2013153069A5 publication Critical patent/JP2013153069A5/ja
Application granted granted Critical
Publication of JP6096413B2 publication Critical patent/JP6096413B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Led Device Packages (AREA)
JP2012013243A 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法 Active JP6096413B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012013243A JP6096413B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法
US13/749,070 US9084372B2 (en) 2012-01-25 2013-01-24 Wiring substrate, light emitting device, and manufacturing method of wiring substrate
CN201310027970.6A CN103227273A (zh) 2012-01-25 2013-01-24 布线衬底、发光器件、以及布线衬底的制造方法
EP13152505.7A EP2621250B1 (en) 2012-01-25 2013-01-24 Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012013243A JP6096413B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013153069A JP2013153069A (ja) 2013-08-08
JP2013153069A5 JP2013153069A5 (https=) 2015-01-29
JP6096413B2 true JP6096413B2 (ja) 2017-03-15

Family

ID=47709855

Family Applications (1)

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JP2012013243A Active JP6096413B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Country Status (4)

Country Link
US (1) US9084372B2 (https=)
EP (1) EP2621250B1 (https=)
JP (1) JP6096413B2 (https=)
CN (1) CN103227273A (https=)

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JP6280710B2 (ja) * 2013-09-02 2018-02-14 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP2015146346A (ja) * 2014-01-31 2015-08-13 イビデン株式会社 多層配線板
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
JP2016012621A (ja) * 2014-06-27 2016-01-21 三星ダイヤモンド工業株式会社 光ファイバ保持装置及びこれを有するレーザ発振器
CN104142087B (zh) * 2014-08-04 2015-12-09 杨文举 一种提高散热器热效率的散热片制造方法
JP6361385B2 (ja) * 2014-09-04 2018-07-25 日亜化学工業株式会社 回路基板およびこれを用いた発光装置
JP6511762B2 (ja) * 2014-10-03 2019-05-15 三菱電機株式会社 発光素子実装基板
US10062820B2 (en) 2015-05-15 2018-08-28 Panasonic Intellectual Property Management Co., Ltd. Interposer
JP6729025B2 (ja) * 2016-06-14 2020-07-22 日亜化学工業株式会社 発光装置
KR101801195B1 (ko) 2017-06-15 2017-11-27 디비라이텍 주식회사 조명모듈 제조방법 및 이에 의하여 제조되는 조명모듈
JP6838528B2 (ja) * 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
CN112997591B (zh) * 2018-11-08 2025-04-01 株式会社村田制作所 陶瓷电子部件
CN113644545A (zh) * 2020-04-24 2021-11-12 浙江睿熙科技有限公司 可分区导通的vcsel激光光源及其制备方法和驱动方法
EP4191692A4 (en) * 2020-07-31 2024-10-16 Kyocera Corporation LIGHT-EMITTING DEVICE AND LIGHTING DEVICE
CN112467018B (zh) * 2020-10-20 2021-10-15 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
WO2022090035A1 (en) * 2020-10-29 2022-05-05 Signify Holding B.V. Insulating metal pcb with light-blocking layer
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure
CN121171983B (zh) * 2025-11-21 2026-02-27 华南理工大学 一种半导体芯片及其安装方法

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Also Published As

Publication number Publication date
US20130188361A1 (en) 2013-07-25
CN103227273A (zh) 2013-07-31
EP2621250B1 (en) 2014-02-26
EP2621250A1 (en) 2013-07-31
JP2013153069A (ja) 2013-08-08
US9084372B2 (en) 2015-07-14

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