CN103227273A - 布线衬底、发光器件、以及布线衬底的制造方法 - Google Patents

布线衬底、发光器件、以及布线衬底的制造方法 Download PDF

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Publication number
CN103227273A
CN103227273A CN201310027970.6A CN201310027970A CN103227273A CN 103227273 A CN103227273 A CN 103227273A CN 201310027970 A CN201310027970 A CN 201310027970A CN 103227273 A CN103227273 A CN 103227273A
Authority
CN
China
Prior art keywords
wiring pattern
reflector
wiring
insulating barrier
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310027970.6A
Other languages
English (en)
Chinese (zh)
Inventor
村松茂次
清水浩
堀川泰爱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN103227273A publication Critical patent/CN103227273A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Led Device Packages (AREA)
CN201310027970.6A 2012-01-25 2013-01-24 布线衬底、发光器件、以及布线衬底的制造方法 Pending CN103227273A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012013243A JP6096413B2 (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法
JP2012-013243 2012-01-25

Publications (1)

Publication Number Publication Date
CN103227273A true CN103227273A (zh) 2013-07-31

Family

ID=47709855

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310027970.6A Pending CN103227273A (zh) 2012-01-25 2013-01-24 布线衬底、发光器件、以及布线衬底的制造方法

Country Status (4)

Country Link
US (1) US9084372B2 (enExample)
EP (1) EP2621250B1 (enExample)
JP (1) JP6096413B2 (enExample)
CN (1) CN103227273A (enExample)

Cited By (3)

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CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
CN112467018A (zh) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
CN112997591A (zh) * 2018-11-08 2021-06-18 株式会社村田制作所 陶瓷电子部件

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JP6280710B2 (ja) * 2013-09-02 2018-02-14 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP2015146346A (ja) * 2014-01-31 2015-08-13 イビデン株式会社 多層配線板
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
JP2016012621A (ja) * 2014-06-27 2016-01-21 三星ダイヤモンド工業株式会社 光ファイバ保持装置及びこれを有するレーザ発振器
CN104142087B (zh) * 2014-08-04 2015-12-09 杨文举 一种提高散热器热效率的散热片制造方法
JP6361385B2 (ja) * 2014-09-04 2018-07-25 日亜化学工業株式会社 回路基板およびこれを用いた発光装置
JP6511762B2 (ja) * 2014-10-03 2019-05-15 三菱電機株式会社 発光素子実装基板
DE112016002190B4 (de) * 2015-05-15 2021-10-07 Panasonic Intellectual Property Management Co., Ltd. Interposer
JP6729025B2 (ja) * 2016-06-14 2020-07-22 日亜化学工業株式会社 発光装置
KR101801195B1 (ko) 2017-06-15 2017-11-27 디비라이텍 주식회사 조명모듈 제조방법 및 이에 의하여 제조되는 조명모듈
JP6838528B2 (ja) * 2017-08-31 2021-03-03 日亜化学工業株式会社 基板の製造方法と発光装置の製造方法
WO2022025065A1 (ja) 2020-07-31 2022-02-03 京セラ株式会社 発光装置及び照明装置
WO2022090035A1 (en) * 2020-10-29 2022-05-05 Signify Holding B.V. Insulating metal pcb with light-blocking layer
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure

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JP3169907B2 (ja) 1998-09-25 2001-05-28 日本電気株式会社 多層配線構造およびその製造方法
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JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
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JP2006294898A (ja) * 2005-04-12 2006-10-26 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
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JP5810302B2 (ja) * 2010-06-28 2015-11-11 パナソニックＩｐマネジメント株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
CN112997591A (zh) * 2018-11-08 2021-06-18 株式会社村田制作所 陶瓷电子部件
CN112467018A (zh) * 2020-10-20 2021-03-09 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法
CN112467018B (zh) * 2020-10-20 2021-10-15 深圳市隆利科技股份有限公司 mini-LED/micro-LED面光源及其制造方法

Also Published As

Publication number Publication date
EP2621250A1 (en) 2013-07-31
US20130188361A1 (en) 2013-07-25
US9084372B2 (en) 2015-07-14
EP2621250B1 (en) 2014-02-26
JP2013153069A (ja) 2013-08-08
JP6096413B2 (ja) 2017-03-15

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Application publication date: 20130731