CN103154328A - 锡电镀用酸性水基组合物 - Google Patents

锡电镀用酸性水基组合物 Download PDF

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Publication number
CN103154328A
CN103154328A CN2012800029066A CN201280002906A CN103154328A CN 103154328 A CN103154328 A CN 103154328A CN 2012800029066 A CN2012800029066 A CN 2012800029066A CN 201280002906 A CN201280002906 A CN 201280002906A CN 103154328 A CN103154328 A CN 103154328A
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CN
China
Prior art keywords
tin
gloss
kinds
group
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012800029066A
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English (en)
Chinese (zh)
Inventor
楠义则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuken Kogyo Co Ltd
Original Assignee
Yuken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuken Kogyo Co Ltd filed Critical Yuken Kogyo Co Ltd
Publication of CN103154328A publication Critical patent/CN103154328A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
CN2012800029066A 2011-09-29 2012-01-17 锡电镀用酸性水基组合物 Pending CN103154328A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011214393A JP5033979B1 (ja) 2011-09-29 2011-09-29 スズからなるめっき用酸性水系組成物
JP2011-214393 2011-09-29
PCT/JP2012/050775 WO2013046731A1 (ja) 2011-09-29 2012-01-17 スズめっき用酸性水系組成物

Publications (1)

Publication Number Publication Date
CN103154328A true CN103154328A (zh) 2013-06-12

Family

ID=47016633

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012800029066A Pending CN103154328A (zh) 2011-09-29 2012-01-17 锡电镀用酸性水基组合物

Country Status (3)

Country Link
JP (1) JP5033979B1 (ja)
CN (1) CN103154328A (ja)
WO (1) WO2013046731A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672400B (zh) * 2016-07-18 2019-09-21 美商羅門哈斯電子材料有限公司 含有１，１０－啡啉化合物的銦電鍍組合物及電鍍銦的方法
CN111206272A (zh) * 2020-02-25 2020-05-29 广州三孚新材料科技股份有限公司 异质结电池片电镀哑锡的镀液添加剂、电镀液及其制备方法和应用
TWI703239B (zh) * 2018-03-20 2020-09-01 日商三菱綜合材料股份有限公司 錫或錫合金鍍敷液及凸塊的形成方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
JP6677873B2 (ja) * 2018-03-26 2020-04-08 三菱マテリアル株式会社 錫又は錫合金めっき液及び該液を用いたバンプの形成方法
WO2019181906A1 (ja) * 2018-03-20 2019-09-26 三菱マテリアル株式会社 錫又は錫合金めっき液、及びバンプの形成方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135833A (ja) * 1972-11-17 1974-12-27
US4923576A (en) * 1988-07-06 1990-05-08 Technic, Inc. Additives for electroplating compositions and methods for their use
JPH04254597A (ja) * 1991-02-06 1992-09-09 Nagano Pref Gov 変調電流電解用の光沢スズ系金属めっき液
JPH05171489A (ja) * 1991-12-17 1993-07-09 Yuken Kogyo Kk めっき用組成液
JPH1036994A (ja) * 1996-07-23 1998-02-10 Nikko Kinzoku Kk 錫及び錫／鉛合金めっき液
CN1649676A (zh) * 2002-04-30 2005-08-03 技术公司 在锡的电沉积物中最小化晶须生长
CN100572608C (zh) * 2005-04-15 2009-12-23 福田金属箔粉工业株式会社 铜箔的粗面化处理方法以及粗面化处理液
JP2010265491A (ja) * 2009-05-12 2010-11-25 Ishihara Chem Co Ltd スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
BG34691A1 (en) * 1981-07-14 1983-11-15 Todorov Electrolyte for depositing bright tin coatings
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
JP4362568B2 (ja) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 錫−銅合金電気めっき液
EP1260614B1 (en) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Tin plating
JP4740754B2 (ja) * 2006-01-27 2011-08-03 株式会社大和化成研究所 変色防止剤組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135833A (ja) * 1972-11-17 1974-12-27
US4923576A (en) * 1988-07-06 1990-05-08 Technic, Inc. Additives for electroplating compositions and methods for their use
JPH04254597A (ja) * 1991-02-06 1992-09-09 Nagano Pref Gov 変調電流電解用の光沢スズ系金属めっき液
JPH05171489A (ja) * 1991-12-17 1993-07-09 Yuken Kogyo Kk めっき用組成液
JPH1036994A (ja) * 1996-07-23 1998-02-10 Nikko Kinzoku Kk 錫及び錫／鉛合金めっき液
CN1649676A (zh) * 2002-04-30 2005-08-03 技术公司 在锡的电沉积物中最小化晶须生长
CN100572608C (zh) * 2005-04-15 2009-12-23 福田金属箔粉工业株式会社 铜箔的粗面化处理方法以及粗面化处理液
JP2010265491A (ja) * 2009-05-12 2010-11-25 Ishihara Chem Co Ltd スズ又はスズ合金メッキ浴、及び当該メッキ浴を用いたバレルメッキ方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672400B (zh) * 2016-07-18 2019-09-21 美商羅門哈斯電子材料有限公司 含有１，１０－啡啉化合物的銦電鍍組合物及電鍍銦的方法
TWI703239B (zh) * 2018-03-20 2020-09-01 日商三菱綜合材料股份有限公司 錫或錫合金鍍敷液及凸塊的形成方法
US11053600B2 (en) 2018-03-20 2021-07-06 Mitsubishi Materials Corporation Tin or tin alloy plating solution and bump forming method
CN111206272A (zh) * 2020-02-25 2020-05-29 广州三孚新材料科技股份有限公司 异质结电池片电镀哑锡的镀液添加剂、电镀液及其制备方法和应用

Also Published As

Publication number Publication date
JP5033979B1 (ja) 2012-09-26
JP2013072133A (ja) 2013-04-22
WO2013046731A1 (ja) 2013-04-04

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Application publication date: 20130612