CN103129049A - 覆铜层压板和制造覆铜层压板的方法 - Google Patents

覆铜层压板和制造覆铜层压板的方法 Download PDF

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Publication number
CN103129049A
CN103129049A CN2012104875323A CN201210487532A CN103129049A CN 103129049 A CN103129049 A CN 103129049A CN 2012104875323 A CN2012104875323 A CN 2012104875323A CN 201210487532 A CN201210487532 A CN 201210487532A CN 103129049 A CN103129049 A CN 103129049A
Authority
CN
China
Prior art keywords
insulating layer
layer
metal plate
edge
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104875323A
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English (en)
Chinese (zh)
Inventor
金荣庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN103129049A publication Critical patent/CN103129049A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2012104875323A 2011-11-24 2012-11-26 覆铜层压板和制造覆铜层压板的方法 Pending CN103129049A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0123536 2011-11-24
KR1020110123536A KR20130057674A (ko) 2011-11-24 2011-11-24 동박적층판 및 그 제조 방법

Publications (1)

Publication Number Publication Date
CN103129049A true CN103129049A (zh) 2013-06-05

Family

ID=48467127

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104875323A Pending CN103129049A (zh) 2011-11-24 2012-11-26 覆铜层压板和制造覆铜层压板的方法

Country Status (5)

Country Link
US (1) US8911848B2 (enExample)
JP (1) JP6043604B2 (enExample)
KR (1) KR20130057674A (enExample)
CN (1) CN103129049A (enExample)
TW (1) TWI538578B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111787688A (zh) * 2020-06-30 2020-10-16 江苏艾诺信电路技术有限公司 金属基覆铜板、其耐电压测试方法及其制造方法
CN113950187A (zh) * 2021-10-27 2022-01-18 杨晓战 平面导热覆铜板及封装多块平面导热覆铜板的封装基板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103612464B (zh) * 2013-11-11 2015-11-25 莱芜金鼎电子材料有限公司 一种双面挠性覆铜板及其制备方法
CN106799885A (zh) * 2017-01-14 2017-06-06 东莞市台信光电科技有限公司 铝基覆铜板的层压方法
DE102017215048A1 (de) * 2017-08-29 2019-02-28 Conti Temic Microelectronic Gmbh Schaltungsträger für Leistungselektronik und Leistungselektronikmodul mit einem Schaltungsträger

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237529B (en) * 2002-05-30 2005-08-01 Mitsui Mining & Smelting Co Double-sided copper clad laminate and method for manufacturing the same
CN101790278A (zh) * 2010-02-10 2010-07-28 上海南亚覆铜箔板有限公司 一种具有全避光性能的覆铜箔层压板及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147246A (ja) * 1984-08-11 1986-03-07 松下電工株式会社 金属ベ−ス金属張積層板
JPH05304345A (ja) * 1992-04-27 1993-11-16 Sanken Electric Co Ltd 金属製配線基板及びその製造方法
JPH0645715A (ja) 1992-07-22 1994-02-18 Mitsui Toatsu Chem Inc 配線基板
JPH11204903A (ja) 1998-01-14 1999-07-30 Kobe Steel Ltd 積層金属基板
JP2001345472A (ja) 2000-03-29 2001-12-14 Canon Inc 太陽電池モジュールの検査方法、検査装置及び製造方法、太陽光発電システムの点検方法及び点検装置、並びに絶縁抵抗測定器及び耐電圧試験器
JP4192870B2 (ja) * 2004-09-13 2008-12-10 新神戸電機株式会社 積層板および配線板
KR20080062285A (ko) 2006-12-29 2008-07-03 에스케이케미칼주식회사 금속 베이스 동박적층판
JP2009172996A (ja) * 2007-12-26 2009-08-06 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法
JP5185066B2 (ja) * 2008-10-23 2013-04-17 Ｊｘ日鉱日石金属株式会社 屈曲性に優れた銅箔、その製造方法及びフレキシブル銅貼積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237529B (en) * 2002-05-30 2005-08-01 Mitsui Mining & Smelting Co Double-sided copper clad laminate and method for manufacturing the same
CN101790278A (zh) * 2010-02-10 2010-07-28 上海南亚覆铜箔板有限公司 一种具有全避光性能的覆铜箔层压板及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111787688A (zh) * 2020-06-30 2020-10-16 江苏艾诺信电路技术有限公司 金属基覆铜板、其耐电压测试方法及其制造方法
CN113950187A (zh) * 2021-10-27 2022-01-18 杨晓战 平面导热覆铜板及封装多块平面导热覆铜板的封装基板

Also Published As

Publication number Publication date
TWI538578B (zh) 2016-06-11
KR20130057674A (ko) 2013-06-03
US8911848B2 (en) 2014-12-16
US20130136887A1 (en) 2013-05-30
JP6043604B2 (ja) 2016-12-14
JP2013111980A (ja) 2013-06-10
TW201330718A (zh) 2013-07-16

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Application publication date: 20130605