JP2013111980A - 銅箔積層板及びその製造方法 - Google Patents
銅箔積層板及びその製造方法 Download PDFInfo
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- JP2013111980A JP2013111980A JP2012257455A JP2012257455A JP2013111980A JP 2013111980 A JP2013111980 A JP 2013111980A JP 2012257455 A JP2012257455 A JP 2012257455A JP 2012257455 A JP2012257455 A JP 2012257455A JP 2013111980 A JP2013111980 A JP 2013111980A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 255
- 239000011889 copper foil Substances 0.000 title claims abstract description 250
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 66
- 229910052751 metal Inorganic materials 0.000 claims abstract description 189
- 239000002184 metal Substances 0.000 claims abstract description 189
- 238000009413 insulation Methods 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims description 205
- 238000000034 method Methods 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 229920001721 polyimide Polymers 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims description 14
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 3
- 238000012545 processing Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】本発明の銅箔積層板は、金属板と、金属板より広い平面積を有して金属板上に積層される絶縁層と、絶縁層上に積層される銅箔と、を有し、絶縁層は、側面が金属板の側面から外側に更に伸びて金属板の外側面と銅箔の外側面との間を絶縁させる絶縁距離を形成する。
【選択図】図1
Description
前記絶縁層は、ポリイミド絶縁層を含み得る。
前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させ得る。
前記金属板と前記絶縁層との間及び前記絶縁層と前記銅箔との間の少なくともいずれかに備えられるポリイミド接着層を更に含み得る。
前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させ得る。
前記絶縁層は、ポリイミド絶縁層を含み得る。
前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させ得る。
前記積層体は、前記絶縁層と前記銅箔との間に接着層を更に備え得る。
前記接着層は、ポリイミド接着層を含み得る。
11 金属板の外側面
20 絶縁層
21 絶縁層の外側面
30 銅箔
31 銅箔の外側面
40 接着層、絶縁フィルム
50 テープ
60 切断溝
L 絶縁距離
Claims (14)
- 金属板と、
前記金属板より広い平面積を有して該金属板上に積層される絶縁層と、
前記絶縁層上に積層される銅箔と、を有し、
前記絶縁層は、側面が前記金属板の側面から外側に更に伸びて前記金属板の外側面と銅箔の外側面との間を絶縁させる絶縁距離を形成することを特徴とする銅箔積層板。 - 前記絶縁距離は、1mm以上15mm以下の範囲内で調節されることを特徴とする請求項1に記載の銅箔積層板。
- 前記絶縁層は、ポリイミド絶縁層を含むことを特徴とする請求項1に記載の銅箔積層板。
- 前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させることを特徴とする請求項1に記載の銅箔積層板。
- 前記金属板と前記絶縁層との間及び前記絶縁層と前記銅箔との間の少なくともいずれかに備えられるポリイミド接着層を更に含むことを特徴とする請求項1に記載の銅箔積層板。
- 金属板、及び該金属板より広い平面積を有して該金属板上に積層される絶縁層と該絶縁層上に積層される銅箔とからなる積層体を準備する段階と、
前記絶縁層の外側面が前記金属板の外側面から外側に更に伸びるように前記金属板上に前記積層体を積層する段階と、
前記金属板と該金属板上に積層された前記積層体とをホットプレスする段階と、を有し、
前記絶縁層の外側面が前記金属板の外側面から伸びた距離だけ前記金属板の外側面と前記銅箔の外側面との間を絶縁させる絶縁距離を形成することを特徴とする銅箔積層板の製造方法。 - 前記絶縁距離は、1mm以上15mm以下の範囲内で調節されることを特徴とする請求項6に記載の銅箔積層板の製造方法。
- 前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させることを特徴とする請求項6に記載の銅箔積層板の製造方法。
- 前記絶縁層は、ポリイミド絶縁層を含むことを特徴とする請求項6に記載の銅箔積層板の製造方法。
- 金属板、及び該金属板より広い平面積を有して該金属板上に積層される絶縁層と該絶縁層上に積層される銅箔とからなる積層体を準備する段階と、
前記絶縁層の外側面が前記金属板の外側面から外側に更に伸びるように前記金属板上に前記積層体を積層し、前記金属板と前記積層体との間に介在する接着層を介して仮接着させる段階と、
前記接着層を高温硬化させて前記金属板と該金属板上に積層された前記積層体とを接着させる段階と、を有し、
前記絶縁層の外側面が前記金属板の外側面から伸びた距離だけ前記金属板の外側面と前記銅箔の外側面との間を絶縁させる絶縁距離を形成することを特徴とする銅箔積層板の製造方法。 - 前記絶縁距離は、1mm以上15mm以下の範囲内で調節されることを特徴とする請求項10に記載の銅箔積層板の製造方法。
- 前記銅箔は、前記絶縁層と対応するサイズで形成されるか又は前記絶縁層より小さいサイズで形成されて縁に沿って前記絶縁層を露出させることを特徴とする請求項10に記載の銅箔積層板の製造方法。
- 前記積層体は、前記絶縁層と前記銅箔との間に接着層を更に備えることを特徴とする請求項10に記載の銅箔積層板の製造方法。
- 前記接着層は、ポリイミド接着層を含むことを特徴とする請求項10又は13に記載の銅箔積層板の製造方法。
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KR1020110123536A KR20130057674A (ko) | 2011-11-24 | 2011-11-24 | 동박적층판 및 그 제조 방법 |
KR10-2011-0123536 | 2011-11-24 |
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JP2013111980A true JP2013111980A (ja) | 2013-06-10 |
JP2013111980A5 JP2013111980A5 (ja) | 2015-12-17 |
JP6043604B2 JP6043604B2 (ja) | 2016-12-14 |
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US (1) | US8911848B2 (ja) |
JP (1) | JP6043604B2 (ja) |
KR (1) | KR20130057674A (ja) |
CN (1) | CN103129049A (ja) |
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CN103612464B (zh) * | 2013-11-11 | 2015-11-25 | 莱芜金鼎电子材料有限公司 | 一种双面挠性覆铜板及其制备方法 |
CN106799885A (zh) * | 2017-01-14 | 2017-06-06 | 东莞市台信光电科技有限公司 | 铝基覆铜板的层压方法 |
KR101856684B1 (ko) * | 2017-05-12 | 2018-05-14 | 주식회사 넥스트업 | 전기 구이기 |
DE102017215048A1 (de) * | 2017-08-29 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Schaltungsträger für Leistungselektronik und Leistungselektronikmodul mit einem Schaltungsträger |
CN111787688A (zh) * | 2020-06-30 | 2020-10-16 | 江苏艾诺信电路技术有限公司 | 金属基覆铜板、其耐电压测试方法及其制造方法 |
CN113950187A (zh) * | 2021-10-27 | 2022-01-18 | 杨晓战 | 平面导热覆铜板及封装多块平面导热覆铜板的封装基板 |
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JPH05304345A (ja) * | 1992-04-27 | 1993-11-16 | Sanken Electric Co Ltd | 金属製配線基板及びその製造方法 |
JPH0645715A (ja) | 1992-07-22 | 1994-02-18 | Mitsui Toatsu Chem Inc | 配線基板 |
JPH11204903A (ja) | 1998-01-14 | 1999-07-30 | Kobe Steel Ltd | 積層金属基板 |
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KR20080062285A (ko) | 2006-12-29 | 2008-07-03 | 에스케이케미칼주식회사 | 금속 베이스 동박적층판 |
JP5185066B2 (ja) * | 2008-10-23 | 2013-04-17 | Jx日鉱日石金属株式会社 | 屈曲性に優れた銅箔、その製造方法及びフレキシブル銅貼積層板 |
CN101790278B (zh) * | 2010-02-10 | 2011-06-08 | 上海南亚覆铜箔板有限公司 | 一种具有全避光性能的覆铜箔层压板及其制备方法 |
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2011
- 2011-11-24 KR KR1020110123536A patent/KR20130057674A/ko not_active Application Discontinuation
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2012
- 2012-11-20 US US13/681,872 patent/US8911848B2/en active Active
- 2012-11-23 TW TW101143847A patent/TWI538578B/zh active
- 2012-11-26 CN CN2012104875323A patent/CN103129049A/zh active Pending
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Patent Citations (3)
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JPS6147246A (ja) * | 1984-08-11 | 1986-03-07 | 松下電工株式会社 | 金属ベ−ス金属張積層板 |
JP2006076263A (ja) * | 2004-09-13 | 2006-03-23 | Shin Kobe Electric Mach Co Ltd | 積層板および配線板 |
JP2009172996A (ja) * | 2007-12-26 | 2009-08-06 | Shin Etsu Chem Co Ltd | フレキシブル銅張積層板及びその製造方法 |
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CN103129049A (zh) | 2013-06-05 |
US20130136887A1 (en) | 2013-05-30 |
TW201330718A (zh) | 2013-07-16 |
JP6043604B2 (ja) | 2016-12-14 |
US8911848B2 (en) | 2014-12-16 |
KR20130057674A (ko) | 2013-06-03 |
TWI538578B (zh) | 2016-06-11 |
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