CN104427790B - 一种局部凹陷印刷电路板及其制作方法 - Google Patents
一种局部凹陷印刷电路板及其制作方法 Download PDFInfo
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- CN104427790B CN104427790B CN201310385004.1A CN201310385004A CN104427790B CN 104427790 B CN104427790 B CN 104427790B CN 201310385004 A CN201310385004 A CN 201310385004A CN 104427790 B CN104427790 B CN 104427790B
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- copper foil
- core plate
- outer layer
- depression
- core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Abstract
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Claims (11)
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CN201310385004.1A CN104427790B (zh) | 2013-08-29 | 2013-08-29 | 一种局部凹陷印刷电路板及其制作方法 |
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CN201310385004.1A CN104427790B (zh) | 2013-08-29 | 2013-08-29 | 一种局部凹陷印刷电路板及其制作方法 |
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CN104427790A CN104427790A (zh) | 2015-03-18 |
CN104427790B true CN104427790B (zh) | 2017-06-09 |
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CN201310385004.1A Active CN104427790B (zh) | 2013-08-29 | 2013-08-29 | 一种局部凹陷印刷电路板及其制作方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106852029B (zh) * | 2017-03-31 | 2018-12-14 | 竞华电子(深圳)有限公司 | 一种PCB Cavity设计区域的制作工艺 |
CN112770539B (zh) * | 2019-10-21 | 2022-06-28 | 深南电路股份有限公司 | 电路板及其加工方法 |
CN111090076A (zh) * | 2020-01-22 | 2020-05-01 | 无锡威孚高科技集团股份有限公司 | 一种毫米波雷达射频前端电路结构及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201044938A (en) * | 2009-06-01 | 2010-12-16 | Unimicron Technology Crop | Method for manufacturing a printed circuit board |
CN102595806A (zh) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | 一种保护内层软板的软硬结合线路板制作方法 |
CN102860144A (zh) * | 2010-02-12 | 2013-01-02 | Lg伊诺特有限公司 | 具有腔的pcb及其制造方法 |
CN103270819A (zh) * | 2010-10-20 | 2013-08-28 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392404B (zh) * | 2009-04-02 | 2013-04-01 | Unimicron Technology Corp | 線路板及其製作方法 |
US8519270B2 (en) * | 2010-05-19 | 2013-08-27 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof |
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- 2013-08-29 CN CN201310385004.1A patent/CN104427790B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201044938A (en) * | 2009-06-01 | 2010-12-16 | Unimicron Technology Crop | Method for manufacturing a printed circuit board |
CN102860144A (zh) * | 2010-02-12 | 2013-01-02 | Lg伊诺特有限公司 | 具有腔的pcb及其制造方法 |
CN103270819A (zh) * | 2010-10-20 | 2013-08-28 | Lg伊诺特有限公司 | 印刷电路板及其制造方法 |
CN102595806A (zh) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | 一种保护内层软板的软硬结合线路板制作方法 |
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CN104427790A (zh) | 2015-03-18 |
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Effective date of registration: 20220616 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |