CN103124475A - 印刷电路板及用于制造该印刷电路板的方法 - Google Patents

印刷电路板及用于制造该印刷电路板的方法 Download PDF

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Publication number
CN103124475A
CN103124475A CN2012104696709A CN201210469670A CN103124475A CN 103124475 A CN103124475 A CN 103124475A CN 2012104696709 A CN2012104696709 A CN 2012104696709A CN 201210469670 A CN201210469670 A CN 201210469670A CN 103124475 A CN103124475 A CN 103124475A
Authority
CN
China
Prior art keywords
pad
resist
circuit board
printed circuit
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104696709A
Other languages
English (en)
Chinese (zh)
Inventor
李东郁
吴华燮
曹淳镇
卢承贤
张容蕣
尹庆老
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN103124475A publication Critical patent/CN103124475A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN2012104696709A 2011-11-18 2012-11-19 印刷电路板及用于制造该印刷电路板的方法 Pending CN103124475A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110121041A KR20130055343A (ko) 2011-11-18 2011-11-18 인쇄회로기판 및 그의 제조방법
KR10-2011-0121041 2011-11-18

Publications (1)

Publication Number Publication Date
CN103124475A true CN103124475A (zh) 2013-05-29

Family

ID=48455273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104696709A Pending CN103124475A (zh) 2011-11-18 2012-11-19 印刷电路板及用于制造该印刷电路板的方法

Country Status (4)

Country Link
JP (1) JP2013110408A (ja)
KR (1) KR20130055343A (ja)
CN (1) CN103124475A (ja)
TW (1) TW201330728A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231755A (zh) * 2017-07-21 2017-10-03 维沃移动通信有限公司 一种柔性电路板及其制作方法、移动终端
CN107278028A (zh) * 2017-07-28 2017-10-20 维沃移动通信有限公司 一种柔性电路板及其制作方法和移动终端

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220133506A (ko) 2021-03-25 2022-10-05 스템코 주식회사 다층 기판 및 그 제조 방법, 및 다층 기판을 포함하는 전자 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290033A (zh) * 1999-08-26 2001-04-04 索尼化学株式会社 超声波发生装置、多层柔性电路板及其制造方法
TW200644754A (en) * 2005-06-03 2006-12-16 Adv Flexible Circuits Co Ltd PCB manufacture method of single copper clad double-sided conduction
TW201101950A (en) * 2009-04-09 2011-01-01 Atotech Deutschland Gmbh A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US20110101510A1 (en) * 2009-10-26 2011-05-05 Kyung-Ro Yoon Board on chip package substrate and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3243462B2 (ja) * 1999-09-01 2002-01-07 ソニーケミカル株式会社 多層基板の製造方法
JP2004179574A (ja) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd 配線基板用コア基板及びその製造方法、並びにそれを用いたビルドアップ配線基板
JP2006312265A (ja) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
JP2010123703A (ja) * 2008-11-19 2010-06-03 Furukawa Electric Co Ltd:The キャリア付きプリント配線基板およびその製造方法
JP2011071406A (ja) * 2009-09-28 2011-04-07 Mitsubishi Paper Mills Ltd 多段化樹脂構造体の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290033A (zh) * 1999-08-26 2001-04-04 索尼化学株式会社 超声波发生装置、多层柔性电路板及其制造方法
TW200644754A (en) * 2005-06-03 2006-12-16 Adv Flexible Circuits Co Ltd PCB manufacture method of single copper clad double-sided conduction
TW201101950A (en) * 2009-04-09 2011-01-01 Atotech Deutschland Gmbh A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US20110101510A1 (en) * 2009-10-26 2011-05-05 Kyung-Ro Yoon Board on chip package substrate and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231755A (zh) * 2017-07-21 2017-10-03 维沃移动通信有限公司 一种柔性电路板及其制作方法、移动终端
CN107278028A (zh) * 2017-07-28 2017-10-20 维沃移动通信有限公司 一种柔性电路板及其制作方法和移动终端

Also Published As

Publication number Publication date
TW201330728A (zh) 2013-07-16
JP2013110408A (ja) 2013-06-06
KR20130055343A (ko) 2013-05-28

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130529