TW201330728A - 印刷電路板及其製造方法 - Google Patents

印刷電路板及其製造方法 Download PDF

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Publication number
TW201330728A
TW201330728A TW101142737A TW101142737A TW201330728A TW 201330728 A TW201330728 A TW 201330728A TW 101142737 A TW101142737 A TW 101142737A TW 101142737 A TW101142737 A TW 101142737A TW 201330728 A TW201330728 A TW 201330728A
Authority
TW
Taiwan
Prior art keywords
pad
layer
photoresist
printed circuit
circuit board
Prior art date
Application number
TW101142737A
Other languages
English (en)
Chinese (zh)
Inventor
Dong-Wook Lee
Hwa-Sub Oh
Soon-Jin Cho
Seung-Hyun Noh
Yong-Soon Jang
Kyoung-Ro Yoon
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201330728A publication Critical patent/TW201330728A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW101142737A 2011-11-18 2012-11-16 印刷電路板及其製造方法 TW201330728A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110121041A KR20130055343A (ko) 2011-11-18 2011-11-18 인쇄회로기판 및 그의 제조방법

Publications (1)

Publication Number Publication Date
TW201330728A true TW201330728A (zh) 2013-07-16

Family

ID=48455273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101142737A TW201330728A (zh) 2011-11-18 2012-11-16 印刷電路板及其製造方法

Country Status (4)

Country Link
JP (1) JP2013110408A (ja)
KR (1) KR20130055343A (ja)
CN (1) CN103124475A (ja)
TW (1) TW201330728A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231755A (zh) * 2017-07-21 2017-10-03 维沃移动通信有限公司 一种柔性电路板及其制作方法、移动终端
CN107278028A (zh) * 2017-07-28 2017-10-20 维沃移动通信有限公司 一种柔性电路板及其制作方法和移动终端
KR20220133506A (ko) 2021-03-25 2022-10-05 스템코 주식회사 다층 기판 및 그 제조 방법, 및 다층 기판을 포함하는 전자 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3243462B2 (ja) * 1999-09-01 2002-01-07 ソニーケミカル株式会社 多層基板の製造方法
US6583364B1 (en) * 1999-08-26 2003-06-24 Sony Chemicals Corp. Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
JP2004179574A (ja) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd 配線基板用コア基板及びその製造方法、並びにそれを用いたビルドアップ配線基板
JP2006312265A (ja) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
TW200644754A (en) * 2005-06-03 2006-12-16 Adv Flexible Circuits Co Ltd PCB manufacture method of single copper clad double-sided conduction
JP2010123703A (ja) * 2008-11-19 2010-06-03 Furukawa Electric Co Ltd:The キャリア付きプリント配線基板およびその製造方法
EP2240005A1 (en) * 2009-04-09 2010-10-13 ATOTECH Deutschland GmbH A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
JP2011071406A (ja) * 2009-09-28 2011-04-07 Mitsubishi Paper Mills Ltd 多段化樹脂構造体の形成方法
KR101089647B1 (ko) * 2009-10-26 2011-12-06 삼성전기주식회사 단층 패키지 기판 및 그 제조방법

Also Published As

Publication number Publication date
JP2013110408A (ja) 2013-06-06
CN103124475A (zh) 2013-05-29
KR20130055343A (ko) 2013-05-28

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