TW200644754A - PCB manufacture method of single copper clad double-sided conduction - Google Patents
PCB manufacture method of single copper clad double-sided conductionInfo
- Publication number
- TW200644754A TW200644754A TW094118473A TW94118473A TW200644754A TW 200644754 A TW200644754 A TW 200644754A TW 094118473 A TW094118473 A TW 094118473A TW 94118473 A TW94118473 A TW 94118473A TW 200644754 A TW200644754 A TW 200644754A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- coverlay
- layer
- pasted
- etching
- Prior art date
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A PCB manufacture method of single copper clad double-sided conduction is disclosed, first, paste a first coverlay including a preset opening on top of a copper layer, and laminate it to be a pasted copper coverlay. Then form an ink photoresist layer in the preset opening on the exposed region of the pasted copper coverlay. After baking the ink phtoresist layer, the photoresist layer forms a protection layer on both sides of the opening wall in the exposed copper region to prevent the etch by the etching liquid in the following steps, and stuff the preset opening. After coating the dry film, exposure developing, and etching, there are several etching regions on the pasted copper coverlay. After peeling off the dry film and the ink photoresist layer, a second coverlay is laminated on the bottom of the copper layer of the pasted copper coverlay after etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094118473A TW200644754A (en) | 2005-06-03 | 2005-06-03 | PCB manufacture method of single copper clad double-sided conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094118473A TW200644754A (en) | 2005-06-03 | 2005-06-03 | PCB manufacture method of single copper clad double-sided conduction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200644754A true TW200644754A (en) | 2006-12-16 |
| TWI319569B TWI319569B (en) | 2010-01-11 |
Family
ID=45073649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094118473A TW200644754A (en) | 2005-06-03 | 2005-06-03 | PCB manufacture method of single copper clad double-sided conduction |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200644754A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103124475A (en) * | 2011-11-18 | 2013-05-29 | 三星电机株式会社 | Printed circuit board and method for manufacturing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201334645A (en) * | 2012-02-09 | 2013-08-16 | Flexium Interconnect Inc | Multi-layer flexible printed circuit board without having to pre-punch outer copper clad layer and its manufacturing method |
| CN109302802B (en) * | 2018-12-03 | 2019-12-03 | 深圳市博敏电子有限公司 | A kind of manufacturing method exempted from V-cut and stamp hole and spell stepped groove wiring board more |
-
2005
- 2005-06-03 TW TW094118473A patent/TW200644754A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103124475A (en) * | 2011-11-18 | 2013-05-29 | 三星电机株式会社 | Printed circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI319569B (en) | 2010-01-11 |
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