TWI268749B - Method for manufacturing flex-rigid printed circuit board - Google Patents
Method for manufacturing flex-rigid printed circuit boardInfo
- Publication number
- TWI268749B TWI268749B TW094103271A TW94103271A TWI268749B TW I268749 B TWI268749 B TW I268749B TW 094103271 A TW094103271 A TW 094103271A TW 94103271 A TW94103271 A TW 94103271A TW I268749 B TWI268749 B TW I268749B
- Authority
- TW
- Taiwan
- Prior art keywords
- double
- prepreg
- circuit board
- sided ccl
- sided
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
This invention relates to a method for manufacturing a flex-rigid printed circuit board. The method comprises the steps of: first, laminating a second prepreg and a double-sided copper clad laminate (double-sided CCL) to a face or both faces of a flexible circuit board in certain order. The flexible circuit board has a section expecting to be exposed. In addition, the second prepreg has an opening and the double-sided CCL has a copper lid. The opening of the prepreg and the copper lid of the double-sided CCL are facing to the section of the flexible circuit board. Then, a circuit pattern is formed onto an outer copper foil of the double-sided CCL and the circuit pattern has a hollow section facing to the copper lid of the double-sided CCL for exposing a first prepreg of the double-sided CCL. Subsequently, apply a laser trimming to the first prepreg along the periphery of the hollow section so as to form a groove with a designated depth on the first prepreg. Last, perform an opening. treatment to the double-sided CCL for removing the trimmed first prepreg and the copper lid from the double-sided CCL; therefore, the section of the flexible circuit board is exposed. The method of the invention prevents the first prepreg from crush during the double-sided CCL and the flexible circuit board lamination.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094103271A TWI268749B (en) | 2005-02-02 | 2005-02-02 | Method for manufacturing flex-rigid printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094103271A TWI268749B (en) | 2005-02-02 | 2005-02-02 | Method for manufacturing flex-rigid printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200630006A TW200630006A (en) | 2006-08-16 |
TWI268749B true TWI268749B (en) | 2006-12-11 |
Family
ID=57809010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094103271A TWI268749B (en) | 2005-02-02 | 2005-02-02 | Method for manufacturing flex-rigid printed circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI268749B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI669036B (en) * | 2017-05-24 | 2019-08-11 | 大陸商慶鼎精密電子(淮安)有限公司 | Method for manufacturing rigid-flex printed circuit board |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102458055B (en) | 2010-10-20 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Manufacturing method for rigid-flexible circuit board |
TWI420999B (en) * | 2010-11-04 | 2013-12-21 | Zhen Ding Technology Co Ltd | Method for manufacturing rigid-flexible printed circuit board |
TWI477212B (en) * | 2013-01-24 | 2015-03-11 | Unimicron Technology Corp | Rigid and flexible composite circuit board and manufacturing metodh thereof |
CN103987207B (en) * | 2013-02-07 | 2017-03-01 | 欣兴电子股份有限公司 | Flexible and hard composite circuit board and manufacturing method thereof |
CN104470250A (en) * | 2013-09-25 | 2015-03-25 | 富葵精密组件(深圳)有限公司 | Manufacturing method for flexible and rigid combined circuit board |
-
2005
- 2005-02-02 TW TW094103271A patent/TWI268749B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI669036B (en) * | 2017-05-24 | 2019-08-11 | 大陸商慶鼎精密電子(淮安)有限公司 | Method for manufacturing rigid-flex printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
TW200630006A (en) | 2006-08-16 |
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