TW200742002A - Method of fabricating substrate with embedded component therein - Google Patents

Method of fabricating substrate with embedded component therein

Info

Publication number
TW200742002A
TW200742002A TW095113896A TW95113896A TW200742002A TW 200742002 A TW200742002 A TW 200742002A TW 095113896 A TW095113896 A TW 095113896A TW 95113896 A TW95113896 A TW 95113896A TW 200742002 A TW200742002 A TW 200742002A
Authority
TW
Taiwan
Prior art keywords
embedded component
supporting board
dielectric layer
circuit layer
fabricating substrate
Prior art date
Application number
TW095113896A
Other languages
Chinese (zh)
Other versions
TWI298941B (en
Inventor
Chien-Hao Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW95113896A priority Critical patent/TWI298941B/en
Publication of TW200742002A publication Critical patent/TW200742002A/en
Application granted granted Critical
Publication of TWI298941B publication Critical patent/TWI298941B/en

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method of fabricating a substrate with an embedded component therein including following steps is provided. First, the embedded component and a supporting board are provided, wherein the embedded component is disposed on a surface of the supporting board, and the embedded component has at least an electrode. Next, a first dielectric layer is formed on the surface of the supporting board. The first dielectric layer has a first surface and a second surface opposite to the first surface, and the embedded component is exposed from the first dielectric layer. Then, the supporting board is removed. Thereafter, a first circuit layer and a second circuit layer are respectively formed on the first surface and the second surface of the dielectric layer by applying digital inkjet printing technology. The first circuit layer and the second circuit layer are electrically connected with the electrode.
TW95113896A 2006-04-19 2006-04-19 Method of fabricating substrate with embedded component therein TWI298941B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95113896A TWI298941B (en) 2006-04-19 2006-04-19 Method of fabricating substrate with embedded component therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95113896A TWI298941B (en) 2006-04-19 2006-04-19 Method of fabricating substrate with embedded component therein

Publications (2)

Publication Number Publication Date
TW200742002A true TW200742002A (en) 2007-11-01
TWI298941B TWI298941B (en) 2008-07-11

Family

ID=45069541

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95113896A TWI298941B (en) 2006-04-19 2006-04-19 Method of fabricating substrate with embedded component therein

Country Status (1)

Country Link
TW (1) TWI298941B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672079B (en) * 2018-03-20 2019-09-11 欣興電子股份有限公司 Embedded component structure and manufacturing method thereof
CN113950190A (en) * 2020-07-15 2022-01-18 欣兴电子股份有限公司 Embedded assembly structure and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010024233A1 (en) 2008-08-27 2012-01-26 日本電気株式会社 Wiring board capable of incorporating functional elements and method for manufacturing the same
CN103929895A (en) * 2013-01-15 2014-07-16 宏启胜精密电子(秦皇岛)有限公司 Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672079B (en) * 2018-03-20 2019-09-11 欣興電子股份有限公司 Embedded component structure and manufacturing method thereof
CN113950190A (en) * 2020-07-15 2022-01-18 欣兴电子股份有限公司 Embedded assembly structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI298941B (en) 2008-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees