CN103124475A - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

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Publication number
CN103124475A
CN103124475A CN2012104696709A CN201210469670A CN103124475A CN 103124475 A CN103124475 A CN 103124475A CN 2012104696709 A CN2012104696709 A CN 2012104696709A CN 201210469670 A CN201210469670 A CN 201210469670A CN 103124475 A CN103124475 A CN 103124475A
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CN
China
Prior art keywords
pad
resist
circuit board
printed circuit
pcb
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Pending
Application number
CN2012104696709A
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Chinese (zh)
Inventor
李东郁
吴华燮
曹淳镇
卢承贤
张容蕣
尹庆老
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN103124475A publication Critical patent/CN103124475A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The present invention relates to a printed circuit board and a method for manufacturing the same. The method comprises the steps of forming a carrier on one surface of a metal layer; forming a first slushing compound on the other surface of the metal layer to provide a first pad formation region; removing the carrier; forming a pattern on the metal layer to form a metal pattern layer; and forming a second slushing compound on the surface of the metal pattern layer, which is opposite to the surface on which the first slushing compound is formed, to provide a second pad formation region. The method enables the high density interlayer connection to be realized and the manufacture cost to be reduced.

Description

Printed circuit board (PCB) reaches the method for the manufacture of this printed circuit board (PCB)
The cross reference of related application
By coming prescription and combination with reference to following domestic priority application and external priority application:
" cross reference of related application "
The 35th piece of the 119th joint of United States code, the application requires the rights and interests of the korean patent application sequence number No.10-2011-0121041 of submission on November 18th, 2011, and its integral body is attached in the application by quoting as proof.
Technical field
The present invention relates to a kind of printed circuit board (PCB) and for the manufacture of the method for this printed circuit board (PCB), more particularly, relate to a kind of like this printed circuit board (PCB) and for the manufacture of the method for this printed circuit board (PCB): it can realize that the high density intermediate layer connects and reduces manufacturing cost.
Background technology
At present, due to the progress of electronic device and product, the integrated development that obtained of the miniaturization of electronic device and product and technology.In addition, integrated in response to miniaturization and technology, also need to be used in the multiple variation of the manufacturing process of the printed circuit board (PCB) in electronic device and product.
Stage is developed to double-sided printed and is developed to again multilayer board from one-sided printed circuit board (PCB) in the early stage for the manufacture of the technique direction of the method for printed circuit board (PCB).Especially recent, when making multilayer board, developing a kind of manufacture method that is called as Layer increasing method (build-up method).
Simultaneously, in the manufacturing process of printed circuit board (PCB), need to form the technique such as the multiple through hole of inner via hole (IVH), blind via hole (BVH) and plated-through-hole (PTH), be electrically connected to form between the circuit pattern of every layer and electronic component.In the prior art, make printed circuit board (PCB) by following steps: form through hole in the bottom substrate; Carry out plating on a surface (inside that comprises through hole) of bottom substrate, be electrically connected to form between layer; And use dry film to form the circuit pattern that comprises pad (pad) on this surface of bottom substrate.
But, need the high density intermediate layer to connect, with in response to the high density of substrate and the demand of thinning, yet when making printed circuit board (PCB) according to prior art, due to the plural metal level of needs, therefore the high density intermediate layer is connected and caused restriction.
In addition, because the inside that forms through hole and plating through hole is absolutely necessary with the technique that forms the intermediate layer electrical connection, so the manufacturing process complexity of printed circuit board (PCB) and manufacturing cost increase.
Summary of the invention
Invention the present invention is to overcome the problems referred to above, therefore, one object of the present invention is to provide a kind of like this printed circuit board (PCB): this printed circuit board (PCB) can not realized high density and thinning in the situation that have through hole that pad is connected directly to metal pattern layer with the structure that forms the intermediate layer electrical connection by adopting.
Another object of the present invention is to provide a kind of like this method for the manufacture of printed circuit board (PCB): the method can be in the situation that do not form the technique of the inside of the technique of through hole or plating through hole and be electrically connected and fetch simplified manufacturing technique and therefore reduce manufacturing cost to form the intermediate layer by pad being connected directly to metal pattern layer.
According to an aspect be used to realizing this purpose of the present invention, a kind of method for the manufacture of printed circuit board (PCB) is provided, comprise the following steps: form carrier on a surface of metal level; Provide the first pad to form the zone by form the first resist (resist) on another surface of metal level; Remove carrier; Form metal pattern layer by form pattern on metal level; And form the second resist on the apparent surface on the surface by being formed with the first resist on its of metal pattern layer and the second pad is set forms the zone.
In addition, the method for the manufacture of printed circuit board (PCB) also can comprise the following steps: form the first pad in the first pad forms the zone; And in forming the zone, the second pad forms the second pad.
And the step that provides the first pad to form the zone can comprise the following steps: the first resist is applied on another surface of metal level; And expose (open opens) first pad by a part of removing the first resist and form the zone.
In addition, the step that provides the second pad to form the zone can comprise the following steps: the second resist is applied on the apparent surface on the surface that is formed with the first resist on its of metal pattern layer; And expose the second pad by a part of removing the second resist and form the zone.
In addition, can comprise the following steps by the step that forms metal pattern layer at formation pattern on metal level: apply thin layer on a surface at metal level; Optionally remove thin layer; And form metal pattern layer by the metal level of removing in the zone of having removed thin layer.
In addition, optionally remove the alternative exposure of step, development and the stripping film layer of thin layer.
In addition, can comprise the following steps by the step that forms metal pattern layer at formation pattern on metal level: apply thin layer on a surface at metal level; Optionally remove thin layer; Form coating layer in the zone of removing thin layer; Remove remaining thin layer; And form metal pattern layer by removing the metal level corresponding with remaining thin layer.
And, optionally remove the step alternative of thin layer and expose, develop and the stripping film layer.
At this moment, can form roughness on the mating surface of the metal pattern layer of the contact surface of the first resist and metal pattern layer.
In addition, the first pad can be the pad that convexes to form that is used to form projection (bump), and the second pad can be the wire bond pad for installing electronic elements.
In addition, the thickness of the first resist can be greater than the thickness of the second resist.
Simultaneously, provide a kind of printed circuit board (PCB) according to of the present invention be used to realizing this purpose on the other hand, having comprised: metal pattern layer forms by form pattern on metal level; Resist is applied on metal pattern layer, forms the zone with exposed pad; And pad, be formed on pad and form in the zone.
At this moment, resist can comprise: the second resist, be applied on a surface of metal pattern layer, and form the zone to expose the second pad; And first resist, be applied on another surface of metal pattern layer, form the zone to expose the first pad.
And metal pattern layer can form to form pattern by a part of removing metal level.
In addition, the part that metal pattern layer can be by removing metal level forms coating layer and forms to form pattern and form thereon on figuratum metal level.
In addition, pad can comprise: the first pad is formed on the first pad and forms in the zone; And second pad, be formed on the second pad and form in the zone.
At this, the first pad can be used to form projection convex to form pad, and the second pad can be that toe-in for installing electronic elements closes pad.
In addition, roughness can be formed on the mating surface of metal pattern layer of contact surface of the first resist and metal pattern layer.
In addition, the thickness of the first resist can be greater than the thickness of the second resist.
Description of drawings
From the following description of the accompanying drawings of embodiments, these and/or other aspect and the advantage of this total inventive concept will become obviously and be more readily understood, wherein:
Fig. 1 is the cross-sectional view according to the printed circuit board (PCB) of one embodiment of the invention;
Fig. 2 is the cross-sectional view of printed circuit board (PCB) according to another embodiment of the present invention;
Fig. 3 to Figure 11 is the cross-sectional view that shows according to the technique of the manufacturing printed circuit board (PCB) of one embodiment of the invention, wherein
Fig. 3 shows the cross-sectional view that carrier is applied to a lip-deep state of metal level,
Fig. 4 shows the cross-sectional view that the first resist is applied to another lip-deep state of metal level,
Fig. 5 shows the cross-sectional view that the first pad wherein forms the first resist that exposes in the zone,
Fig. 6 is the cross-sectional view that shows the state of removing carrier,
Fig. 7 shows the cross-sectional view that the thin layer that will remove a part is applied to a lip-deep state of metal level,
Fig. 8 shows the cross-sectional view that forms the state of metal pattern layer by removing metal level in the zone removed thin layer,
Fig. 9 is the cross-sectional view that shows the state of removing thin layer,
Figure 10 shows the cross-sectional view that the second resist is applied to the state on the apparent surface on the surface that is formed with the first resist on its of metal pattern layer, and
Figure 11 shows the cross-sectional view that forms the first pad and form the state of the second pad in the first pad forms the zone in the second pad forms the zone; And
Figure 12 to Figure 20 is the cross-sectional view that shows the technique of manufacturing printed circuit board (PCB) according to another embodiment of the present invention, wherein
Figure 12 shows the cross-sectional view that carrier is applied to a lip-deep state of metal level,
Figure 13 shows the cross-sectional view that the first resist is applied to another lip-deep state of metal level,
Figure 14 shows the cross-sectional view that the first pad wherein forms the first resist that exposes in the zone,
Figure 15 is the cross-sectional view that shows the state of removing carrier,
Figure 16 shows the cross-sectional view that the thin layer that will remove a part is applied to a lip-deep state of metal level,
Figure 17 shows the cross-sectional view that forms the state of coating layer in the zone of this part of removing thin layer,
Figure 18 shows the cross-sectional view that forms the state of metal pattern layer by removing remaining thin layer and the metal level corresponding with remaining thin layer,
Figure 19 shows the cross-sectional view that the second resist is applied to the state on the apparent surface on the surface that is formed with the first resist on its of metal pattern layer, and
Figure 20 shows the cross-sectional view that forms the first pad and form the state of the second pad in the first pad forms the zone in the second pad forms the zone.
Embodiment
The term and the word that use in the present specification and claims should not be construed as limited to typical meaning or lexical meaning, but should be interpreted as having meaning and the concept relevant to technical spirit of the present invention based on such rule: according to this rule, the inventor can suitably define the concept of term, in order in best mode, his/her invention of self is described.
Therefore, the structure shown in embodiments of the invention and accompanying drawing is only have most the example of exemplary embodiment and do not represent all technical spirits of the present invention.Therefore, will be appreciated that when submitting the application to, the multiple equivalent and the modification that replace these structures can be arranged.
Hereinafter, embodiments of the present invention is described in detail in connection with accompanying drawing.
Fig. 1 is the cross-sectional view according to the printed circuit board (PCB) of one embodiment of the invention.
As shown in Figure 1, printed circuit board (PCB) 100 comprises metal pattern layer 120, resist 140 and pad 160.
It is by form the device that pattern forms on metal level 122 for metal pattern layer 120() can be made by metal material, such as copper (Cu), silver (Ag), gold (Au), aluminium (Al), iron (Fe), titanium (Ti), tin (Sn), nickel (Ni) or molybdenum (Mo).
Metal pattern layer 120 can have the structure that forms pattern by removing a part of metal level 122, and the thickness of metal pattern layer can be different according to the difficulty that forms circuit.Usually, the thickness of metal pattern layer 120 can be 2 μ m, 3 μ m, 5 μ m, 12 μ m, 18 μ m etc., but can be different, is not limited to this.
At this, be only an example and can be applicable to different printed circuit board (PCB)s as the structure of the printed circuit board (PCB) in Fig. 1, and can use equally the technical characterictic of the present invention that the following describes.
Resist 140 is applied on metal pattern layer 120 and forms the zone with exposed pad, and can comprise upper the first resist 142 of regional A that forms to expose the first pad in another surface that forms the second resist 144 of regional B and be applied to metal pattern layer 120 to expose the second pad on a surface that is applied to metal pattern layer 120.
In addition, roughness can be formed on the mating surface of the metal pattern layer 120 in the contact surface of the first resist 142 and metal pattern layer 120, to strengthen the adhesion between metal pattern layer 120 and resist 140.
Resist 140 can be photocuring/thermosetting resin, normally solder resist.
At this, solder resist (it is a kind of insulation permanent coating material) is a kind of like this film: this film covering metal patterned layer 120, the accident that welding was caused of carrying out when preventing due to installing electronic elements connects.In addition, because solder resist covering metal patterned layer 120 is also protected except the remainder outside the required pad of soldering of electronic components (that is, the part of electronic component being installed), so solder resist is called as solder mask.Solder resist prevents short circuit, burn into and the pollution of printed circuit board (PCB), and remains on substrate as film after the manufacturing of printed circuit board (PCB), avoids the effect of external impact, moisture and chemicals impact to play protective circuit.
It is formed in pad 160(pad and forms a kind of device in the zone) can comprise that being formed on the first pad forms the first pad 162 in regional A and be formed on the second pad and form the second pad 164 in regional B.
At this, the first pad 162 is the pads that convex to form that are used to form projection, and the second pad 164 is the wire bond pad for installing electronic elements.For this reason, the thickness of the first resist 142 can be configured to the thickness greater than the second resist 144.
That is to say, owing to being formed with projection on the first pad 162, the thickness of the first resist 142 can increase in response to size, thickness and the area of projection and relatively greater than the thickness of the second resist 144 of the second pad that is combined with lead-in wire.If projection is soldered ball, according to the diameter of soldered ball, the first resist 142 can have the multi-thickness from minimum value 5 μ m to maximum 50 μ m.
Like this, because the thickness of resist can be adjusted according to the type that is formed on the projection on pad, therefore can stably obtain the adhesion between pad and projection and reliable printed circuit board (PCB) is provided.
In a word, in the situation that do not have through hole that pad is connected directly to the structure that metal pattern layer is electrically connected to form the intermediate layer, therefore can realize high density and thinning by implementing printed circuit board (PCB) with individual layer owing to adopting according to the printed circuit board (PCB) of one embodiment of the invention.
Fig. 2 is the cross-sectional view of printed circuit board (PCB) according to another embodiment of the present invention.
At this, except metal pattern layer, another embodiment of the present invention has the technical construction identical with according to the abovementioned embodiments of the present invention printed circuit board (PCB), and provides identical reference number for identical technical construction.
As shown in Figure 2, printed circuit board (PCB) 100 comprises metal pattern layer 120, resist 140 and pad 160.
In addition, the part that metal pattern layer 120 can be by removing metal level 122 forms coating layer 124 and forms to form pattern and form thereon on figuratum metal level 122.At this moment, metal level 122 according to another embodiment of the present invention can be configured to form of film, to have beguine according to the little thickness of the metal level 122 of one embodiment of the invention.
Metal pattern layer 120 can be made by metal material, such as copper (Cu), silver (Ag), gold (Au), aluminium (Al), iron (Fe), titanium (Ti), tin (Sn), nickel (Ni) or molybdenum (Mo).
Resist 140 is applied on metal pattern layer 120 and forms the zone with exposed pad, and can comprise upper the first resist 142 of regional A that forms to expose the first pad in another surface that forms the second resist 144 of regional B and be applied to metal pattern layer 120 to expose the second pad on a surface that is applied to metal pattern layer 120.
In addition, roughness can be formed on the mating surface of the metal pattern layer 120 in the contact surface of the first resist 142 and metal pattern layer 120, to strengthen the adhesion between metal pattern layer 120 and resist 140.
It is formed in pad 160(pad and forms a kind of device in the zone) can comprise that being formed on the first pad forms the first pad 162 in regional A and be formed on the second pad and form the second pad 164 in regional B.
At this, the first pad 162 is the pads that convex to form that are used to form projection, and the second pad 164 is the wire bond pad for installing electronic elements.For this reason, the thickness of the first resist 142 can be configured to the thickness greater than the second resist 144.
That is to say, owing to being formed with projection on the first pad 162, the thickness of the first resist 142 can increase in response to size, thickness and the area of projection and relatively greater than the thickness of the second resist 144 of the second pad that is combined with lead-in wire.If projection is soldered ball, according to the diameter of soldered ball, the first resist 142 can have the multi-thickness from minimum value 5 μ m to maximum 50 μ m.
Hereinafter, will the technique according to the manufacturing printed circuit board (PCB) of one embodiment of the invention be described.
Fig. 3 to Figure 11 is the cross-sectional view that shows according to the technique of the manufacturing printed circuit board (PCB) of one embodiment of the invention.
As shown in Figure 3, form carrier 110 on a surface of metal level 122.At this moment, it is a kind of device of supporting printing board 100 for metal level 122() can be made by metal material, such as copper (Cu), silver (Ag), gold (Au), aluminium (Al), iron (Fe), titanium (Ti), tin (Sn), nickel (Ni) or molybdenum (Mo).
In addition, can adopt any one in sputtering method, attachment method and plating method to apply metal level 122 on a surface of carrier 100.
At this, sputtering method is a kind of technology that makes film be attached to a surface of object, and can use when vaporizing solid forms film and thick film under high vacuum state, in order to form electronic circuit with pottery or semi-conducting material.
More particularly, sputtering method is also referred to as sputtering sedimentation, and can form film by a surface that makes atom, thin-film material be attached to object.That is to say, when by electric field acceleration ionized atom (Ar) when bumping against with thin-film material, the atom of thin-film material flows out and is attached to a surface of object by collision, with the formation film.Except sputtering sedimentation, can use several different methods to form metal level, such as the thin film deposition of using evaporation.For depositing metal layers, use the thin film deposition of evaporation in high vacuum (5 * 10 -5~ 1 * 10 -7Holder) heat boat with electron beam or electric filament under, with metal and the evaporated metal on the fusing boat.At this moment, the metal of evaporation condenses on the cold surface of object, to form film.
In addition, attachment method is a kind ofly to make the method that is attached to carrier 110 such as the metal level 122 of Copper Foil, and plating method is a kind of method of using hot-dip or electroplating plating on carrier 110.
The thickness of metal level 122 can be different according to the difficulty that forms circuit.Usually, the thickness of metal level can be 2 μ m, 3 μ m, 5 μ m, 12 μ m, 18 μ m, but can be different, is not limited to this.
And carrier 110 can be made by metal material, and the thickness of carrier can be about 20 μ m to 50 μ m usually.
Then, form the first resist 142 on another surface of metal level 122, form regional A so that the first pad to be provided.More specifically, as shown in Figure 4 and Figure 5, the first resist 142 is applied on another surface of metal level 122, and removes the part of the first resist 142, form regional A to expose the first pad.Use exposure, development and stripping technology to remove this part of the first resist 142.
In addition, can be by multiple laser (such as ultraviolet (UV) laser or carbon dioxide (CO 2) laser) remove this part of the first resist 142.
Then, as shown in Figure 6, remove carrier 110.
Then, as shown in Figure 7, apply thin layer 130 and optionally remove on a surface of metal level 122.At this moment, can expose, develop and stripping technology, optionally removing thin layer 130, and can use multiple laser, such as UV laser or CO 2Laser.
In addition, thin layer 130 can be made by multiple light-sensitive material, and such as photoresist, photoresistance solder flux and dry film, but available multiple material replaces above-mentioned material, is not limited to this.
And, as Fig. 8 and shown in Figure 9, form metal pattern layer 120 by the metal level 122 of removing in the zone of having removed thin layer 130, and remove thin layer 130.
Then, as shown in figure 10, form the second resist 144 on the metal pattern layer 120 of removing thin layer 130, form regional B so that the second pad to be provided., the second resist 144 is applied on metal pattern layer 120 for this reason, and removes the part of the second resist 144, form regional B to expose the second pad.
Then, as shown in figure 11, form at the first pad and form the first pad 162 in regional A, and form formation the second pad 164 in regional B at the second pad.At this, the first pad 162 is the pads that convex to form that are used to form projection, and the second pad 164 is the wire bond pad for installing electronic elements.For this reason, the thickness of the first resist 142 can be configured to the thickness greater than the second resist 144.
That is to say, owing to forming projection on the first pad 162, the thickness of the first resist 142 can increase in response to size, thickness and the area of projection and relatively greater than the thickness of the second resist 144 of the second pad that is combined with lead-in wire.If projection is soldered ball, according to the diameter of soldered ball, the first resist 142 can have the multi-thickness from minimum value 5 μ m to maximum 50 μ m.
Like this, because the thickness of resist can be adjusted according to the type that is formed on the projection on pad, therefore can stably obtain the adhesion between pad and projection and reliable printed circuit board (PCB) is provided.
Hereinafter, will the technique of according to another embodiment of the present invention manufacturing printed circuit board (PCB) be described.
Figure 12 to Figure 20 is the cross-sectional view that shows the technique of making according to another embodiment of the present invention printed circuit board (PCB).
At this, another embodiment of the present invention has the technical construction identical with according to the abovementioned embodiments of the present invention the method for the manufacture of printed circuit board (PCB), and provides identical reference number for identical technical construction.
As shown in figure 12, apply carrier 110 on a surface of metal level 122.At this moment, it is a kind of device of supporting printing board 100 for metal level 122() can be made by metal material, such as copper (Cu), silver (Ag), gold (Au), aluminium (Al), iron (Fe), titanium (Ti), tin (Sn), nickel (Ni) or molybdenum (Mo).
At this moment, metal level 122 according to another embodiment of the present invention is configured to form of film, to have beguine according to the little thickness of the metal level 122 of one embodiment of the invention.
In addition, can adopt any one in sputtering method, attachment method and plating method to apply metal level 122 on a surface of carrier 100.
At this, sputtering method is a kind of technology that makes film be attached to a surface of object, and can use when vaporizing solid forms film and thick film under high vacuum state, in order to form electronic circuit with pottery or semi-conducting material.
In addition, attachment method is a kind ofly to make the method that is attached to carrier 110 such as the metal level 122 of Copper Foil, and plating method is a kind of method of using hot-dip or electroplating plating on carrier 110.
The thickness of metal level 122 can be different according to the difficulty that forms circuit.Usually, metal level 122(its have form of film) can have beguine according to the little thickness of the metal level 122 of one embodiment of the invention.
And carrier 110 can be made by metal material, and the thickness of carrier can be about 20 μ m to 50 μ m usually.
Then, form the first resist 142 on another surface of metal level 122, form regional A so that the first pad to be provided.More specifically, as Figure 13 and shown in Figure 14, the first resist 142 is applied on another surface of metal level 122, and removes the part of the first resist 142, form regional A to expose the first pad.Use exposure, development and stripping technology to remove this part of the first resist 142.
In addition, can be by multiple laser (such as UV laser or CO 2Laser) remove this part of the first resist 142.
Then, as shown in figure 15, remove carrier 110.
Then, as shown in figure 16, apply thin layer 130 and remove the part of thin layer 130 on a surface of metal level 122.At this moment, can expose, develop and stripping technology, with this part of removal thin layer 130, and can use multiple laser, such as UV laser or CO 2Laser.
In addition, thin layer 130 can be made by multiple light-sensitive material, and such as photoresist, photoresistance solder flux and dry film, but available multiple material replaces above-mentioned material, is not limited to this.
And, as shown in Figure 17 and Figure 18, by form coating layer 124 in the zone of this part of removing thin layer 130 and remove remaining thin layer 130 and the metal level 122(corresponding with the remaining area of thin layer 130 namely, metal level 122 below remaining thin layer 130) form metal pattern layer 120, and remove thin layer 130.
Then, as shown in figure 19, form the second resist 144 on the metal pattern layer 120 of removing thin layer 130, form regional B so that the second pad to be provided., the second resist 144 is applied on the metal pattern layer 120 of removing thin layer 130 for this reason, and removes the part of the second resist 144, form regional B to expose the second pad.
Then, as shown in figure 20, form at the first pad and form the first pad 162 in regional A, and form formation the second pad 164 in regional B at the second pad.At this, the first pad 162 is the pads that convex to form that are used to form projection, and the second pad 164 is the wire bond pad for installing electronic elements.For this reason, the thickness of the first resist 142 can be configured to the thickness greater than the second resist 144.
That is to say, owing to forming projection on the first pad 162, the thickness of the first resist 142 can increase in response to size, thickness and the area of projection and relatively greater than the thickness of the second resist 144 of the second pad that is combined with lead-in wire.If projection is soldered ball, according to the diameter of soldered ball, the first resist 142 can have the multi-thickness from minimum value 5 μ m to maximum 50 μ m.
Simultaneously, the method for the manufacture of printed circuit board (PCB) according to the present invention can be applicable to all subtractive process, addition process, masking method and semi-additive process.
In a word, according to the method for the manufacture of printed circuit board (PCB) of the present invention can in the situation that the technique of inside that does not form through hole or plating through hole by pad being connected directly to metal pattern layer to form the intermediate layer and be electrically connected to simplified manufacturing technique and therefore reduce manufacturing cost.
As mentioned above, according to according to the printed circuit board (PCB) of one embodiment of the invention with for the manufacture of the method for this printed circuit board (PCB), can be by adopting do not realize high density and thinning in the situation that have through hole that pad is connected directly to metal pattern layer with the structure that forms the intermediate layer and be electrically connected to.That is to say, owing to two-layer at least traditional printing circuit board can being embodied as single layer structure, therefore can realize high density intermediate layer connection.
In addition, minimize because printed circuit board (PCB) can make the loss of signal, and can improve signaling rate.
And, due to the technique of the inside that does not need to form through hole or plating through hole, but therefore simplified manufacturing technique, and therefore lower manufacturing cost.
In addition, can be by replacing physical technology with photocuring/thermosetting resist.
For this reason, can guarantee to have the reliability of the whole product of printed circuit board (PCB).
Foregoing description illustrates the present invention.In addition, foregoing description only illustrates and has illustrated the preferred embodiments of the present invention, but, be understood that, corresponding with the skills or knowledge of above-mentioned instruction and/or prior art, in the scope of conceiving as the present invention who explains herein, the present invention can be used in multiple other combinations, modification and environment, and can have variation and revise.Above-described embodiment also is intended to explanation and puts into practice known optimal mode of the present invention, and makes those skilled in the art the present invention can be used in these or other embodiment and have application-specific or the required multiple modification of purposes of the present invention.Therefore, this description is not to be intended to limit the invention to form disclosed herein.And, be intended to appended claims are interpreted as comprising alternate embodiment.

Claims (21)

1. method for the manufacture of printed circuit board (PCB) comprises:
Form carrier on a surface of metal level;
Provide the first pad to form the zone by form the first resist on another surface of described metal level;
Remove described carrier;
Form metal pattern layer by form pattern on described metal level; And
Forming the second resist on the apparent surface on the surface by being formed with described the first resist on its of described metal pattern layer provides the second pad to form the zone.
2. the method for the manufacture of printed circuit board (PCB) according to claim 1 also comprises:
In forming the zone, described the first pad forms the first pad; And
In forming the zone, described the second pad forms the second pad.
3. the method for the manufacture of printed circuit board (PCB) according to claim 1 wherein, provides described the first pad to form the zone and comprises:
Described the first resist is applied on described another surface of described metal level; And
Expose described the first pad by a part of removing described the first resist and form the zone.
4. the method for the manufacture of printed circuit board (PCB) according to claim 1 wherein, provides described the second pad to form the zone and comprises:
Described the second resist is applied on the apparent surface on the surface that is formed with described the first resist on its of described metal pattern layer; And
Expose described the second pad by a part of removing described the second resist and form the zone.
5. the method for the manufacture of printed circuit board (PCB) according to claim 1 wherein, forms described metal pattern layer and comprises by form described pattern on described metal level:
Apply thin layer on a surface of described metal level;
Optionally remove described thin layer; And
Form described metal pattern layer by the described metal level of removing in the zone of having removed described thin layer.
6. the method for the manufacture of printed circuit board (PCB) according to claim 5, wherein, optionally remove described thin layer and optionally expose, develop and peel off described thin layer.
7. the method for the manufacture of printed circuit board (PCB) according to claim 1 wherein, forms described metal pattern layer and comprises by form described pattern on described metal level:
Apply thin layer on a surface of described metal level;
Optionally remove described thin layer;
Form coating layer in the zone of removing described thin layer;
Remove remaining thin layer; And
Form described metal pattern layer by removing the described metal level corresponding with described remaining thin layer.
8. the method for the manufacture of printed circuit board (PCB) according to claim 7, wherein, optionally remove described thin layer and optionally expose, develop and peel off described thin layer.
9. the method for the manufacture of printed circuit board (PCB) according to claim 1, wherein, form roughness on the mating surface of the described metal pattern layer in the contact surface of described the first resist and described metal pattern layer.
10. the method for the manufacture of printed circuit board (PCB) according to claim 2, wherein, described the first pad is the pad that convexes to form that is used to form projection.
11. the method for the manufacture of printed circuit board (PCB) according to claim 2, wherein, described the second pad is the wire bond pad for installing electronic elements.
12. the method for the manufacture of printed circuit board (PCB) according to claim 1, wherein, the thickness of described the first resist is greater than the thickness of described the second resist.
13. a printed circuit board (PCB) comprises:
Metal pattern layer forms by form pattern on metal level;
Resist is applied on described metal pattern layer, forms the zone with exposed pad; And
Pad is formed on described pad and forms in the zone.
14. printed circuit board (PCB) according to claim 13, wherein, described resist comprises:
The second resist is applied on a surface of described metal pattern layer, forms the zone to expose described the second pad; And
The first resist is applied on another surface of described metal pattern layer, forms the zone to expose described the first pad.
15. printed circuit board (PCB) according to claim 13, wherein, described metal pattern layer forms to form described pattern by a part of removing described metal level.
16. printed circuit board (PCB) according to claim 13, wherein, the part of described metal pattern layer by removing described metal level forms coating layer on the described metal level of described pattern and forms to form described pattern and to be formed with thereon.
17. printed circuit board (PCB) according to claim 14, wherein, described pad comprises:
The first pad is formed on described the first pad and forms in the zone; And
The second pad is formed on described the second pad and forms in the zone.
18. printed circuit board (PCB) according to claim 17, wherein, described the first pad is the pad that convexes to form that is used to form projection.
19. printed circuit board (PCB) according to claim 17, wherein, described the second pad is the wire bond pad for installing electronic elements.
20. printed circuit board (PCB) according to claim 13, wherein, roughness is formed on the mating surface of the described metal pattern layer in the contact surface of described the first resist and described metal pattern layer.
21. printed circuit board (PCB) according to claim 14, wherein, the thickness of described the first resist is greater than the thickness of described the second resist.
CN2012104696709A 2011-11-18 2012-11-19 Printed circuit board and method for manufacturing the same Pending CN103124475A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231755A (en) * 2017-07-21 2017-10-03 维沃移动通信有限公司 A kind of flexible PCB and preparation method thereof, mobile terminal
CN107278028A (en) * 2017-07-28 2017-10-20 维沃移动通信有限公司 A kind of flexible PCB and preparation method thereof and mobile terminal

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220133506A (en) 2021-03-25 2022-10-05 스템코 주식회사 Multi-layer board and manufacturing method thereof, and electronic apparatus including the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290033A (en) * 1999-08-26 2001-04-04 索尼化学株式会社 Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof
TW200644754A (en) * 2005-06-03 2006-12-16 Adv Flexible Circuits Co Ltd PCB manufacture method of single copper clad double-sided conduction
TW201101950A (en) * 2009-04-09 2011-01-01 Atotech Deutschland Gmbh A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US20110101510A1 (en) * 2009-10-26 2011-05-05 Kyung-Ro Yoon Board on chip package substrate and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3243462B2 (en) * 1999-09-01 2002-01-07 ソニーケミカル株式会社 Method for manufacturing multilayer substrate
JP2004179574A (en) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd Core substrate for wiring boards, its manufacturing method, and build-up wiring board using the same
JP2006312265A (en) * 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk Extremely thin copper foil with carrier, printed wiring board using it and multilayered printed wiring board
JP2010123703A (en) * 2008-11-19 2010-06-03 Furukawa Electric Co Ltd:The Printed wiring board with carrier, and method of manufacturing the same
JP2011071406A (en) * 2009-09-28 2011-04-07 Mitsubishi Paper Mills Ltd Method of forming multistaged resin structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1290033A (en) * 1999-08-26 2001-04-04 索尼化学株式会社 Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof
TW200644754A (en) * 2005-06-03 2006-12-16 Adv Flexible Circuits Co Ltd PCB manufacture method of single copper clad double-sided conduction
TW201101950A (en) * 2009-04-09 2011-01-01 Atotech Deutschland Gmbh A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US20110101510A1 (en) * 2009-10-26 2011-05-05 Kyung-Ro Yoon Board on chip package substrate and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231755A (en) * 2017-07-21 2017-10-03 维沃移动通信有限公司 A kind of flexible PCB and preparation method thereof, mobile terminal
CN107278028A (en) * 2017-07-28 2017-10-20 维沃移动通信有限公司 A kind of flexible PCB and preparation method thereof and mobile terminal

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TW201330728A (en) 2013-07-16
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