CN103081105B - 图像拾取装置、图像拾取模块和照相机 - Google Patents

图像拾取装置、图像拾取模块和照相机 Download PDF

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Publication number
CN103081105B
CN103081105B CN201180040856.6A CN201180040856A CN103081105B CN 103081105 B CN103081105 B CN 103081105B CN 201180040856 A CN201180040856 A CN 201180040856A CN 103081105 B CN103081105 B CN 103081105B
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China
Prior art keywords
image pickup
semiconductor substrate
area
thickness
pickup element
Prior art date
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CN201180040856.6A
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English (en)
Chinese (zh)
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CN103081105A (zh
Inventor
长谷川真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication of CN103081105A publication Critical patent/CN103081105A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201180040856.6A 2010-08-23 2011-08-05 图像拾取装置、图像拾取模块和照相机 Active CN103081105B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010186070A JP2012044091A (ja) 2010-08-23 2010-08-23 撮像装置、撮像モジュール及びカメラ
JP2010-186070 2010-08-23
PCT/JP2011/004452 WO2012026074A1 (en) 2010-08-23 2011-08-05 Image pickup device, image pickup module, and camera

Publications (2)

Publication Number Publication Date
CN103081105A CN103081105A (zh) 2013-05-01
CN103081105B true CN103081105B (zh) 2016-02-10

Family

ID=45723098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180040856.6A Active CN103081105B (zh) 2010-08-23 2011-08-05 图像拾取装置、图像拾取模块和照相机

Country Status (4)

Country Link
US (1) US9111826B2 (https=)
JP (1) JP2012044091A (https=)
CN (1) CN103081105B (https=)
WO (1) WO2012026074A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229675A (ja) * 2012-04-24 2013-11-07 Sony Corp 撮像ユニット及び撮像装置
JP2014216476A (ja) * 2013-04-25 2014-11-17 凸版印刷株式会社 固体撮像装置及びその製造方法
US20140326856A1 (en) * 2013-05-06 2014-11-06 Omnivision Technologies, Inc. Integrated circuit stack with low profile contacts
US10186539B2 (en) * 2014-10-13 2019-01-22 Bio-Rad Laboratories, Inc. Heated image sensor window
CN105467638A (zh) * 2016-01-08 2016-04-06 豪威半导体（上海）有限责任公司 一种lcos结构及制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351997A (ja) * 2000-06-09 2001-12-21 Canon Inc 受光センサーの実装構造体およびその使用方法
US20070262381A1 (en) * 2006-05-11 2007-11-15 Olympus Corporation Semiconductor device and method of manufacturing the same
CN101325208A (zh) * 2007-06-15 2008-12-17 夏普株式会社 固态图像捕捉器件、其制造方法和电子信息器件
JP2009158863A (ja) * 2007-12-27 2009-07-16 Toshiba Corp 半導体パッケージ及びカメラモジュール

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Publication number Priority date Publication date Assignee Title
US6943423B2 (en) * 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
JP4198072B2 (ja) * 2004-01-23 2008-12-17 シャープ株式会社 半導体装置、光学装置用モジュール及び半導体装置の製造方法
JP2009099591A (ja) * 2007-10-12 2009-05-07 Toshiba Corp 固体撮像素子及びその製造方法
JP4799542B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ
JP5690466B2 (ja) * 2008-01-31 2015-03-25 インヴェンサス・コーポレイション 半導体チップパッケージの製造方法
JP5009209B2 (ja) * 2008-03-21 2012-08-22 シャープ株式会社 ウエハ状光学装置およびその製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュール、電子情報機器
JP5198150B2 (ja) * 2008-05-29 2013-05-15 株式会社東芝 固体撮像装置
JP5392458B2 (ja) 2008-08-21 2014-01-22 株式会社ザイキューブ 半導体イメージセンサ
JP2010067872A (ja) * 2008-09-12 2010-03-25 Nikon Corp パッケージ及びそれを用いた光電変換装置
JP5178569B2 (ja) * 2009-02-13 2013-04-10 株式会社東芝 固体撮像装置
US8355628B2 (en) * 2009-03-06 2013-01-15 Visera Technologies Company Limited Compact camera module
KR20100130423A (ko) * 2009-06-03 2010-12-13 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈
JP5709435B2 (ja) * 2010-08-23 2015-04-30 キヤノン株式会社 撮像モジュール及びカメラ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001351997A (ja) * 2000-06-09 2001-12-21 Canon Inc 受光センサーの実装構造体およびその使用方法
US20070262381A1 (en) * 2006-05-11 2007-11-15 Olympus Corporation Semiconductor device and method of manufacturing the same
CN101325208A (zh) * 2007-06-15 2008-12-17 夏普株式会社 固态图像捕捉器件、其制造方法和电子信息器件
JP2009158863A (ja) * 2007-12-27 2009-07-16 Toshiba Corp 半導体パッケージ及びカメラモジュール

Also Published As

Publication number Publication date
WO2012026074A1 (en) 2012-03-01
US9111826B2 (en) 2015-08-18
JP2012044091A (ja) 2012-03-01
CN103081105A (zh) 2013-05-01
US20130141626A1 (en) 2013-06-06

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