CN1226790C - Cmos图像传感器 - Google Patents
Cmos图像传感器 Download PDFInfo
- Publication number
- CN1226790C CN1226790C CNB021202958A CN02120295A CN1226790C CN 1226790 C CN1226790 C CN 1226790C CN B021202958 A CNB021202958 A CN B021202958A CN 02120295 A CN02120295 A CN 02120295A CN 1226790 C CN1226790 C CN 1226790C
- Authority
- CN
- China
- Prior art keywords
- image sensor
- cmos image
- signal processing
- processing circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 230000003287 optical effect Effects 0.000 claims description 19
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- 239000000758 substrate Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Steroid Compounds (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP164020/01 | 2001-05-31 | ||
JP2001164020 | 2001-05-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1389928A CN1389928A (zh) | 2003-01-08 |
CN1226790C true CN1226790C (zh) | 2005-11-09 |
Family
ID=19006887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021202958A Expired - Lifetime CN1226790C (zh) | 2001-05-31 | 2002-05-22 | Cmos图像传感器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6727487B2 (zh) |
EP (1) | EP1263055B1 (zh) |
KR (1) | KR100596104B1 (zh) |
CN (1) | CN1226790C (zh) |
AT (1) | ATE398337T1 (zh) |
DE (1) | DE60227027D1 (zh) |
TW (1) | TW540157B (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7323676B2 (en) * | 2001-09-11 | 2008-01-29 | Lumileds Lighting Us, Llc. | Color photosensor with color filters and subtraction unit |
US7662094B2 (en) | 2002-05-14 | 2010-02-16 | Given Imaging Ltd. | Optical head assembly with dome, and device for use thereof |
US6946715B2 (en) * | 2003-02-19 | 2005-09-20 | Micron Technology, Inc. | CMOS image sensor and method of fabrication |
US20040061799A1 (en) * | 2002-09-27 | 2004-04-01 | Konica Corporation | Image pickup device and portable terminal equipped therewith |
KR20060059873A (ko) * | 2003-08-22 | 2006-06-02 | 코니카 미놀타 옵토 인코포레이티드 | 고체 촬상 장치 및 상기 고체 촬상 장치를 구비한 촬상장치 및 고체 촬상 장치의 마이크로렌즈 어레이 제조 방법 |
FR2860644B1 (fr) * | 2003-10-06 | 2006-03-03 | St Microelectronics Sa | Composant, plaque et boitier semi-conducteur a capteur optique |
US7821564B2 (en) * | 2003-12-30 | 2010-10-26 | Given Imaging Ltd. | Assembly for aligning an optical system |
US7372497B2 (en) * | 2004-04-28 | 2008-05-13 | Taiwan Semiconductor Manufacturing Company | Effective method to improve sub-micron color filter sensitivity |
CN1969539A (zh) * | 2004-05-04 | 2007-05-23 | 德塞拉股份有限公司 | 紧凑透镜塔形组件 |
US20060109366A1 (en) * | 2004-05-04 | 2006-05-25 | Tessera, Inc. | Compact lens turret assembly |
JP2005347416A (ja) * | 2004-06-01 | 2005-12-15 | Sharp Corp | 固体撮像装置、半導体ウエハ及びカメラモジュール |
KR100629679B1 (ko) | 2004-07-01 | 2006-09-29 | 삼성전자주식회사 | 열전 냉각 소자를 갖는 반도체 칩 패키지 |
DE202004011854U1 (de) * | 2004-07-28 | 2004-11-04 | Microelectronic Packaging Dresden Gmbh | Image-Modul |
US7645635B2 (en) * | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
US9320417B2 (en) | 2005-12-29 | 2016-04-26 | Given Imaging Ltd. | In-vivo optical imaging device with backscatter blocking |
KR100868630B1 (ko) * | 2006-12-11 | 2008-11-13 | 동부일렉트로닉스 주식회사 | 마이크로 렌즈 형성용 패턴 마스크, 이미지 센서 및 이의제조 방법 |
US20090283665A1 (en) * | 2008-05-13 | 2009-11-19 | Eastman Kodak Company | Image sensor with an aligned optical assembly |
JP5553707B2 (ja) * | 2009-08-21 | 2014-07-16 | 株式会社半導体エネルギー研究所 | 光検出装置 |
US8461567B2 (en) * | 2010-06-24 | 2013-06-11 | Nokia Corporation | Apparatus and method for sensing photons |
JP2014123014A (ja) * | 2012-12-21 | 2014-07-03 | Casio Comput Co Ltd | 光源装置、プロジェクタ |
US9917991B2 (en) * | 2014-10-24 | 2018-03-13 | Apple Inc. | Camera actuator |
TWI613478B (zh) * | 2016-09-12 | 2018-02-01 | 台睿精工股份有限公司 | 單鏡頭機械零傾角的調整方法 |
CN109115250A (zh) * | 2018-08-08 | 2019-01-01 | 珠海格力电器股份有限公司 | 感光器件的阵列结构和光电编码器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5321249A (en) * | 1991-10-31 | 1994-06-14 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device and method of manufacturing the same |
KR950002410A (ko) * | 1993-06-30 | 1995-01-04 | 김광호 | 고체 촬상 장치 |
JPH10270672A (ja) * | 1997-03-25 | 1998-10-09 | Sony Corp | 固体撮像素子 |
EP0948059A1 (fr) * | 1998-02-05 | 1999-10-06 | Asulab S.A. | Moyens de positionnement pour un dispositif microélectronique et appareil de prise de vues muni d'un tel dispositif |
KR20000050478A (ko) * | 1999-01-11 | 2000-08-05 | 윤종용 | 고체 촬상 소자 이미지 센서 모듈 및 그 조립방법 |
US6137634A (en) * | 1999-02-01 | 2000-10-24 | Intel Corporation | Microlens array |
KR100359768B1 (ko) * | 1999-03-18 | 2002-11-07 | 주식회사 하이닉스반도체 | 고체 촬상 소자 및 그 제조방법 |
FR2798226B1 (fr) * | 1999-09-02 | 2002-04-05 | St Microelectronics Sa | Procede de mise en boitier d'une puce de semi-conducteur contenant des capteurs et boitier obtenu |
US6171885B1 (en) * | 1999-10-12 | 2001-01-09 | Taiwan Semiconductor Manufacturing Company | High efficiency color filter process for semiconductor array imaging devices |
JP3840058B2 (ja) * | 2000-04-07 | 2006-11-01 | キヤノン株式会社 | マイクロレンズ、固体撮像装置及びそれらの製造方法 |
US6395576B1 (en) * | 2000-06-14 | 2002-05-28 | Taiwan Semiconductor Manufacturing Company | High efficiency color filter process to improve color balance in semiconductor array imaging devices |
TW523924B (en) * | 2001-01-12 | 2003-03-11 | Konishiroku Photo Ind | Image pickup device and image pickup lens |
-
2002
- 2002-05-20 TW TW091110530A patent/TW540157B/zh not_active IP Right Cessation
- 2002-05-21 DE DE60227027T patent/DE60227027D1/de not_active Expired - Lifetime
- 2002-05-21 EP EP02253569A patent/EP1263055B1/en not_active Expired - Lifetime
- 2002-05-21 AT AT02253569T patent/ATE398337T1/de not_active IP Right Cessation
- 2002-05-22 CN CNB021202958A patent/CN1226790C/zh not_active Expired - Lifetime
- 2002-05-28 KR KR1020020029553A patent/KR100596104B1/ko active IP Right Grant
- 2002-05-29 US US10/156,017 patent/US6727487B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60227027D1 (de) | 2008-07-24 |
KR100596104B1 (ko) | 2006-07-05 |
ATE398337T1 (de) | 2008-07-15 |
EP1263055B1 (en) | 2008-06-11 |
US20020195546A1 (en) | 2002-12-26 |
EP1263055A3 (en) | 2005-03-30 |
KR20020091792A (ko) | 2002-12-06 |
US6727487B2 (en) | 2004-04-27 |
TW540157B (en) | 2003-07-01 |
EP1263055A2 (en) | 2002-12-04 |
CN1389928A (zh) | 2003-01-08 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KONICA MINOLTA OPTO INC.; PATENTEE Free format text: FORMER OWNER: KONICA MINOLTA MEINENGDA HOLDING CO., LTD.; PATENTEE Effective date: 20051104 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: KONICA MINOLTA MEINENGDA HOLDING CO., LTD.; PATENT Free format text: FORMER NAME OR ADDRESS: KONICA CORP.; PATENTEE |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: HYNIX SEMICONDUCTOR Inc. Patentee after: Konica Minolta Holdings, Inc. Address before: Tokyo, Japan Co-patentee before: HYNIX SEMICONDUCTOR Inc. Patentee before: Konica Corp. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20051104 Address after: Tokyo, Japan Co-patentee after: HYNIX SEMICONDUCTOR Inc. Patentee after: Konica Minolta Opto, Inc. Address before: Tokyo, Japan Co-patentee before: HYNIX SEMICONDUCTOR Inc. Patentee before: Konica Minolta Holdings, Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: KONICA MINOLTA OPTO INC.; MAGNACHIP SEMICONDUCTOR Free format text: FORMER OWNER: KONICA MINOLTA OPTO INC.; HYNIX SEMICONDUCTOR INC. Effective date: 20070126 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20070126 Address after: Tokyo, Japan Co-patentee after: MagnaChip Semiconductor, Ltd. Patentee after: Konica Minolta Opto, Inc. Address before: Tokyo, Japan Co-patentee before: HYNIX SEMICONDUCTOR Inc. Patentee before: Konica Minolta Opto, Inc. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Co-patentee after: MagnaChip Semiconductor, Ltd. Patentee after: Konica Minolta Opto, Inc. Address before: Tokyo, Japan Co-patentee before: MagnaChip Semiconductor, Ltd. Patentee before: Konica Minolta Opto, Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180608 Address after: North Chungcheong Province Patentee after: MagnaChip Semiconductor, Ltd. Address before: Tokyo, Japan Co-patentee before: MagnaChip Semiconductor, Ltd. Patentee before: KONICA MINOLTA,Inc. Effective date of registration: 20180608 Address after: Tokyo, Japan Co-patentee after: MagnaChip Semiconductor, Ltd. Patentee after: KONICA MINOLTA,Inc. Address before: Tokyo, Japan Co-patentee before: MagnaChip Semiconductor, Ltd. Patentee before: Konica Minolta Opto, Inc. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20051109 |